Footprints
429 footprints matching “RM”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
WDFN-8-1EP_4x3mm_P0.65mm_EP2.4x1.8mm_ThermalVias
Package_DFN_QFN
WDFN, 8 Pin (https://www.onsemi.com/pub/Collateral/509AF.PDF)
- Pads
- 9
- SMD
- 5.2×3.5
- Boards
- —
WQFN-20-1EP_4x4mm_P0.5mm_EP2.7x2.7mm_ThermalVias
Package_DFN_QFN
WQFN, 20 Pin (JEDEC MO-220 variation WGGD-5, custom Exposed Pad from Texas Instruments and Maxim, https://www.jedec.org/standards-documents/docs/mo-220-k01, https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF, https://www.ti.com/lit/ml/qfnd016s/qfnd016s.pdf, https://www.ti.com/lit/ds/symlink/tuss4470.pdf#page=44)
- Pads
- 21
- SMD
- 5.3×5.3
- Boards
- —
WQFN-38-1EP_5x7mm_P0.5mm_EP3.15x5.15mm_ThermalVias
Package_DFN_QFN
WQFN, 38 Pin (JEDEC MO-220 variation WHKD (with exposed pad size from Linear Technology / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_38_05-08-1701.pdf)
- Pads
- 39
- SMD
- 6.2×8.2
- Boards
- —
LQFP-52-1EP_10x10mm_P0.65mm_EP4.8x4.8mm_ThermalVias
Package_QFP
LQFP, 52 Pin (https://www.onsemi.com/pub/Collateral/848H-01.PDF)
- Pads
- 53
- SMD
- 13.3×13.3
- Boards
- —
TQFP-44-1EP_10x10mm_P0.8mm_EP4.5x4.5mm_ThermalVias
Package_QFP
TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)
- Pads
- 45
- SMD
- 13.3×13.3
- Boards
- —
TQFP-48-1EP_7x7mm_P0.5mm_EP3.5x3.5mm_ThermalVias
Package_QFP
TQFP, 48 Pin (JEDEC MS-026 variation ABC, 1.00mm body thickness, custom Exposed Pad from Microchip and Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=664, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_48_4.pdf)
- Pads
- 49
- SMD
- 10.3×10.3
- Boards
- —
TQFP-52-1EP_10x10mm_P0.65mm_EP6.5x6.5mm_ThermalVias
Package_QFP
TQFP, 52 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_52_1.pdf)
- Pads
- 53
- SMD
- 13.3×13.3
- Boards
- —
TQFP-64-1EP_10x10mm_P0.5mm_EP5.305x5.305mm_ThermalVias
Package_QFP
TQFP, 64 Pin (https://www.esstech.com/wp-content/uploads/2022/09/ES9028PRO-Datasheet-v3.7.pdf#page=54)
- Pads
- 65
- SMD
- 13.5×13.5
- Boards
- —
TQFP-80-1EP_14x14mm_P0.65mm_EP9.5x9.5mm_ThermalVias
Package_QFP
TQFP, 80 Pin (Based on JEDEC MS-026 variation AEC, 1.00mm body thickness, lead width / tolerances / custom Exposed Pad from Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_80_4.pdf)
- Pads
- 81
- SMD
- 17.4×17.4
- Boards
- —
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- —
HTSSOP-38-1EP_6.1x12.5mm_P0.65mm_EP5.2x12.5mm_Mask3.39x6.35mm_ThermalVias
Package_SO
HTSSOP, 38 Pin (https://www.ti.com/jp/lit/ml/pptd158c/pptd158c.pdf)
- Pads
- 39
- SMD
- 9.5×13.0
- Boards
- —
MSOP-12-1EP_3x4.039mm_P0.65mm_EP1.651x2.845mm_ThermalVias
Package_SO
MSOP, 12 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081666_g_mse12.pdf)
- Pads
- 13
- SMD
- 6.3×4.5
- Boards
- —
SSOP-10-1EP_3.9x4.9mm_P1mm_EP2.1x3.3mm_ThermalVias
Package_SO
SSOP, 10 Pin (http://download.py32.org/%E6%95%B0%E6%8D%AE%E6%89%8B%E5%86%8C/zh-CN/PY32F002A%20%E7%B3%BB%E5%88%97%E6%95%B0%E6%8D%AE%E6%89%8B%E5%86%8C_Rev1.0.pdf#page=44)
- Pads
- 11
- SMD
- 7.5×5.4
- Boards
- —
ST_PowerSSO-24_SlugDown_ThermalVias
Package_SO
ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7266p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)
- Pads
- 25
- SMD
- 12.1×10.8
- Boards
- —
ST_PowerSSO-36_SlugDown_ThermalVias
Package_SO
ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7492p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)
- Pads
- 37
- SMD
- 12.1×10.8
- Boards
- —
Texas_HTSSOP-14-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3.155x3.255mm_ThermalVias
Package_SO
Texas HTSSOP, 14 Pin (Texas Instruments PWP0014A, based on JEDEC MO-153 variation ABT-1, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd287a/pptd287a.pdf, https://www.ti.com/lit/ds/symlink/lm5161.pdf#page=34, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 15
- SMD
- 7.8×5.5
- Boards
- —
Microchip_USON-10-1EP_3x3mm_P0.5mm_EP1.8x2.5mm_ThermalVias
Package_SON
Microchip USON, 10 Pin (https://ww1.microchip.com/downloads/aemDocuments/documents/OTH/ProductDocuments/DataSheets/20002281C.pdf#page=14)
- Pads
- 11
- SMD
- 4.2×3.5
- Boards
- —
VSON-10-1EP_3x3mm_P0.5mm_EP1.2x2mm_ThermalVias
Package_SON
VSON, 10 Pin (http://rohmfs.rohm.com/en/products/databook/datasheet/ic/power/switching_regulator/bd8314nuv-e.pdf (Page 20))
- Pads
- 11
- SMD
- 4.3×3.5
- Boards
- —
WSON-10-1EP_4x4mm_P0.8mm_EP2.6x3mm_ThermalVias
Package_SON
WSON, 10 Pin (https://www.ti.com/lit/ml/qfnd434a/qfnd434a.pdf)
- Pads
- 11
- SMD
- 5.3×4.5
- Boards
- —
TO-218-2_Vertical
Package_TO_SOT_THT
TO-218-2, Vertical, RM 10.95mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf
- Pads
- 2
- THT
- 15.4×5.4
- Boards
- —
TO-220-11_P3.4x5.08mm_StaggerEven_Lead4.58mm_Vertical
Package_TO_SOT_THT
TO-220-11, Vertical, RM 1.7mm, Multiwatt-11, staggered type-2, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf
- Pads
- 11
- THT
- 20.7×11.0
- Boards
- —
TO-220-5_P3.4x3.7mm_StaggerEven_Lead3.8mm_Vertical
Package_TO_SOT_THT
TO-220-5, Vertical, RM 1.7mm, Pentawatt, staggered type-2, see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-to-220/to-220_5_05-08-1421.pdf?domain=www.linear.com, https://www.diodes.com/assets/Package-Files/TO220-5.pdf
- Pads
- 5
- THT
- 10.5×9.6
- Boards
- —
TO-247-5_Vertical
Package_TO_SOT_THT
TO-247-5, Vertical, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf
- Pads
- 5
- THT
- 16.4×5.5
- Boards
- —
TO-251-2_Vertical
Package_TO_SOT_THT
TO-251-2, Vertical, RM 4.58mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf
- Pads
- 2
- THT
- 7.1×2.8
- Boards
- —