Components
189 components matching “package”
A component is a schematic symbol with, where the catalog has them, its footprint and 3D package model — linked by KiCad's own references and cross-checked pin by pin.
MCP73831-4-MC
Battery_Management
Single cell, Li-Ion/Li-Po charge management controller, 4.40V, Tri-State Status Output, in DFN-8 package
- Pins
- 8
- Pads
- 9
- SMD
- 4.2×2.5
MCP73831-5-MC
Battery_Management
Single cell, Li-Ion/Li-Po charge management controller, 4.50V, Tri-State Status Output, in DFN-8 package
- Pins
- 8
- Pads
- 9
- SMD
- 4.2×2.5
MCP73832-2-MC
Battery_Management
Single cell, Li-Ion/Li-Po charge management controller, 4.20V, Open-Drain Status Output, in DFN-8 package
- Pins
- 8
- Pads
- 9
- SMD
- 4.2×2.5
MCP73832-3-MC
Battery_Management
Single cell, Li-Ion/Li-Po charge management controller, 4.35V, Open-Drain Status Output, in DFN-8 package
- Pins
- 8
- Pads
- 9
- SMD
- 4.2×2.5
MCP73832-4-MC
Battery_Management
Single cell, Li-Ion/Li-Po charge management controller, 4.40V, Open-Drain Status Output, in DFN-8 package
- Pins
- 8
- Pads
- 9
- SMD
- 4.2×2.5
MCP73832-5-MC
Battery_Management
Single cell, Li-Ion/Li-Po charge management controller, 4.50V, Open-Drain Status Output, in DFN-8 package
- Pins
- 8
- Pads
- 9
- SMD
- 4.2×2.5
XRA1201IL24
Interface_Expansion
16-bit I/O expander, I2C and SMBus interface, interrupts, w/ optional pull-ups, QFN-24 package
- Pins
- 25
- Pads
- 25
- SMD
- 5.3×5.3
XRA1201PIL24
Interface_Expansion
16-bit I/O expander, I2C and SMBus interface, interrupts, w/ pull-ups, QFN-24 package
- Pins
- 25
- Pads
- 25
- SMD
- 5.3×5.3
ESP32-PICO-V3
MCU_Espressif
RF Module, ESP32 SoC, 4MB In-Package flash, Wi-Fi 802.11b/g/n, Bluetooth, BLE, 32-bit, 3.0-3.6V, external antenna, QFN-48
- Pins
- 49
- Pads
- 49
- SMD
- 8.2×8.2
ESP32-PICO-V3-02
MCU_Espressif
RF Module, ESP32 SoC, 8MB In-Package flash, 2MB In-Package PSRAM, Wi-Fi 802.11b/g/n, Bluetooth, BLE, 32-bit, 3.0-3.6V, external antenna, QFN-48
- Pins
- 49
- Pads
- 49
- SMD
- 8.2×8.2
PIC18F45K80-IML
MCU_Microchip_PIC18
32K Flash, 3.5K RAM, 1K EEPROM, Microchip PIC18F series enhanced flash microcontroller with ECAN and nanoWatt XLP Technology in QFN-44 package
- Pins
- 45
- Pads
- 45
- SMD
- 9.2×9.2
PIC18F46K80-IML
MCU_Microchip_PIC18
64K Flash, 3.5K RAM, 1K EEPROM PIC18 Microcontroller ADC PWM CAN SPI I2C USART in QFN44 package
- Pins
- 45
- Pads
- 45
- SMD
- 9.2×9.2
PIC18LF45K80-IML
MCU_Microchip_PIC18
32K Flash, 3.5K RAM, 1K EEPROM PIC18 Microcontroller ADC PWM CAN SPI I2C USART in QFN44 package
- Pins
- 45
- Pads
- 45
- SMD
- 9.2×9.2
PIC18LF46K80-IML
MCU_Microchip_PIC18
64K Flash, 3.5K RAM, 1K EEPROM PIC18 Microcontroller ADC PWM CAN SPI I2C USART in QFN44 package
- Pins
- 45
- Pads
- 45
- SMD
- 9.2×9.2
AP2204MP-ADJ
Regulator_Linear
150mA low dropout adjustable linear regulator, wide input voltage range, PSOP-8 package
- Pins
- 9
- Pads
- 9
- SMD
- 7.4×5.4
LM5175RHF
Regulator_Switching
42-V wide Vin synchronous 4-switch Buck-Boost controller, QFN-28 package
- Pins
- 29
- Pads
- 29
- SMD
- 5.3×6.3
LM5176RHF
Regulator_Switching
55-V wide Vin synchronous 4-switch Buck-Boost controller, QFN-28 package
- Pins
- 29
- Pads
- 29
- SMD
- 5.3×6.3
M95
RF_GSM
Quectel quad-band GSM/GPRS module in LCC package
- Pins
- 42
- Pads
- 42
- SMD
- 25.9×29.6
UL865
RF_GSM
Telit 3G Module (GSM/GPRS/UMTS/HSPA), 3.8V, Digital voice and SMS, I2S, USB 2.0, UART, SPI. Manufacturer package
- Pins
- 48
- Pads
- 48
- SMD
- 30.0×30.0
SFH2400
Sensor_Optical
Silicon PIN Photodiode, SMD package
- Pins
- 2
- Pads
- 3
- SMD
- 6.5×2.8
ILPS28QSW
Sensor_Pressure
Dual full-scale (mode 1: 260..1260 hPa; mode 2: 260..4060 hPa), absolute digital output barometer with Qvar detection in a water-resistant package, 1.7..3.6V supply voltage, LGA-7
- Pins
- 7
- Pads
- 7
- SMD
- 3.3×3.3