Footprints
540 footprints matching “6mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
L_Axial_L26.0mm_D10.0mm_P30.48mm_Horizontal_Fastron_77A
Inductor_THT
Inductor, Axial series, Axial, Horizontal, pin pitch=30.48mm, length*diameter=26*10mm^2, Fastron, 77A, http://cdn-reichelt.de/documents/datenblatt/B400/DS_77A.pdf
- Pads
- 2
- THT
- 33.4×10.5
- Boards
- 1
L_Axial_L26.0mm_D10.0mm_P7.62mm_Vertical_Fastron_77A
Inductor_THT
Inductor, Axial series, Axial, Vertical, pin pitch=7.62mm, length*diameter=26*10mm^2, Fastron, 77A, http://cdn-reichelt.de/documents/datenblatt/B400/DS_77A.pdf
- Pads
- 2
- THT
- 14.3×10.5
- Boards
- 1
L_Axial_L26.0mm_D11.0mm_P30.48mm_Horizontal_Fastron_77A
Inductor_THT
Inductor, Axial series, Axial, Horizontal, pin pitch=30.48mm, length*diameter=26*11mm^2, Fastron, 77A, http://cdn-reichelt.de/documents/datenblatt/B400/DS_77A.pdf
- Pads
- 2
- THT
- 33.4×11.5
- Boards
- 1
L_Axial_L26.0mm_D11.0mm_P5.08mm_Vertical_Fastron_77A
Inductor_THT
Inductor, Axial series, Axial, Vertical, pin pitch=5.08mm, length*diameter=26*11mm^2, Fastron, 77A, http://cdn-reichelt.de/documents/datenblatt/B400/DS_77A.pdf
- Pads
- 2
- THT
- 12.3×11.5
- Boards
- 1
L_Axial_L26.0mm_D9.0mm_P5.08mm_Vertical_Fastron_77A
Inductor_THT
Inductor, Axial series, Axial, Vertical, pin pitch=5.08mm, length*diameter=26*9mm^2, Fastron, 77A, http://cdn-reichelt.de/documents/datenblatt/B400/DS_77A.pdf
- Pads
- 2
- THT
- 11.3×9.5
- Boards
- 1
L_Radial_L7.5mm_W4.6mm_P5.00mm_Neosid_SD75
Inductor_THT
Inductor, Radial series, Radial, pin pitch=5.00mm, length*width=7.5*4.6mm^2, Neosid, SD75, http://www.neosid.de/produktblaetter/neosid_Festinduktivitaet_Sd75.pdf
- Pads
- 2
- THT
- 8.0×5.1
- Boards
- 1
LED_D1.8mm_W1.8mm_H2.4mm_Horizontal_O3.81mm_Z1.6mm
LED_THT
LED, diameter 1.8mm, size 1.8x2.4mm, horizontal offset 3.81mm, z-position of LED center 1.6mm, 2 pins, generated by kicad-footprint-generator
- Pads
- 2
- THT
- 5.0×8.3
- Boards
- 1
Mounting_Wuerth_WA-SMSI-M1.6_H6mm_ThreadDepth2mm_97730606334
Mounting_Wuerth
Mounting Hardware, inside blind hole M1.6, height 6, Wuerth electronics 97730606334 (https://www.we-online.com/components/products/datasheet/97730606334R.pdf)
- Pads
- 1
- SMD
- 4.5×4.5
- Boards
- 1
BGA-9_1.6x1.6mm_Layout3x3_P0.5mm
Package_BGA
BGA-9, http://www.ti.com/lit/ds/symlink/bq27421-g1.pdf
- Pads
- 9
- SMD
- 3.6×3.6
- Boards
- 1
Texas_DSBGA-12_1.36x1.86mm_Layout3x4_P0.5mm
Package_BGA
Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf
- Pads
- 12
- SMD
- 3.4×3.9
- Boards
- 1
LFCSP-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm
Package_CSP
LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_22.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 1
LFCSP-16-1EP_3x3mm_P0.5mm_EP1.6x1.6mm_ThermalVias
Package_CSP
LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_22.pdf)
- Pads
- 17
- SMD
- 4.3×4.3
- Boards
- 1
LFCSP-32-1EP_5x5mm_P0.5mm_EP3.6x3.6mm_ThermalVias
Package_CSP
LFCSP, 32 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ADV7280.PDF#page=28)
- Pads
- 33
- SMD
- 6.3×6.3
- Boards
- 1
DFN-8-1EP_3x2mm_P0.5mm_EP1.7x1.6mm
Package_DFN_QFN
DFN, 8 Pin (https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MP8904DD/document_id/1244/)
- Pads
- 9
- SMD
- 4.3×2.5
- Boards
- 1
DFN-8-1EP_4x4mm_P0.8mm_EP2.5x3.6mm
Package_DFN_QFN
8-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 9
- SMD
- 5.3×4.7
- Boards
- 1
QFN-56-1EP_7x7mm_P0.4mm_EP5.6x5.6mm_ThermalVias
Package_DFN_QFN
QFN, 56 Pin (http://www.cypress.com/file/416486/download#page=40)
- Pads
- 57
- SMD
- 8.3×8.3
- Boards
- 1
UQFN-48-1EP_6x6mm_P0.4mm_EP4.45x4.45mm
Package_DFN_QFN
UQFN, 48 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=347)
- Pads
- 49
- SMD
- 7.2×7.2
- Boards
- 1
DIP-10_W10.16mm_LongPads
Package_DIP
10-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads
- Pads
- 10
- THT
- 13.1×13.2
- Boards
- 1
DIP-12_W10.16mm_LongPads
Package_DIP
12-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads
- Pads
- 12
- THT
- 13.1×15.7
- Boards
- 1
DIP-22_W10.16mm
Package_DIP
22-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)
- Pads
- 22
- THT
- 12.3×28.4
- Boards
- 1
DIP-22_W10.16mm_Socket
Package_DIP
22-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), Socket
- Pads
- 22
- THT
- 13.2×28.6
- Boards
- 1
DIP-24_W10.16mm
Package_DIP
24-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)
- Pads
- 24
- THT
- 12.3×31.0
- Boards
- 1
AMS_LGA-10-1EP_2.7x4mm_P0.6mm
Package_LGA
LGA-10, http://ams.com/eng/content/download/951091/2269479/471718
- Pads
- 11
- SMD
- 3.0×4.3
- Boards
- 1
TQFP-144_16x16mm_P0.4mm
Package_QFP
144-Lead Plastic Thin Quad Flatpack (PH) - 16x16x1 mm Body, 2.00 mm Footprint [TQFP] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 144
- SMD
- 19.4×19.4
- Boards
- 1