3,408 footprints matching “3”

Package_DIP

20-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils), Clearance8mm

Pads

20

SMD

11.5×25.9

Boards

—

Package_DIP

22-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)

Pads

22

SMD

10.1×28.4

Boards

—

Package_DIP

22-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils)

Pads

22

SMD

12.0×28.4

Boards

—

Package_DIP

22-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils), Clearance8mm

Pads

22

SMD

11.5×28.4

Boards

—

Package_DIP

24-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)

Pads

24

SMD

10.1×31.0

Boards

—

Package_DIP

24-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils)

Pads

24

SMD

12.0×31.0

Boards

—

Package_DIP

32-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)

Pads

32

SMD

14.0×41.2

Boards

—

Package_DIP

32-lead surface-mounted (SMD) DIP package, row spacing 15.24mm (600 mils)

Pads

32

SMD

17.8×41.2

Boards

—

Package_DIP

32-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)

Pads

32

SMD

10.1×41.2

Boards

—

Package_DIP

32-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils)

Pads

32

SMD

12.0×41.2

Boards

—

Package_DIP

40-lead surface-mounted (SMD) DIP package, row spacing 25.24mm (993 mils)

Pads

40

SMD

27.7×51.3

Boards

—

Package_DIP

Toshiba 11-7A9 package, like 6-lead dip package with missing pin 5, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S)

Pads

5

THT

9.8×8.2

Boards

—

Package_LGA

Texas SIL0010A MicroSiP, 10 Pin (http://www.ti.com/lit/ml/mpds579b/mpds579b.pdf)

Pads

11

SMD

4.4×3.5

Boards

—

Package_QFP

LQFP, 36 Pin (https://www.onsemi.com/pub/Collateral/561AV.PDF)

Pads

36

SMD

10.4×10.4

Boards

—

Package_QFP

TQFP, 48 Pin (JEDEC MS-026 variation ABC, 1.00mm body thickness, custom Exposed Pad from Microchip and Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=664, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_48_4.pdf)

Pads

49

SMD

10.3×10.3

Boards

—

Package_QFP

TQFP, 64 Pin (https://www.esstech.com/wp-content/uploads/2022/09/ES9028PRO-Datasheet-v3.7.pdf#page=54)

Pads

65

SMD

13.5×13.5

Boards

—

Package_QFP

TQFP, 64 Pin (https://www.esstech.com/wp-content/uploads/2022/09/ES9028PRO-Datasheet-v3.7.pdf#page=54)

Pads

65

SMD

13.5×13.5

Boards

—

Package_QFP

TQFP, 80 Pin (JEDEC MS-026 variation AEC, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=679)

Pads

80

SMD

17.3×17.3

Boards

—

Package_SIP

SIP 9-pin ()

Pads

9

THT

22.3×3.5

Boards

—

Package_SO

Analog MSOP, 12 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081847_b_ms16(12).pdf)

Pads

12

SMD

5.6×4.5

Boards

—

Package_SO

HSOP 11.0x15.9mm Pitch 0.65mm Slug Up (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf)

Pads

36

SMD

15.9×16.4

Boards

—

Package_SO

HTSSOP, 16 Pin (http://www.ti.com/lit/ds/symlink/tps2660.pdf#page=48)

Pads

17

SMD

7.8×5.5

Boards

—

Package_SO

20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [HTSSOP], with thermal pad with vias

Pads

21

SMD

7.9×7.1

Boards

—

Package_SO

HTSSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=37&zoom=160,-90,3)

Pads

21

SMD

7.8×7.0

Boards

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