Footprints
3,408 footprints matching “3”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Toshiba_SOIC-4-6_4.4x3.6mm_P1.27mm
Package_SO
Toshiba SOIC, 4 Pin (https://toshiba.semicon-storage.com/eu/semiconductor/design-development/package/detail.4pin%20MFSOP6.html)
- Pads
- 4
- SMD
- 8.0×4.1
- Boards
- —
Toshiba_SOIC-5-6_4.4x3.6mm_P1.27mm
Package_SO
Toshiba SOIC, 5 Pin (https://toshiba.semicon-storage.com/eu/semiconductor/design-development/package/detail.5pin%20MFSOP6.html)
- Pads
- 5
- SMD
- 8.0×4.1
- Boards
- —
TSOP-I-32_16.4x8mm_P0.5mm
Package_SO
TSOP-I, 32 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation BC)
- Pads
- 32
- SMD
- 19.5×8.5
- Boards
- —
TSSOP-30_6.1x9.7mm_P0.65mm
Package_SO
TSSOP, 30 Pin (JEDEC MO-153 Var DB-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 30
- SMD
- 9.4×10.2
- Boards
- —
TSSOP-32_4.4x6.5mm_P0.4mm
Package_SO
TSSOP, 32 Pin (JEDEC MO-153 Var CB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 32
- SMD
- 7.7×7.0
- Boards
- —
TSSOP-32_6.1x11mm_P0.65mm
Package_SO
TSSOP, 32 Pin (JEDEC MO-153 Var DC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 32
- SMD
- 9.4×11.5
- Boards
- —
TSSOP-32_8x11mm_P0.65mm
Package_SO
TSSOP, 32 Pin (JEDEC MO-153 Var GB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 32
- SMD
- 11.3×11.5
- Boards
- —
TSSOP-36_4.4x7.8mm_P0.4mm
Package_SO
TSSOP, 36 Pin (JEDEC MO-153 Var CC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 36
- SMD
- 7.7×8.3
- Boards
- —
TSSOP-36_4.4x9.7mm_P0.5mm
Package_SO
TSSOP, 36 Pin (JEDEC MO-153 Var BD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 36
- SMD
- 7.7×10.2
- Boards
- —
TSSOP-36_6.1x12.5mm_P0.65mm
Package_SO
TSSOP, 36 Pin (JEDEC MO-153 Var DD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 36
- SMD
- 9.4×13.0
- Boards
- —
TSSOP-36_6.1x7.8mm_P0.4mm
Package_SO
TSSOP, 36 Pin (JEDEC MO-153 Var FA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 36
- SMD
- 9.4×8.3
- Boards
- —
TSSOP-36_6.1x9.7mm_P0.5mm
Package_SO
TSSOP, 36 Pin (JEDEC MO-153 Var EB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 36
- SMD
- 9.4×10.2
- Boards
- —
TSSOP-36_8x12.5mm_P0.65mm
Package_SO
TSSOP, 36 Pin (JEDEC MO-153 Var GC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 36
- SMD
- 11.3×13.0
- Boards
- —
TSSOP-36_8x9.7mm_P0.5mm
Package_SO
TSSOP, 36 Pin (JEDEC MO-153 Var HA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 36
- SMD
- 11.3×10.2
- Boards
- —
TSSOP-38_6.1x12.5mm_P0.65mm
Package_SO
TSSOP, 38 Pin (JEDEC MO-153 Var DD-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 38
- SMD
- 9.4×13.0
- Boards
- —
Microchip_USON-10-1EP_3x3mm_P0.5mm_EP1.8x2.5mm
Package_SON
Microchip USON, 10 Pin (https://ww1.microchip.com/downloads/aemDocuments/documents/OTH/ProductDocuments/DataSheets/20002281C.pdf#page=14)
- Pads
- 11
- SMD
- 4.2×3.5
- Boards
- —
Microchip_USON-10-1EP_3x3mm_P0.5mm_EP1.8x2.5mm_ThermalVias
Package_SON
Microchip USON, 10 Pin (https://ww1.microchip.com/downloads/aemDocuments/documents/OTH/ProductDocuments/DataSheets/20002281C.pdf#page=14)
- Pads
- 11
- SMD
- 4.2×3.5
- Boards
- —
Nexperia_HUSON-12_USON-12-1EP_1.35x2.5mm_P0.4mm_EP0.4x2mm
Package_SON
Nexperia HUSON-12 USON, 12 Pin (https://assets.nexperia.com/documents/data-sheet/IP4251_52_53_54-TTL.pdf)
- Pads
- 13
- SMD
- 2.6×3.0
- Boards
- —
Nexperia_HUSON-8_USON-8-1EP_1.35x1.7mm_P0.4mm_EP0.4x1.2mm
Package_SON
Nexperia HUSON-8 USON, 8 Pin (https://assets.nexperia.com/documents/data-sheet/IP4251_52_53_54-TTL.pdf)
- Pads
- 9
- SMD
- 2.6×2.2
- Boards
- —
VSON-10-1EP_3x3mm_P0.5mm_EP1.2x2mm_ThermalVias
Package_SON
VSON, 10 Pin (http://rohmfs.rohm.com/en/products/databook/datasheet/ic/power/switching_regulator/bd8314nuv-e.pdf (Page 20))
- Pads
- 11
- SMD
- 4.3×3.5
- Boards
- —
WSON-10-1EP_4x4mm_P0.8mm_EP2.6x3mm
Package_SON
WSON, 10 Pin (https://www.ti.com/lit/ml/qfnd434a/qfnd434a.pdf)
- Pads
- 11
- SMD
- 5.3×4.5
- Boards
- —
WSON-10-1EP_4x4mm_P0.8mm_EP2.6x3mm_ThermalVias
Package_SON
WSON, 10 Pin (https://www.ti.com/lit/ml/qfnd434a/qfnd434a.pdf)
- Pads
- 11
- SMD
- 5.3×4.5
- Boards
- —
WSON-16_3.3x1.35_P0.4mm
Package_SON
WSON-16 3.3 x 1.35mm Pitch 0.4mm http://www.chip.tomsk.ru/chip/chipdoc.nsf/Package/C67E729A4D6C883A4725793E004C8739!OpenDocument
- Pads
- 17
- SMD
- 2.2×3.8
- Boards
- —
SOT-1333-1
Package_TO_SOT_SMD
SOT-1333-1
- Pads
- 9
- SMD
- 3.0×2.8
- Boards
- —