Footprints

12 footprints matching “DIP-8”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints that come with a 3D model.

12 footprints

Matched by name and keywords. Search by meaning instead

DIP-8_W7.62mm

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads: 8
THT: 9.7×10.7
Boards: 956

DIP-8_W7.62mm_Socket

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads: 8
THT: 10.7×10.8
Boards: 322

DIP-8_W7.62mm_LongPads

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads: 8
THT: 10.5×10.7
Boards: 242

DIP-8_W7.62mm_Socket_LongPads

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 8
THT: 10.7×10.8
Boards: 178

DIP-8_W10.16mm

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)

Pads: 8
THT: 12.3×10.7
Boards: 17

DIP-8_W10.16mm_LongPads

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads

Pads: 8
THT: 13.1×10.7
Boards: 6

DIP-8-N7_W7.62mm

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 7

Pads: 7
THT: 9.8×10.7
Boards: 3

DIP-8-N6_W7.62mm

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 6

Pads: 7
THT: 9.8×10.7
Boards: —

Oscillator_DIP-8

FP3D

Oscillator

Oscillator, DIP8,http://cdn-reichelt.de/documents/datenblatt/B400/OSZI.pdf

Pads: 4
THT: 13.2×13.2
Boards: 120

Oscillator_DIP-8_LargePads

FP3D

Oscillator

Oscillator, DIP8, Large Pads, http://cdn-reichelt.de/documents/datenblatt/B400/OSZI.pdf

Pads: 4
THT: 13.2×13.2
Boards: 4

PowerIntegrations_PDIP-8B

FP3D

Package_DIP

Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf

Pads: 7
THT: 10.6×10.7
Boards: —

PowerIntegrations_PDIP-8C

FP3D

Package_DIP

Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf

Pads: 7
THT: 10.6×10.7
Boards: —