Footprints

2,878 footprints matching “TI”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Footprints that come with a 3D model.

2,878 footprints · page 119 of 120

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Mounting_Wuerth_WA-SMST-4.5mm_H8mm_9774080982

FP3D

Mounting_Wuerth

Mounting Hardware, inside through hole 4.5mm, height 8, Wuerth electronics 9774080982 (https://www.we-online.com/components/products/datasheet/9774080982R.pdf)

Pads: 1
SMD: 9.9×9.9
Boards: —

Mounting_Wuerth_WA-SMST-4.5mm_H9mm_9774090982

FP3D

Mounting_Wuerth

Mounting Hardware, inside through hole 4.5mm, height 9, Wuerth electronics 9774090982 (https://www.we-online.com/components/products/datasheet/9774090982R.pdf)

Pads: 1
SMD: 9.9×9.9
Boards: —

Mounting_Wuerth_WP-SMRA-D3.3mm_L7mm_7466300_Horizontal

FP3D

Mounting_Wuerth

Right-angle SMD mounting hardware, inside through hole 3.3mm, lenght 7mm, total height 5mm, Würth electronics 7466300 (https://www.we-online.com/components/products/datasheet/7466300.pdf)

Pads: 1
SMD: 7.5×5.7
Boards: —

Mounting_Wuerth_WP-SMRA-M3_L7mm_7466303_Horizontal

FP3D

Mounting_Wuerth

Right-angle SMD mounting Hardware, inside threaded M3, length 7m, total height 5mm, Würth electronics 7466303 (https://www.we-online.com/components/products/datasheet/7466303.pdf)

Pads: 1
SMD: 7.5×5.7
Boards: —

Broadcom_AFBR-16xxZ_Tilted

FP3D

OptoDevice

Fiber Optic Transmitter and Receiver, https://docs.broadcom.com/docs/AV02-4369EN

Pads: 6
THT: 19.8×12.8
Boards: —

Kodenshi_SG105_Reverse

FP3D

OptoDevice

package for Kodenshi SG-105 with PCB cutout, light-direction downwards, see http://www.kodenshi.co.jp/products/pdf/sensor/photointerrupter_ref/SG-105.pdf

Pads: 4
SMD: 4.2×7.5
Boards: —

Kodenshi_SG105F

FP3D

OptoDevice

package for Kodenshi SG-105F, see http://www.kodenshi.co.jp/products/pdf/sensor/photointerrupter_ref/SG-105F.pdf

Pads: 4
THT: 3.7×6.0
Boards: —

R_LDR_11x9.4mm_P8.2mm_Vertical

FP3D

OptoDevice

Resistor, LDR 11x9.4mm

Pads: 2
THT: 12.6×9.9
Boards: —

R_LDR_D13.8mm_P9.0mm_Vertical

FP3D

OptoDevice

Resistor, diameter 13.8mm pitch 9mm, see http://yourduino.com/docs/Photoresistor-5516-datasheet.pdf

Pads: 2
THT: 14.3×14.3
Boards: —

R_LDR_D20mm_P17.5mm_Vertical

FP3D

OptoDevice

Resistor, LDR 20mm diameter, pin pitch 17.5mm, see http://yourduino.com/docs/Photoresistor-5516-datasheet.pdf

Pads: 2
THT: 20.5×20.5
Boards: —

Texas_DSBGA-6_0.757x1.01mm_Layout2x3_P0.35mm

FP3D

Package_BGA

Texas Instruments, DSBGA-6, 0.757x1.01mm, SMD, YKA0006 pad definition, 0.757x1.01mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, https://www.ti.com/lit/ds/symlink/tps62843.pdf

Pads: 6
SMD: 2.8×3.0
Boards: —

ArtInChip_QFN-100-1EP_12x12mm_P0.4mm_EP7.4x7.4mm

FP3D

Package_DFN_QFN

ArtInChip QFN, 100 Pin (https://artinchip.com/upload/files/product/20240112/17050529177725663.pdf/#page=44)

Pads: 101
SMD: 13.3×13.3
Boards: —

ArtInChip_QFN-100-1EP_12x12mm_P0.4mm_EP7.4x7.4mm_ThermalVias

FP3D

Package_DFN_QFN

ArtInChip QFN, 100 Pin (https://artinchip.com/upload/files/product/20240112/17050529177725663.pdf/#page=44)

Pads: 101
SMD: 13.3×13.3
Boards: —

ArtInChip_QFN-68-1EP_7x7mm_P0.35mm_EP5.49x5.49mm_ThermalVias

FP3D

Package_DFN_QFN

ArtInChip QFN, 68 Pin (https://artinchip.com/upload/files/product/20240112/17050529177725663.pdf/#page=42)

Pads: 69
SMD: 7.7×7.7
Boards: —

ArtInChip_QFN-88-1EP_10x10mm_P0.4mm_EP6.74x6.74mm

FP3D

Package_DFN_QFN

ArtInChip QFN, 88 Pin (https://artinchip.com/upload/files/product/20240112/17050529177725663.pdf/#page=43)

Pads: 89
SMD: 10.7×10.7
Boards: —

ArtInChip_QFN-88-1EP_10x10mm_P0.4mm_EP6.74x6.74mm_ThermalVias

FP3D

Package_DFN_QFN

ArtInChip QFN, 88 Pin (https://artinchip.com/upload/files/product/20240112/17050529177725663.pdf/#page=43)

Pads: 89
SMD: 10.7×10.7
Boards: —

Texas_WQFN-MR-100_3x3-DapStencil

FP3D

Package_DFN_QFN

http://www.ti.com/general/docs/lit/getliterature.tsp?baseLiteratureNumber=szza059&fileType=pdf,http://www.ti.com/general/docs/lit/getliterature.tsp?baseLiteratureNumber=mpqf258&fileType=pdf,http://www.ti.com/general/docs/lit/getliterature.tsp?baseLiteratureNumber=LPPD235&fileType=pdf

Pads: 105
SMD: 10.5×10.5
Boards: —

Texas_WQFN-MR-100_ThermalVias_3x3-DapStencil

FP3D

Package_DFN_QFN

Pads: 105
SMD: 10.5×10.5
Boards: —

PowerIntegrations_eDIP-12B

FP3D

Package_DIP

Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf

Pads: 11
THT: 12.1×10.8
Boards: —

PowerIntegrations_PDIP-8B

FP3D

Package_DIP

Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf

Pads: 7
THT: 10.6×10.7
Boards: —

PowerIntegrations_PDIP-8C

FP3D

Package_DIP

Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf

Pads: 7
THT: 10.6×10.7
Boards: —

PowerIntegrations_SDIP-10C

FP3D

Package_DIP

PowerIntegrations variant of 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf

Pads: 9
THT: 10.6×13.3
Boards: —

PowerIntegrations_SMD-8C

FP3D

Package_DIP

PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf

Pads: 7
SMD: 11.1×10.7
Boards: —

TQFP-44-1EP_10x10mm_P0.8mm_EP4.5x4.5mm_ThermalVias

FP3D

Package_QFP

TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)

Pads: 45
SMD: 13.3×13.3
Boards: —