Footprints

33 footprints matching “TDFN”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

33 footprints · page 1 of 2

Matched by name and keywords. Search by meaning instead

TDFN-8-1EP_2x2mm_P0.5mm_EP0.8x1.2mm

FP—

Package_DFN_QFN

TDFN, 8 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0168.PDF)

Pads: 9
SMD: 3.3×2.5
Boards: 12

TDFN-12_2x3mm_P0.5mm

FP—

Package_DFN_QFN

TDFN, 12 Pads, No exposed, http://www.st.com/resource/en/datasheet/stm6600.pdf

Pads: 12
SMD: 2.8×3.5
Boards: 5

TDFN-14-1EP_3x3mm_P0.4mm_EP1.78x2.35mm

FP—

Package_DFN_QFN

TDFN, 14 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0137.PDF (T1433-2C))

Pads: 15
SMD: 4.3×3.5
Boards: 5

TDFN-8-1EP_3x2mm_P0.5mm_EP1.80x1.65mm

FP—

Package_DFN_QFN

8-lead plastic dual flat, 2x3x0.75mm size, 0.5mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_TDFN_2x3_MN_C04-0129E-MN.pdf)

Pads: 9
SMD: 4.3×2.5
Boards: 5

TDFN-10-1EP_2x3mm_P0.5mm_EP0.9x2mm

FP—

Package_DFN_QFN

TDFN, 10 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0429.PDF)

Pads: 11
SMD: 3.3×3.5
Boards: 4

TDFN-8-1EP_3x2mm_P0.5mm_EP1.3x1.4mm

FP—

Package_DFN_QFN

TDFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/MCP6V66-Family-Data-Sheet-DS20006266A.pdf#page=35)

Pads: 9
SMD: 4.2×2.5
Boards: 4

TDFN-14-1EP_3x3mm_P0.4mm_EP1.78x2.35mm_ThermalVias

FP—

Package_DFN_QFN

TDFN, 14 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0137.PDF (T1433-2C))

Pads: 15
SMD: 4.3×3.5
Boards: 2

TDFN-8

FP3D

agg-agg

Pads: 8
SMD: 3.3×2.5
Boards: —

TDFN-8-1EP

FP—

digikey-digikey-footprints

file:///C:/Users/alex_wegscheid/Downloads/EST02896_MR25H256-MR25H256A_Combined%20Datasheet_Rev1.4%20020117%20(5).pdf

Pads: 8
SMD: 7.2×5.6
Boards: —

TDFN-8-1EP

FP—

digikey-Source_Footprints

file:///C:/Users/alex_wegscheid/Downloads/EST02896_MR25H256-MR25H256A_Combined%20Datasheet_Rev1.4%20020117%20(5).pdf

Pads: 8
SMD: 7.2×5.6
Boards: —

TDFN-10-1EP_2x3mm_P0.5mm_EP0.9x2mm_ThermalVias

FP—

Package_DFN_QFN

TDFN, 10 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0429.PDF)

Pads: 11
SMD: 3.3×3.5
Boards: —

TDFN-12-1EP_3x3mm_P0.4mm_EP1.7x2.45mm

FP—

Package_DFN_QFN

TDFN, 12 Pin (https://www.renesas.com/us/en/document/psc/package-drawing-tdfn-12pin-l123x3c)

Pads: 13
SMD: 4.2×3.5
Boards: —

TDFN-12-1EP_3x3mm_P0.4mm_EP1.7x2.45mm_ThermalVias

FP—

Package_DFN_QFN

TDFN, 12 Pin (https://www.renesas.com/us/en/document/psc/package-drawing-tdfn-12pin-l123x3c)

Pads: 13
SMD: 4.2×3.5
Boards: —

TDFN-6-1EP_1.2x1.2mm_P0.4mm_EP0.3x0.94mm

FP—

Package_DFN_QFN

TDFN, 6 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/MIC5528.pdf)

Pads: 7
SMD: 1.7×1.7
Boards: —

TDFN-6-1EP_2.5x2.5mm_P0.65mm_EP1.3x2mm

FP3D

Package_DFN_QFN

TDFN, 6 Pin (http://www.nve.com/Downloads/ab3.pdf)

Pads: 7
SMD: 3.8×3.0
Boards: —

TDFN-6-1EP_2.5x2.5mm_P0.65mm_EP1.3x2mm_ThermalVias

FP3D

Package_DFN_QFN

TDFN, 6 Pin (http://www.nve.com/Downloads/ab3.pdf)

Pads: 7
SMD: 3.8×3.0
Boards: —

TDFN-8_1.4x1.6mm_P0.4mm

FP3D

Package_DFN_QFN

TDFN, 8 Pin (https://www.silabs.com/documents/public/data-sheets/si7210-datasheet.pdf)

Pads: 8
SMD: 2.7×2.1
Boards: —

TDFN-8-1EP_3x2mm_P0.5mm_EP1.4x1.4mm

FP—

Package_DFN_QFN

TDFN, 8 Pin (http://ww1.microchip.com/downloads/en/devicedoc/20005514a.pdf#page=35)

Pads: 9
SMD: 4.2×2.5
Boards: —

TDFN-8-1EP_3x2mm_P0.5mm_EP1.80x1.65mm_ThermalVias

FP—

Package_DFN_QFN

8-lead plastic dual flat, 2x3x0.75mm size, 0.5mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_TDFN_2x3_MN_C04-0129E-MN.pdf)

Pads: 9
SMD: 4.3×2.5
Boards: —

Maxim_TDFN-12-1EP_3x3mm_P0.5mm_EP1.7x2.5mm_ThermalVias

FP—

Package_DFN_QFN

Maxim TDFN, 12 Pin (https://www.analog.com/media/en/package-pcb-resources/land-pattern/tdfn/90-0397.pdf)

Pads: 13
SMD: 4.2×3.5
Boards: 1

MAXIM TDFN-10 3x3MM T1033-1

FP—

celestial-altium-Leadless_DFN

DFN, 10-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.58x2.35mm, IPC Medium Density

Pads: 11
SMD: 4.2×4.2
Boards: —

MAXIM TDFN-10 T1032N+1

FP—

celestial-altium-Leadless_DFN

SON, 10-Leads, Body 3.00x2.00mm, Pitch 0.50mm, Thermal Pad 0.00x0.00mm

Pads: 11
SMD: 3.0×3.4
Boards: —

MAXIM TDFN-10 T1034N-1

FP—

celestial-altium-Leadless_DFN

DFN, 10-Leads, Body 4.00x3.00mm, Pitch 0.50mm, Thermal Pad 2.30x2.60mm, IPC Medium Density

Pads: 11
SMD: 5.2×3.8
Boards: —

MAXIM TDFN-12 3X3MM TD1233+1

FP—

celestial-altium-Leadless_DFN

DFN, 12-Leads, Body 3.00x3.00mm, Pitch 0.50mm, Thermal Pad 1.70x2.50mm

Pads: 13
SMD: 4.2×3.6
Boards: —