Footprints

2,662 footprints matching “F)”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints that come with a 3D model.

2,662 footprints · page 107 of 111

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UQFN-48-1EP_6x6mm_P0.4mm_EP4.45x4.45mm_ThermalVias

FP3D

Package_DFN_QFN

UQFN, 48 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=347)

Pads: 49
SMD: 7.2×7.2
Boards: —

VQFN-12-1EP_4x4mm_P0.8mm_EP2.1x2.1mm

FP3D

Package_DFN_QFN

VQFN, 12 Pin (https://www.mouser.ch/datasheet/2/268/EMC2301_2_3_5_Data_Sheet_DS20006532A-3443118.pdf)

Pads: 13
SMD: 5.2×5.2
Boards: —

VQFN-40-1EP_5x5mm_P0.4mm_EP3.7x3.7mm

FP3D

Package_DFN_QFN

VQFN, 40 Pin (Based on JEDEC MO-220-K.01, variation VHHE-1, https://www.silabs.com/documents/public/data-sheets/efm32pg23-datasheet.pdf#page=89, https://www.jedec.org/system/files/docs/MO-220K01.pdf)

Pads: 41
SMD: 6.3×6.3
Boards: —

VQFN-40-1EP_5x5mm_P0.4mm_EP3.7x3.7mm_ThermalVias

FP3D

Package_DFN_QFN

VQFN, 40 Pin (Based on JEDEC MO-220-K.01, variation VHHE-1, https://www.silabs.com/documents/public/data-sheets/efm32pg23-datasheet.pdf#page=89, https://www.jedec.org/system/files/docs/MO-220K01.pdf)

Pads: 41
SMD: 6.3×6.3
Boards: —

VQFN-48-1EP_7x7mm_P0.5mm_EP4.1x4.1mm

FP3D

Package_DFN_QFN

VQFN, 48 Pin (http://www.ti.com/lit/ds/symlink/cc430f5137.pdf#page=128)

Pads: 49
SMD: 8.3×8.3
Boards: —

VQFN-68-1EP_8x8mm_P0.4mm_EP4.3x4.3mm

FP3D

Package_DFN_QFN

VQFN, 68 Pin (https://ftdichip.com/wp-content/uploads/2025/09/DS_FT2233HP.pdf#page=49)

Pads: 69
SMD: 9.2×9.2
Boards: —

WDFN-8-1EP_4x3mm_P0.65mm_EP2.4x1.8mm_ThermalVias

FP3D

Package_DFN_QFN

WDFN, 8 Pin (https://www.onsemi.com/pub/Collateral/509AF.PDF)

Pads: 9
SMD: 5.2×3.5
Boards: —

WQFN-20-1EP_4x4mm_P0.5mm_EP2.7x2.7mm_ThermalVias

FP3D

Package_DFN_QFN

WQFN, 20 Pin (JEDEC MO-220 variation WGGD-5, custom Exposed Pad from Texas Instruments and Maxim, https://www.jedec.org/standards-documents/docs/mo-220-k01, https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF, https://www.ti.com/lit/ml/qfnd016s/qfnd016s.pdf, https://www.ti.com/lit/ds/symlink/tuss4470.pdf#page=44)

Pads: 21
SMD: 5.3×5.3
Boards: —

WQFN-38-1EP_5x7mm_P0.5mm_EP3.15x5.15mm

FP3D

Package_DFN_QFN

WQFN, 38 Pin (JEDEC MO-220 variation WHKD (with exposed pad size from Linear Technology / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_38_05-08-1701.pdf)

Pads: 39
SMD: 6.2×8.2
Boards: —

WQFN-38-1EP_5x7mm_P0.5mm_EP3.15x5.15mm_ThermalVias

FP3D

Package_DFN_QFN

Pads: 39
SMD: 6.2×8.2
Boards: —

IXYS_Flatpak-8_6.3x9.7mm_P2.54mm

FP3D

Package_DIP

IXYS Flatpak, 8 Pin (https://www.littelfuse.com/media?resourcetype=datasheets&itemid=996c6e8f-cc1b-44f6-811e-251c6e004c56&filename=littelfuse-integrated-circuits-loc112-datasheet)

Pads: 8
SMD: 10.8×10.2
Boards: —

IXYS_SMD-8_6.3x9.7mm_P2.54mm

FP3D

Package_DIP

IXYS Flatpak, 8 Pin (https://www.littelfuse.com/media?resourcetype=datasheets&itemid=996c6e8f-cc1b-44f6-811e-251c6e004c56&filename=littelfuse-integrated-circuits-loc112-datasheet)

Pads: 8
SMD: 11.1×10.2
Boards: —