Footprints

7,584 footprints matching “T”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

7,584 footprints · page 1 of 316

Matched by name and keywords. Search by meaning instead

TestPoint_Pad_D1.0mm

FP—

TestPoint

SMD pad as test Point, diameter 1.0mm

Pads
1
SMD
2.0×2.0
Boards
1,387

TSSOP-20_4.4x6.5mm_P0.65mm

FP3D

Package_SO

TSSOP, 20 Pin (JEDEC MO-153 Var AC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads
20
SMD
7.7×7.0
Boards
731

TO-252-2

FP3D

Package_TO_SOT_SMD

TO-252/DPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO252/PG-TO252-3-1/

Pads
3
SMD
11.1×7.0
Boards
658

TestPoint_Pad_D1.5mm

FP—

TestPoint

SMD pad as test Point, diameter 1.5mm

Pads
1
SMD
2.5×2.5
Boards
641

TSSOP-16_4.4x5mm_P0.65mm

FP3D

Package_SO

TSSOP, 16 Pin (https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads
16
SMD
7.7×5.5
Boards
579

TSSOP-14_4.4x5mm_P0.65mm

FP3D

Package_SO

TSSOP, 14 Pin (JEDEC MO-153 variation AB-1, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads
14
SMD
7.7×5.5
Boards
507

TQFP-32_7x7mm_P0.8mm

FP3D

Package_QFP

TQFP, 32 Pin (JEDEC MS-026 variation ABA, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=656)

Pads
32
SMD
10.3×10.3
Boards
503

TestPoint_Pad_D2.0mm

FP—

TestPoint

SMD pad as test Point, diameter 2.0mm

Pads
1
SMD
3.0×3.0
Boards
447

TestPoint_Pad_1.0x1.0mm

FP—

TestPoint

SMD rectangular pad as test Point, square 1.0mm side length

Pads
1
SMD
2.0×2.0
Boards
436

TSOT-23-6

FP3D

Package_TO_SOT_SMD

TSOT, 6 Pin (https://www.jedec.org/sites/default/files/docs/MO-193D.pdf variant AA)

Pads
6
SMD
4.1×3.4
Boards
352

TQFP-44_10x10mm_P0.8mm

FP3D

Package_QFP

TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=658)

Pads
44
SMD
13.3×13.3
Boards
335

TestPoint_Pad_1.5x1.5mm

FP—

TestPoint

SMD rectangular pad as test Point, square 1.5mm side length

Pads
1
SMD
2.5×2.5
Boards
292

TestPoint_Pad_2.0x2.0mm

FP—

TestPoint

SMD rectangular pad as test Point, square 2.0mm side length

Pads
1
SMD
3.0×3.0
Boards
283

TSOT-23-5

FP3D

Package_TO_SOT_SMD

TSOT, 5 Pin (https://www.jedec.org/sites/default/files/docs/MO-193D.pdf variant AB)

Pads
5
SMD
4.1×3.4
Boards
256

TSSOP-24_4.4x7.8mm_P0.65mm

FP3D

Package_SO

TSSOP, 24 Pin (JEDEC MO-153 variation AD, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads
24
SMD
7.7×8.3
Boards
242

TO-263-5_TabPin3

FP3D

Package_TO_SOT_SMD

TO-263/D2PAK/DDPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO263/PG-TO263-5-1/

Pads
5
SMD
16.6×11.3
Boards
217

TSSOP-8_4.4x3mm_P0.65mm

FP3D

Package_SO

TSSOP, 8 Pin (JEDEC MO-153 Var AA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads
8
SMD
7.7×3.5
Boards
179

TO-263-2

FP3D

Package_TO_SOT_SMD

TO-263/D2PAK/DDPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO263/PG-TO263-3-1/

Pads
3
SMD
16.6×11.3
Boards
168

TSSOP-28_4.4x9.7mm_P0.65mm

FP3D

Package_SO

TSSOP, 28 Pin (JEDEC MO-153 Var AE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads
28
SMD
7.7×10.2
Boards
164

TO-252-3_TabPin2

FP3D

Package_TO_SOT_SMD

TO-252/DPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO252/PG-TO252-3-1/

Pads
3
SMD
11.1×7.0
Boards
161

TSSOP-10_3x3mm_P0.5mm

FP3D

Package_SO

TSSOP, 10 Pin (https://www.ti.com/lit/ml/mpds035c/mpds035c.pdf, https://www.ti.com/lit/ds/symlink/ads1115.pdf#page=50, https://www.nxp.com/docs/en/package-information/SOT552-1.pdf)

Pads
10
SMD
6.3×3.5
Boards
153

TSOT-23

FP3D

Package_TO_SOT_SMD

3-pin TSOT23 package, http://www.analog.com.tw/pdf/All_In_One.pdf

Pads
3
SMD
4.3×3.4
Boards
112

TSSOP-8_3x3mm_P0.65mm

FP3D

Package_SO

TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf)

Pads
8
SMD
5.9×3.6
Boards
111

TestPoint_Pad_D2.5mm

FP—

TestPoint

SMD pad as test Point, diameter 2.5mm

Pads
1
SMD
3.5×3.5
Boards
110