Footprints
269 footprints matching “7.62mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
DIP-22_W7.62mm_Socket_LongPads
Package_DIP
22-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads
- Pads
- 22
- THT
- 10.7×28.6
- Boards
- —
DIP-24_W7.62mm_SMDSocket_SmallPads
Package_DIP
24-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), SMDSocket, SmallPads
- Pads
- 24
- SMD
- 10.7×31.1
- Boards
- —
DIP-5-6_W7.62mm_LongPads
Package_DIP
5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads
- Pads
- 5
- THT
- 10.6×8.2
- Boards
- —
DIP-5-6_W7.62mm_SMDSocket_SmallPads
Package_DIP
5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads
- Pads
- 5
- SMD
- 10.7×8.3
- Boards
- —
DIP-5-6_W7.62mm_Socket
Package_DIP
5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket
- Pads
- 5
- THT
- 10.7×8.3
- Boards
- —
DIP-5-6_W7.62mm_Socket_LongPads
Package_DIP
5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads
- Pads
- 5
- THT
- 10.7×8.3
- Boards
- —
DIP-8-N6_W7.62mm
Package_DIP
8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 6
- Pads
- 7
- THT
- 9.8×10.7
- Boards
- —
PowerIntegrations_eDIP-12B
Package_DIP
Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf
- Pads
- 11
- THT
- 12.1×10.8
- Boards
- —
PowerIntegrations_PDIP-8B
Package_DIP
Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf
- Pads
- 7
- THT
- 10.6×10.7
- Boards
- —
PowerIntegrations_PDIP-8C
Package_DIP
Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf
- Pads
- 7
- THT
- 10.6×10.7
- Boards
- —
PowerIntegrations_SDIP-10C
Package_DIP
PowerIntegrations variant of 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf
- Pads
- 9
- THT
- 10.6×13.3
- Boards
- —
PowerIntegrations_SMD-8C
Package_DIP
PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf
- Pads
- 7
- SMD
- 11.1×10.7
- Boards
- —
SMDIP-10_W7.62mm
Package_DIP
10-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)
- Pads
- 10
- SMD
- 10.1×13.2
- Boards
- —
SMDIP-12_W7.62mm
Package_DIP
12-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)
- Pads
- 12
- SMD
- 10.1×15.7
- Boards
- —
SMDIP-14_W7.62mm
Package_DIP
14-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)
- Pads
- 14
- SMD
- 10.1×18.3
- Boards
- —
SMDIP-16_W7.62mm
Package_DIP
16-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)
- Pads
- 16
- SMD
- 10.1×20.8
- Boards
- —
SMDIP-18_W7.62mm
Package_DIP
18-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)
- Pads
- 18
- SMD
- 10.1×23.4
- Boards
- —
SMDIP-20_W7.62mm
Package_DIP
20-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)
- Pads
- 20
- SMD
- 10.1×25.9
- Boards
- —
SMDIP-22_W7.62mm
Package_DIP
22-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)
- Pads
- 22
- SMD
- 10.1×28.4
- Boards
- —
SMDIP-24_W7.62mm
Package_DIP
24-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)
- Pads
- 24
- SMD
- 10.1×31.0
- Boards
- —
SMDIP-32_W7.62mm
Package_DIP
32-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)
- Pads
- 32
- SMD
- 10.1×41.2
- Boards
- —
Toshiba_11-7A9
Package_DIP
Toshiba 11-7A9 package, like 6-lead dip package with missing pin 5, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S)
- Pads
- 5
- THT
- 9.8×8.2
- Boards
- —
SIP4_Sharp-SSR_P7.62mm_Angled_NoHole
Package_SIP
SIP4 Footprint for SSR made by Sharp
- Pads
- 4
- THT
- 19.3×31.5
- Boards
- —
Relay_StandexMeder_DIP_HighProfile
Relay_THT
package for Standex Meder DIP reed relay series, see https://standexelectronics.com/wp-content/uploads/datasheet_reed_relay_DIP.pdf
- Pads
- 8
- THT
- 9.8×20.4
- Boards
- —