Footprints

201 footprints matching “SC”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints that come with a 3D model.

201 footprints · page 1 of 9

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TO-92_Inline

FP3D

Package_TO_SOT_THT

TO-92 leads in-line, narrow, oval pads, drill 0.75mm (see NXP sot054_po.pdf)

Pads: 3
THT: 5.5×4.7
Boards: 988

C_Disc_D4.3mm_W1.9mm_P5.00mm

FP3D

Capacitor_THT

C, Disc series, Radial, pin pitch=5.00mm, diameter*width=4.3*1.9mm^2, Capacitor, http://www.vishay.com/docs/45233/krseries.pdf

Pads: 2
THT: 7.1×2.4
Boards: 432

C_Disc_D3.0mm_W1.6mm_P2.50mm

FP3D

Capacitor_THT

C, Disc series, Radial, pin pitch=2.50mm, diameter*width=3.0*1.6mm^2, Capacitor, http://www.vishay.com/docs/45233/krseries.pdf

Pads: 2
THT: 4.6×2.1
Boards: 424

C_Disc_D5.0mm_W2.5mm_P5.00mm

FP3D

Capacitor_THT

C, Disc series, Radial, pin pitch=5.00mm, diameter*width=5*2.5mm^2, Capacitor, http://cdn-reichelt.de/documents/datenblatt/B300/DS_KERKO_TC.pdf

Pads: 2
THT: 7.1×3.0
Boards: 424

TO-92_Inline_Wide

FP3D

Package_TO_SOT_THT

TO-92 leads in-line, wide, drill 0.75mm (see NXP sot054_po.pdf)

Pads: 3
THT: 7.1×4.7
Boards: 358

C_Disc_D5.0mm_W2.5mm_P2.50mm

FP3D

Capacitor_THT

C, Disc series, Radial, pin pitch=2.50mm, diameter*width=5*2.5mm^2, Capacitor, http://cdn-reichelt.de/documents/datenblatt/B300/DS_KERKO_TC.pdf

Pads: 2
THT: 5.5×3.0
Boards: 312

C_Disc_D4.7mm_W2.5mm_P5.00mm

FP3D

Capacitor_THT

C, Disc series, Radial, pin pitch=5.00mm, diameter*width=4.7*2.5mm^2, Capacitor, http://www.vishay.com/docs/45233/krseries.pdf

Pads: 2
THT: 7.1×3.0
Boards: 303

C_Disc_D3.0mm_W2.0mm_P2.50mm

FP3D

Capacitor_THT

C, Disc series, Radial, pin pitch=2.50mm, diameter*width=3*2mm^2, Capacitor

Pads: 2
THT: 4.6×2.5
Boards: 288

C_Disc_D3.8mm_W2.6mm_P2.50mm

FP3D

Capacitor_THT

C, Disc series, Radial, pin pitch=2.50mm, diameter*width=3.8*2.6mm^2, Capacitor, http://www.vishay.com/docs/45233/krseries.pdf

Pads: 2
THT: 4.6×3.1
Boards: 249

TO-92

FP3D

Package_TO_SOT_THT

TO-92 leads molded, narrow, drill 0.75mm (see NXP sot054_po.pdf)

Pads: 3
THT: 5.5×4.7
Boards: 181

C_Disc_D3.4mm_W2.1mm_P2.50mm

FP3D

Capacitor_THT

C, Disc series, Radial, pin pitch=2.50mm, diameter*width=3.4*2.1mm^2, Capacitor, http://www.vishay.com/docs/45233/krseries.pdf

Pads: 2
THT: 4.6×2.6
Boards: 161

C_Disc_D6.0mm_W2.5mm_P5.00mm

FP3D

Capacitor_THT

C, Disc series, Radial, pin pitch=5.00mm, diameter*width=6*2.5mm^2, Capacitor, http://cdn-reichelt.de/documents/datenblatt/B300/DS_KERKO_TC.pdf

Pads: 2
THT: 7.1×3.0
Boards: 136

C_Disc_D5.1mm_W3.2mm_P5.00mm

FP3D

Capacitor_THT

C, Disc series, Radial, pin pitch=5.00mm, diameter*width=5.1*3.2mm^2, Capacitor, http://www.vishay.com/docs/45233/krseries.pdf

Pads: 2
THT: 7.1×3.7
Boards: 134

Oscillator_DIP-14

FP3D

Oscillator

Oscillator, DIP14, http://cdn-reichelt.de/documents/datenblatt/B400/OSZI.pdf

Pads: 4
THT: 21.2×13.2
Boards: 130

Oscillator_DIP-8

FP3D

Oscillator

Oscillator, DIP8,http://cdn-reichelt.de/documents/datenblatt/B400/OSZI.pdf

Pads: 4
THT: 13.2×13.2
Boards: 120

TO-92_HandSolder

FP3D

Package_TO_SOT_THT

TO-92 leads molded, narrow, drill 0.75mm, handsoldering variant with enlarged pads (see NXP sot054_po.pdf)

Pads: 3
THT: 5.5×5.1
Boards: 117

C_Disc_D7.0mm_W2.5mm_P5.00mm

FP3D

Capacitor_THT

C, Disc series, Radial, pin pitch=5.00mm, diameter*width=7*2.5mm^2, Capacitor, http://cdn-reichelt.de/documents/datenblatt/B300/DS_KERKO_TC.pdf

Pads: 2
THT: 7.5×3.0
Boards: 104

TO-92L_HandSolder

FP3D

Package_TO_SOT_THT

TO-92L leads in-line (large body variant of TO-92), also known as TO-226, wide, drill 0.75mm, hand-soldering variant with enlarged pads (see https://www.diodes.com/assets/Package-Files/TO92L.pdf and http://www.ti.com/lit/an/snoa059/snoa059.pdf)

Pads: 3
THT: 5.5×5.1
Boards: 85