Components

1,247 components matching “P”

A component is a schematic symbol with, where the catalog has them, its footprint and 3D package model — linked by KiCad's own references and cross-checked pin by pin.

1,247 components · page 13 of 52

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TC7662AxPA

SYMFP3D

Converter_DCDC

Charge Pump DC-to-DC Converter, 3 - 18V, 40mA, DIP-8

Pins
8
Pads
8
THT
9.7×10.7

TC7662BxPA

SYMFP3D

Converter_DCDC

Charge Pump DC-to-DC Converter, 1.5 - 15V, 100mA, DIP-8

Pins
8
Pads
8
THT
9.7×10.7

EP300

SYMFP3D

CPLD_Altera

EPLD, DIP-20

Pins
20
Pads
20
THT
9.7×25.9

EP310

SYMFP3D

CPLD_Altera

EPLD, 8 Macrocell, DIP-20

Pins
20
Pads
20
THT
9.7×25.9

CDP1802ACEX

SYMFP3D

CPU

8-bit, General Purpose, 5V, 3.2 MHz, Burned-In, DIP-40

Pins
40
Pads
40
THT
17.3×51.3

CDP1802BCE

SYMFP3D

CPU

8-bit, General Purpose, 5V, 5 MHz, DIP-40

Pins
40
Pads
40
THT
17.3×51.3

CDP1802BCEX

SYMFP3D

CPU

8-bit, General Purpose, 5V, 5 MHz, Burned-In, DIP-40

Pins
40
Pads
40
THT
17.3×51.3

MC68000P

SYMFP3D

CPU_NXP_68000

16/32-bit microprocessor, 16-bit external data bus, 23-bit external address bus (effectively 24-bit), DIP-64 (900 mil, case 754-01)

Pins
64
Pads
64
THT
25.0×81.8

MC68008P

SYMFP3D

CPU_NXP_68000

8/32-bit microprocessor, 8-bit external data bus, 20-bit external address bus, DIP-48 (600 mil, case 767-02)

Pins
48
Pads
48
THT
17.3×61.5

MC68010P

SYMFP3D

CPU_NXP_68000

16/32-bit microprocessor, 16-bit external data bus, 23-bit external address bus (effectively 24-bit), virtual memory support, loop mode, DIP-64 (900 mil, case 754-01)

Pins
64
Pads
64
THT
25.0×81.8

TMPZ84C00A

SYMFP3D

CPU

TLCS-Z80 MPU / 8-bit Microprocessor, Zilog Z80 compatible, 8-bit data bus, 16-bit address bus, 6 / 8 MHz, DIP-40 (600 mil) / SSOP-40

Pins
40
Pads
40
THT
17.3×51.3

Z084000xP

SYMFP3D

CPU

8-bit General Purpose Microprocessor, 8-bit data bus, 16-bit address bus, 4 / 6.17 / 8 MHz, DIP-40 (600 mil)

Pins
40
Pads
40
THT
17.3×51.3

Z84C00xxP

SYMFP3D

CPU

8-bit General Purpose Microprocessor, 8-bit data bus, 16-bit address bus, up to 6.17 / 8 / 10 / 20 MHz, CMOS version, DIP-40 (600 mil)

Pins
40
Pads
40
THT
17.3×51.3

R_Network_Dividers_x02_SIP

SYMFP3D

Device

2 voltage divider network, dual terminator, SIP package

Pins
4
Pads
4
THT
10.8×3.1

R_Network_Dividers_x03_SIP

SYMFP3D

Device

3 voltage divider network, dual terminator, SIP package

Pins
5
Pads
5
THT
13.4×3.1

R_Network_Dividers_x04_SIP

SYMFP3D

Device

4 voltage divider network, dual terminator, SIP package

Pins
6
Pads
6
THT
15.9×3.1

R_Network_Dividers_x05_SIP

SYMFP3D

Device

5 voltage divider network, dual terminator, SIP package

Pins
7
Pads
7
THT
18.4×3.1

R_Network_Dividers_x07_SIP

SYMFP3D

Device

7 voltage divider network, dual terminator, SIP package

Pins
9
Pads
9
THT
23.5×3.1

R_Network_Dividers_x09_SIP

SYMFP3D

Device

9 voltage divider network, dual terminator, SIP package

Pins
11
Pads
11
THT
28.6×3.1

R_Network_Dividers_x10_SIP

SYMFP3D

Device

10 voltage divider network, dual terminator, SIP package

Pins
12
Pads
12
THT
31.1×3.1

R_Network_Dividers_x11_SIP

SYMFP3D

Device

11 voltage divider network, dual terminator, SIP package

Pins
13
Pads
13
THT
33.7×3.1

R_Network06_Split

SYMFP3D

Device

6 resistor network, star topology, bussed resistors, split

Pins
7
Pads
7
THT
18.4×3.1

R_Network10_Split

SYMFP3D

Device

10 resistor network, star topology, bussed resistors, split

Pins
11
Pads
11
THT
28.6×3.1

R_Network11_Split

SYMFP3D

Device

11 resistor network, star topology, bussed resistors, split

Pins
12
Pads
12
THT
31.1×3.1