Footprints

377 footprints matching “leaded”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

377 footprints · page 15 of 16

Matched by name and keywords. Search by meaning instead

SMDIP-22_W9.53mm_Clearance8mm

FP3D

Package_DIP

22-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils), Clearance8mm

Pads
22
SMD
11.5×28.4
Boards
—

SMDIP-24_W11.48mm

FP3D

Package_DIP

24-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)

Pads
24
SMD
14.0×31.0
Boards
—

SMDIP-24_W15.24mm

FP3D

Package_DIP

24-lead surface-mounted (SMD) DIP package, row spacing 15.24mm (600 mils)

Pads
24
SMD
17.8×31.0
Boards
—

SMDIP-24_W7.62mm

FP3D

Package_DIP

24-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)

Pads
24
SMD
10.1×31.0
Boards
—

SMDIP-24_W9.53mm

FP3D

Package_DIP

24-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils)

Pads
24
SMD
12.0×31.0
Boards
—

SMDIP-28_W15.24mm

FP3D

Package_DIP

28-lead surface-mounted (SMD) DIP package, row spacing 15.24mm (600 mils)

Pads
28
SMD
17.8×36.1
Boards
—

SMDIP-32_W11.48mm

FP3D

Package_DIP

32-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)

Pads
32
SMD
14.0×41.2
Boards
—

SMDIP-32_W15.24mm

FP3D

Package_DIP

32-lead surface-mounted (SMD) DIP package, row spacing 15.24mm (600 mils)

Pads
32
SMD
17.8×41.2
Boards
—

SMDIP-32_W7.62mm

FP3D

Package_DIP

32-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)

Pads
32
SMD
10.1×41.2
Boards
—

SMDIP-32_W9.53mm

FP3D

Package_DIP

32-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils)

Pads
32
SMD
12.0×41.2
Boards
—

SMDIP-4_W11.48mm

FP3D

Package_DIP

4-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)

Pads
4
SMD
14.0×5.6
Boards
—

SMDIP-40_W15.24mm

FP3D

Package_DIP

40-lead surface-mounted (SMD) DIP package, row spacing 15.24mm (600 mils)

Pads
40
SMD
17.8×51.3
Boards
—

SMDIP-40_W25.24mm

FP3D

Package_DIP

40-lead surface-mounted (SMD) DIP package, row spacing 25.24mm (993 mils)

Pads
40
SMD
27.7×51.3
Boards
—

SMDIP-42_W15.24mm

FP3D

Package_DIP

42-lead surface-mounted (SMD) DIP package, row spacing 15.24mm (600 mils)

Pads
42
SMD
17.8×53.8
Boards
—

SMDIP-48_W15.24mm

FP3D

Package_DIP

48-lead surface-mounted (SMD) DIP package, row spacing 15.24mm (600 mils)

Pads
48
SMD
17.8×61.5
Boards
—

SMDIP-6_W11.48mm

FP3D

Package_DIP

6-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)

Pads
6
SMD
14.0×8.1
Boards
—

SMDIP-64_W15.24mm

FP3D

Package_DIP

64-lead surface-mounted (SMD) DIP package, row spacing 15.24mm (600 mils)

Pads
64
SMD
17.8×81.8
Boards
—

Toshiba_11-7A9

FP3D

Package_DIP

Toshiba 11-7A9 package, like 6-lead dip package with missing pin 5, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S)

Pads
5
THT
9.8×8.2
Boards
—

Microchip_PQFP-44_10x10mm_P0.8mm

FP3D

Package_QFP

Microchip PQFP, 44 Pin (JEDEC MO-112 variation AA-2, Microchip and Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MO-112, https://ww1.microchip.com/downloads/aemDocuments/documents/OTH/ProductDocuments/DataSheets/20005418B.pdf#page=10, https://www.analog.com/media/en/technical-documentation/data-sheets/ad7722.pdf#page=23)

Pads
44
SMD
15.4×15.4
Boards
—

TQFP-44-1EP_10x10mm_P0.8mm_EP4.5x4.5mm_ThermalVias

FP3D

Package_QFP

TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)

Pads
45
SMD
13.3×13.3
Boards
—

TQFP-80-1EP_14x14mm_P0.65mm_EP9.5x9.5mm

FP3D

Package_QFP

TQFP, 80 Pin (Based on JEDEC MS-026 variation AEC, 1.00mm body thickness, lead width / tolerances / custom Exposed Pad from Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_80_4.pdf)

Pads
81
SMD
17.4×17.4
Boards
—

TQFP-80-1EP_14x14mm_P0.65mm_EP9.5x9.5mm_ThermalVias

FP3D

Package_QFP

TQFP, 80 Pin (Based on JEDEC MS-026 variation AEC, 1.00mm body thickness, lead width / tolerances / custom Exposed Pad from Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_80_4.pdf)

Pads
81
SMD
17.4×17.4
Boards
—

HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm

FP3D

Package_SO

20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [HTSSOP], with thermal pad with vias

Pads
21
SMD
7.9×7.1
Boards
—

HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm

FP3D

Package_SO

HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad

Pads
29
SMD
7.3×10.3
Boards
—