Components

725 components matching “rf”

A component is a schematic symbol with, where the catalog has them, its footprint and 3D package model — linked by KiCad's own references and cross-checked pin by pin.

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725 components · page 3 of 31

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MC12080

SYMFP3D

1.1 GHz Prescaler, divide by 10 20 40 80, SOIC-8

Pins: 8
Pads: 8
SMD: 7.4×5.4

DWM3000

SYMFP3D

RF_Module

Ultra wide band RF module With ranging location capabilities

Pins: 24
Pads: 24
SMD: 15.7×24.7

ADG919BRMZ

SYMFP3D

RF_Switch

SPDT DC-4GHz reflective switch, 43dB isolation at 1GHz, MSOP-8

Pins: 8
Pads: 8
SMD: 6.4×3.5

MASWSS0136

SYMFP3D

RF_Switch

Macom GaAs RF SPDT switch, DC-3GHz, 0.4/27dB loss/isolation, SOT-363

Pins: 6
Pads: 6
SMD: 2.9×2.2

SX1272

SYMFP3D

860 MHz to 1020 MHz Low Power Long Range Transceiver, spreading factor from 6 to 12, LoRA, QFN-28

Pins: 29
Pads: 29
SMD: 7.3×7.3

MW-R-WX

SYMFP3D

RF_ZigBee

NXP JN5164/JN5169 breakout module, SMD

Pins: 32
Pads: 32
SMD: 15.4×15.4

BFR92

SYMFP3D

Transistor_BJT

0.025A Ic, 15V Vce, 5GHz Wideband NPN Transistor, SOT-323

Pins: 3
Pads: 3
SMD: 2.9×2.2

IRF60DM206

SYMFP3D

Transistor_FET

130A Id, 60V Vds, 2.9mOhm Rds, N-Channel MOSFET, DirectFET ME

Pins: 3
Pads: 3
SMD: 7.8×5.4

IRF6710S2

SYMFP3D

Transistor_FET

12A Id, 25V Vds, 5.9mOhm Rds, N-Channel MOSFET, DirectFET S1

Pins: 3
Pads: 3
SMD: 6.3×4.3

IRF7343PBF

SYMFP3D

Transistor_FET

4A Id, 55V Vds, Dual HEXFET N- and P-channel MOSFET, SO-8

Pins: 8
Pads: 8
SMD: 7.4×5.4

IRF7403

SYMFP3D

Transistor_FET

9.7A Id, 30V Vds, N-Channel HEXFET Power MOSFET, SO-8

Pins: 8
Pads: 8
SMD: 7.4×5.4

IRFS4127

SYMFP3D

Transistor_FET

72A Id, 200V Vds, 18.6mOhm Rds, N-Channel MOSFET, 18.6mOhm Ron, D2PAK

Pins: 3
Pads: 3
SMD: 16.6×11.3

LMH6733

SYMFP3D

Amplifier_Operational

1.0 GHz GBW Triple Operational Amplifier, 3..12V single supply or ±1.5V...6V dual supply , SSOP-16

Pins: 16
Pads: 16
SMD: 7.4×5.4

ESP32-S3

SYMFP3D

espressif-Espressif

ESP32-S3 is a low-power MCU-based system-on-chip (SoC) that supports 2.4 GHz Wi-Fi and Bluetooth® Low Energy (Bluetooth LE). It consists of high-performance dual-core microprocessor (Xtensa® 32-bit LX7), a low power coprocessor, a Wi-Fi baseband, a Bluetooth LE baseband, RF module, and peripherals.

Pins: 57
Pads: 57
SMD: 8.3×8.3