Footprints

336 footprints matching “power”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints that come with a 3D model.

336 footprints · page 13 of 14

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L_Walsin_WLFM252009x

FP3D

Inductor_SMD

Inductor, Walsin, WLFM252009x, 2.5x2.0x0.9mm, (http://www.passivecomponent.com/wp-content/uploads/inductor/WLFM_C_series.pdf)

Pads: 2
SMD: 4.3×2.5
Boards: —

BarrelJack_Horizontal

FP3D

kiml-00-kiml-connector-barrel-jack

DC Barrel Jack

Pads: 3
THT: 16.0×11.5
Boards: —

Vishay_PowerPAK_MLP44-24L

FP3D

Package_DFN_QFN

PowerPAK PowerPAK MLP44-24L (https://www.vishay.com/docs/78231/mlp44-24l.pdf)

Pads: 28
SMD: 5.1×5.1
Boards: —

Vishay_PowerPAK_MLP44-24L_ThermalVias

FP3D

Package_DFN_QFN

PowerPAK PowerPAK MLP44-24L (https://www.vishay.com/docs/78231/mlp44-24l.pdf)

Pads: 28
SMD: 5.1×5.1
Boards: —

PowerIntegrations_eDIP-12B

FP3D

Package_DIP

Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf

Pads: 11
THT: 12.1×10.8
Boards: —

PowerIntegrations_PDIP-8B

FP3D

Package_DIP

Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf

Pads: 7
THT: 10.6×10.7
Boards: —

PowerIntegrations_PDIP-8C

FP3D

Package_DIP

Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf

Pads: 7
THT: 10.6×10.7
Boards: —

PowerIntegrations_SDIP-10C

FP3D

Package_DIP

PowerIntegrations variant of 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf

Pads: 9
THT: 10.6×13.3
Boards: —

PowerIntegrations_SMD-8C

FP3D

Package_DIP

PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf

Pads: 7
SMD: 11.1×10.7
Boards: —

PowerIntegrations_eSIP-7C

FP3D

Package_SIP

eSIP-7C Vertical Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf

Pads: 6
THT: 10.5×5.8
Boards: —

PowerIntegrations_eSIP-7F

FP3D

Package_SIP

eSIP-7F Flat Package with Heatsink Tab https://ac-dc.power.com/sites/default/files/product-docs/linkswitch-ph_family_datasheet.pdf

Pads: 6
THT: 14.0×10.7
Boards: —

PowerIntegrations_eSOP-12B

FP3D

Package_SO

eSOP-12B SMT Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf

Pads: 12
SMD: 13.6×11.2
Boards: —

PowerIntegrations_SO-8B

FP3D

Package_SO

Power-Integrations variant of 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf

Pads: 7
SMD: 7.4×5.4
Boards: —

PowerSSO-16-1EP_3.9x4.9mm_P0.5mm_EP2.5x3.61mm

FP3D

Package_SO

PowerSSO, 16 Pin (https://www.st.com/resource/en/datasheet/vnd7020aj.pdf)

Pads: 17
SMD: 7.3×5.4
Boards: —

ST_PowerSSO-24_SlugDown

FP3D

Package_SO

ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7266p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)

Pads: 25
SMD: 12.1×10.8
Boards: —

ST_PowerSSO-24_SlugDown_ThermalVias

FP3D

Package_SO

ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7266p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)

Pads: 25
SMD: 12.1×10.8
Boards: —

ST_PowerSSO-24_SlugUp

FP3D

Package_SO

ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7266p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)

Pads: 24
SMD: 12.1×10.8
Boards: —

ST_PowerSSO-36_SlugDown

FP3D

Package_SO

ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7492p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)

Pads: 37
SMD: 12.1×10.8
Boards: —

ST_PowerSSO-36_SlugDown_ThermalVias

FP3D

Package_SO

ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7492p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)

Pads: 37
SMD: 12.1×10.8
Boards: —

ST_PowerSSO-36_SlugUp

FP3D

Package_SO

ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7492p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)

Pads: 36
SMD: 12.1×10.8
Boards: —

Texas_HTSSOP-14-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3.155x3.255mm

FP3D

Package_SO

Texas HTSSOP, 14 Pin (Texas Instruments PWP0014A, based on JEDEC MO-153 variation ABT-1, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd287a/pptd287a.pdf, https://www.ti.com/lit/ds/symlink/lm5161.pdf#page=34, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 15
SMD: 7.8×5.5
Boards: —

Texas_HTSSOP-14-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3.155x3.255mm_ThermalVias

FP3D

Package_SO

Pads: 15
SMD: 7.8×5.5
Boards: —

Relay_DPDT_Hongfa_HF115F-2Z-x4

FP3D

Relay_THT

Hongfa DPDT power relay, 8A, 250VAC, body size 29x127.x15.7mm, https://source.hongfa.com//pdf/web/viewer.html?file=/Uploads/Product/PDF/HF115F_I_en.pdf

Pads: 8
THT: 29.6×13.2
Boards: —

Relay_SPST_Omron_G5NB

FP3D

Relay_THT

PCB Power Relay, SPST-NO, 7A (250 VAC), 5A (30 VDC), 20.5x7.2x15.3mm max

Pads: 4
THT: 21.0×7.7
Boards: —