Footprints
1,208 footprints matching “T-1”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SOIC-16_3.9x9.9mm_P1.27mm
Package_SO
SOIC, 16 Pin (JEDEC MS-012, variation AC, https://www.jedec.org/document_search?search_api_views_fulltext=MS-012, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_16.pdf)
- Pads
- 16
- SMD
- 7.4×10.4
- Boards
- 1,078
LQFP-48_7x7mm_P0.5mm
Package_QFP
LQFP, 48 Pin (JEDEC MS-026 variation BBC, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-lqfp/05081760_a_lx48.pdf)
- Pads
- 48
- SMD
- 10.3×10.3
- Boards
- 862
TSSOP-14_4.4x5mm_P0.65mm
Package_SO
TSSOP, 14 Pin (JEDEC MO-153 variation AB-1, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 14
- SMD
- 7.7×5.5
- Boards
- 507
QFN-56-1EP_7x7mm_P0.4mm_EP3.2x3.2mm
Package_DFN_QFN
QFN, 56 Pin (https://datasheets.raspberrypi.com/rp2040/rp2040-datasheet.pdf#page=607)
- Pads
- 57
- SMD
- 8.3×8.3
- Boards
- 381
SOT-143
Package_TO_SOT_SMD
SOT-143 https://www.nxp.com/docs/en/package-information/SOT143B.pdf
- Pads
- 4
- SMD
- 3.2×3.4
- Boards
- 308
QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm
Package_DFN_QFN
QFN, 24 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=278)
- Pads
- 25
- SMD
- 5.2×5.2
- Boards
- 256
QFN-48-1EP_7x7mm_P0.5mm_EP5.6x5.6mm
Package_DFN_QFN
QFN, 48 Pin (http://www.st.com/resource/en/datasheet/stm32f042k6.pdf#page=94)
- Pads
- 49
- SMD
- 8.3×8.3
- Boards
- 245
QFN-32-1EP_5x5mm_P0.5mm_EP3.45x3.45mm
Package_DFN_QFN
QFN, 32 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_32_05-08-1693.pdf)
- Pads
- 33
- SMD
- 6.3×6.3
- Boards
- 176
QFN-28-1EP_5x5mm_P0.5mm_EP3.35x3.35mm
Package_DFN_QFN
QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=283)
- Pads
- 29
- SMD
- 6.2×6.2
- Boards
- 175
U.FL_Hirose_U.FL-R-SMT-1_Vertical
Connector_Coaxial
Hirose U.FL Coaxial (https://www.hirose.com/en/product/document?clcode=CL0331-0472-2-01&productname=U.FL-R-SMT-1(01)&series=U.FL&documenttype=2DDrawing&lang=en&documentid=0000940668)
- Pads
- 2
- SMD
- 4.3×5.0
- Boards
- 158
TSSOP-10_3x3mm_P0.5mm
Package_SO
TSSOP, 10 Pin (https://www.ti.com/lit/ml/mpds035c/mpds035c.pdf, https://www.ti.com/lit/ds/symlink/ads1115.pdf#page=50, https://www.nxp.com/docs/en/package-information/SOT552-1.pdf)
- Pads
- 10
- SMD
- 6.3×3.5
- Boards
- 153
SO-16_3.9x9.9mm_P1.27mm
Package_SO
SO, 16 Pin (https://www.nxp.com/docs/en/package-information/SOT109-1.pdf)
- Pads
- 16
- SMD
- 7.4×10.4
- Boards
- 141
SOIC-8_5.3x5.3mm_P1.27mm
Package_SO
SOIC, 8 Pin (JEITA/EIAJ ED-7311-19 variation 08-001-BBA and Atmel/Microchip, 208 mils width, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=21, https://ww1.microchip.com/downloads/en/DeviceDoc/20005045C.pdf#page=23, https://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=162)
- Pads
- 8
- SMD
- 9.3×5.8
- Boards
- 139
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
Package_SO
SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 135
QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm
Package_DFN_QFN
QFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=274)
- Pads
- 21
- SMD
- 5.2×5.2
- Boards
- 115
SSOP-16_3.9x4.9mm_P0.635mm
Package_SO
SSOP, 16 Pin (https://www.nxp.com/docs/en/package-information/SOT519-1.pdf#page=2)
- Pads
- 16
- SMD
- 7.4×5.4
- Boards
- 98
WSON-6-1EP_2x2mm_P0.65mm_EP1x1.6mm
Package_SON
WSON, 6 Pin (http://www.ti.com/lit/ds/symlink/tps61040.pdf#page=35)
- Pads
- 7
- SMD
- 2.7×2.5
- Boards
- 94
TQFP-100_14x14mm_P0.5mm
Package_QFP
TQFP, 100 Pin (JEDEC MS-026 variation AED, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=683)
- Pads
- 100
- SMD
- 17.3×17.3
- Boards
- 93
WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm
Package_SON
8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf
- Pads
- 9
- SMD
- 3.2×2.5
- Boards
- 87
QFN-44-1EP_7x7mm_P0.5mm_EP5.2x5.2mm
Package_DFN_QFN
QFN, 44 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/2512S.pdf#page=17)
- Pads
- 45
- SMD
- 8.3×8.3
- Boards
- 85
QFN-20-1EP_3x3mm_P0.4mm_EP1.65x1.65mm
Package_DFN_QFN
QFN, 20 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/3553fc.pdf#page=34)
- Pads
- 21
- SMD
- 4.3×4.3
- Boards
- 83
QFN-32-1EP_5x5mm_P0.5mm_EP3.1x3.1mm
Package_DFN_QFN
QFN, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8008S.pdf#page=20)
- Pads
- 33
- SMD
- 6.3×6.3
- Boards
- 72
TDSON-8-1
Package_TO_SOT_SMD
Power MOSFET package, TDSON-8-1, 5.15x5.9mm (https://www.infineon.com/cms/en/product/packages/PG-TDSON/PG-TDSON-8-1/)
- Pads
- 5
- SMD
- 7.2×5.7
- Boards
- 70
WSON-8-1EP_6x5mm_P1.27mm_EP3.4x4.3mm
Package_SON
WSON, 8 Pin (http://www.winbond.com/resource-files/w25q32jv%20revg%2003272018%20plus.pdf (page 68))
- Pads
- 9
- SMD
- 6.7×5.5
- Boards
- 68
