Footprints

2,204 footprints matching “lead”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints on their own, whether or not a symbol uses them.

2,204 footprints · page 1 of 92

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QFN-56-1EP_7x7mm_P0.4mm_EP3.2x3.2mm

FP3D

Package_DFN_QFN

QFN, 56 Pin (https://datasheets.raspberrypi.com/rp2040/rp2040-datasheet.pdf#page=607)

Pads: 57
SMD: 8.3×8.3
Boards: 381

TQFP-44_10x10mm_P0.8mm

FP3D

Package_QFP

TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=658)

Pads: 44
SMD: 13.3×13.3
Boards: 335

QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm

FP3D

Package_DFN_QFN

QFN, 24 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=278)

Pads: 25
SMD: 5.2×5.2
Boards: 256

QFN-48-1EP_7x7mm_P0.5mm_EP5.6x5.6mm

FP—

Package_DFN_QFN

QFN, 48 Pin (http://www.st.com/resource/en/datasheet/stm32f042k6.pdf#page=94)

Pads: 49
SMD: 8.3×8.3
Boards: 245

QFN-32-1EP_5x5mm_P0.5mm_EP3.45x3.45mm

FP3D

Package_DFN_QFN

QFN, 32 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_32_05-08-1693.pdf)

Pads: 33
SMD: 6.3×6.3
Boards: 176

QFN-28-1EP_5x5mm_P0.5mm_EP3.35x3.35mm

FP3D

Package_DFN_QFN

QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=283)

Pads: 29
SMD: 6.2×6.2
Boards: 175

InvenSense_QFN-24_4x4mm_P0.5mm

FP—

Sensor_Motion

24-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf)

Pads: 24
SMD: 5.3×5.3
Boards: 136

LGA-14_3x2.5mm_P0.5mm_LayoutBorder3x4y

FP3D

Package_LGA

LGA, 14 Pin (https://www.st.com/resource/en/datasheet/lsm6ds3tr-c.pdf)

Pads: 14
SMD: 3.5×3.0
Boards: 118

QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm

FP3D

Package_DFN_QFN

QFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=274)

Pads: 21
SMD: 5.2×5.2
Boards: 115

TSSOP-8_3x3mm_P0.65mm

FP3D

Package_SO

TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf)

Pads: 8
SMD: 5.9×3.6
Boards: 111

LQFP-144_20x20mm_P0.5mm

FP3D

Package_QFP

LQFP, 144 Pin (JEDEC MS-026 variation BFB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=425)

Pads: 144
SMD: 23.3×23.3
Boards: 104

WSON-6-1EP_2x2mm_P0.65mm_EP1x1.6mm

FP3D

Package_SON

WSON, 6 Pin (http://www.ti.com/lit/ds/symlink/tps61040.pdf#page=35)

Pads: 7
SMD: 2.7×2.5
Boards: 94

SW_Tactile_SPST_NO_Straight_CK_PTS636Sx25SMTRLFS

FP3D

Button_Switch_SMD

Tactile switch, SPST, 6.0x3.5 mm, H2.5 mm, straight, NO, gull wing leads: https://www.ckswitches.com/media/2779/pts636.pdf

Pads: 2
SMD: 9.5×4.2
Boards: 90

WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm

FP3D

Package_SON

8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf

Pads: 9
SMD: 3.2×2.5
Boards: 87

QFN-44-1EP_7x7mm_P0.5mm_EP5.2x5.2mm

FP—

Package_DFN_QFN

QFN, 44 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/2512S.pdf#page=17)

Pads: 45
SMD: 8.3×8.3
Boards: 85

QFN-20-1EP_3x3mm_P0.4mm_EP1.65x1.65mm

FP—

Package_DFN_QFN

QFN, 20 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/3553fc.pdf#page=34)

Pads: 21
SMD: 4.3×4.3
Boards: 83

InvenSense_QFN-24_3x3mm_P0.4mm

FP—

Sensor_Motion

24-Lead Plastic QFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf)

Pads: 24
SMD: 4.1×4.1
Boards: 74