Footprints

31 footprints matching “Pack”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

31 footprints · page 1 of 2

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TQFP-44_10x10mm_P0.8mm

FP3D

Package_QFP

TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=658)

Pads: 44
SMD: 13.3×13.3
Boards: 335

LQFP-144_20x20mm_P0.5mm

FP3D

Package_QFP

LQFP, 144 Pin (JEDEC MS-026 variation BFB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=425)

Pads: 144
SMD: 23.3×23.3
Boards: 104

Diodes_DFN1006-3

FP—

Package_DFN_QFN

DFN package size 1006 3 pins

Pads: 3
SMD: 1.6×1.2
Boards: 20

LQFP-128_14x14mm_P0.4mm

FP3D

Package_QFP

LQFP, 128 Pin (JEDEC MS-026 variation BEE, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=423)

Pads: 128
SMD: 17.3×17.3
Boards: 9

Allegro_QFN-12-10-1EP_3x3mm_P0.5mm

FP—

Sensor_Current

Allegro Microsystems 12-Lead (10-Lead Populated) Quad Flat Pack, 3x3mm Body, 0.5mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/ACS711-Datasheet.ashx)

Pads: 10
SMD: 4.2×4.3
Boards: 9

TQFP-44-1EP_10x10mm_P0.8mm_EP4.5x4.5mm

FP3D

Package_QFP

TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)

Pads: 45
SMD: 13.3×13.3
Boards: 3

SOT-963

FP3D

Package_TO_SOT_SMD

SOT 963 6 pins package 1x0.8mm pitch 0.35mm

Pads: 6
SMD: 1.6×1.5
Boards: 1

Texas_RWU-VQFN-N7_2.1x2.1mm

FP3D

kiml-00-kiml-dfn-qfn

PLASTIC QUAD FLAT PACK - NO LEAD

Pads: 7
SMD: 2.6×2.4
Boards: —

ST_TFBGA-436_18x18mm_Layout22x22_P0.8mm

FP—

Package_BGA

ST TFBGA-436, 18.0x18.0mm, 436 Ball, 22x22 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp255c.pdf#page=222

Pads: 436
SMD: 20.0×20.0
Boards: —

ST_VFBGA-361_10x10mm_Layout19x19_P0.5mm

FP—

Package_BGA

ST VFBGA-361, 10.0x10.0mm, 361 Ball, 19x19 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp255c.pdf#page=218

Pads: 361
SMD: 12.0×12.0
Boards: —

ST_WLCSP-19_1.643x2.492mm_Layout4x11_P0.35mm_Stagger

FP3D

Package_CSP

ST WLCSP-19, ST Die ID 493, 1.643x2.492mm, 19 Ball, Y-staggered 4x11 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32c071kb.pdf#page=101

Pads: 19
SMD: 3.7×4.5
Boards: —

ST_WLCSP-36_2.652x2.592mm_Layout7x12_P0.4mm_Stagger_Offcenter

FP—

Package_CSP

ST WLCSP-36, ST Die ID 028, 2.652x2.592mm, 36 Ball, Y-staggered 7x12 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb05tz.pdf#page=55

Pads: 36
SMD: 4.7×4.6
Boards: —

ST_WLCSP-36_2.83x2.99mm_Layout7x13_P0.4mm_Stagger_Offcenter

FP—

Package_CSP

ST WLCSP-36, ST Die ID 032, 2.83x2.99mm, 36 Ball, Y-staggered 7x13 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb09te.pdf#page=59

Pads: 36
SMD: 4.8×5.0
Boards: —

ST_WLCSP-39_2.76x2.78mm_Layout11x7_P0.4mm_Stagger

FP3D

Package_CSP

ST WLCSP-39, ST Die ID 478, 2.76x2.78mm, 39 Ball, X-staggered 11x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32h523he.pdf#page=197

Pads: 39
SMD: 4.8×4.8
Boards: —