Footprints
4,101 footprints matching “G”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
LGA-16_4x4mm_P0.65mm_LayoutBorder4x4y
Package_LGA
LGA, 16 Pin (http://www.st.com/resource/en/datasheet/l3gd20.pdf)
- Pads
- 16
- SMD
- 4.5×4.5
- Boards
- —
LQFP-176_20x20mm_P0.4mm
Package_QFP
LQFP, 176 Pin (JEDEC MS-026 variation BFC, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026)
- Pads
- 176
- SMD
- 23.3×23.3
- Boards
- —
MO112AC1_PQFP-52_10x10mm_P0.65mm
Package_QFP
MO112AC1 PQFP, 52 Pin (JEDEC MO-112 variation AC-1, https://www.jedec.org/document_search?search_api_views_fulltext=MO-112, https://www.analog.com/media/en/package-pcb-resources/package/32717196300961s_52_2.pdf)
- Pads
- 52
- SMD
- 15.2×15.2
- Boards
- —
TQFP-80-1EP_14x14mm_P0.65mm_EP9.5x9.5mm
Package_QFP
TQFP, 80 Pin (Based on JEDEC MS-026 variation AEC, 1.00mm body thickness, lead width / tolerances / custom Exposed Pad from Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_80_4.pdf)
- Pads
- 81
- SMD
- 17.4×17.4
- Boards
- —
TQFP-80-1EP_14x14mm_P0.65mm_EP9.5x9.5mm_ThermalVias
Package_QFP
TQFP, 80 Pin (Based on JEDEC MS-026 variation AEC, 1.00mm body thickness, lead width / tolerances / custom Exposed Pad from Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_80_4.pdf)
- Pads
- 81
- SMD
- 17.4×17.4
- Boards
- —
PowerIntegrations_eSIP-7C
Package_SIP
eSIP-7C Vertical Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf
- Pads
- 6
- THT
- 10.5×5.8
- Boards
- —
PowerIntegrations_eSIP-7F
Package_SIP
eSIP-7F Flat Package with Heatsink Tab https://ac-dc.power.com/sites/default/files/product-docs/linkswitch-ph_family_datasheet.pdf
- Pads
- 6
- THT
- 14.0×10.7
- Boards
- —
SIP4_Sharp-SSR_P7.62mm_Angled_NoHole
Package_SIP
SIP4 Footprint for SSR made by Sharp
- Pads
- 4
- THT
- 19.3×31.5
- Boards
- —
Analog_MSOP-12-16_3x4.039mm_P0.5mm
Package_SO
Analog MSOP, 12 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081847_b_ms16(12).pdf)
- Pads
- 12
- SMD
- 5.6×4.5
- Boards
- —
HSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugUp
Package_SO
HSOP 11.0x15.9mm Pitch 0.65mm Slug Up (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf)
- Pads
- 36
- SMD
- 15.9×16.4
- Boards
- —
HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x4.68mm
Package_SO
HTSSOP, 24 Pin (http://www.ti.com/lit/ds/symlink/tps703.pdf)
- Pads
- 25
- SMD
- 7.8×8.3
- Boards
- —
HTSSOP-38-1EP_6.1x12.5mm_P0.65mm_EP5.2x12.5mm_Mask3.39x6.35mm
Package_SO
HTSSOP, 38 Pin (https://www.ti.com/jp/lit/ml/pptd158c/pptd158c.pdf)
- Pads
- 39
- SMD
- 9.5×13.0
- Boards
- —
HTSSOP-38-1EP_6.1x12.5mm_P0.65mm_EP5.2x12.5mm_Mask3.39x6.35mm_ThermalVias
Package_SO
HTSSOP, 38 Pin (https://www.ti.com/jp/lit/ml/pptd158c/pptd158c.pdf)
- Pads
- 39
- SMD
- 9.5×13.0
- Boards
- —
Infineon_PG-DSO-20-U03_7.5x12.8mm
Package_SO
Infineon PG-DSO, 20 Pin (https://www.infineon.com/dgdl/Infineon-2ED1323S12P_2ED1324S12P-DataSheet-v01_01-EN.pdf?fileId=8ac78c8c869190210186e92f0f506d0c)
- Pads
- 20
- SMD
- 11.8×13.3
- Boards
- —
Infineon_PG-DSO-8-24_4x5mm
Package_SO
Infineon PG-DSO, 8 Pin (https://www.infineon.com/dgdl/Infineon-BSP752R-DS-v01_02-EN.pdf?fileId=db3a304316f112290116f233cbd271e9#page=17)
- Pads
- 8
- SMD
- 7.4×5.5
- Boards
- —
PowerIntegrations_eSOP-12B
Package_SO
eSOP-12B SMT Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf
- Pads
- 12
- SMD
- 13.6×11.2
- Boards
- —
PowerIntegrations_SO-8B
Package_SO
Power-Integrations variant of 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf
- Pads
- 7
- SMD
- 7.4×5.4
- Boards
- —
ST_PowerSSO-24_SlugDown
Package_SO
ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7266p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)
- Pads
- 25
- SMD
- 12.1×10.8
- Boards
- —
ST_PowerSSO-24_SlugDown_ThermalVias
Package_SO
ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7266p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)
- Pads
- 25
- SMD
- 12.1×10.8
- Boards
- —
ST_PowerSSO-24_SlugUp
Package_SO
ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7266p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)
- Pads
- 24
- SMD
- 12.1×10.8
- Boards
- —
ST_PowerSSO-36_SlugDown
Package_SO
ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7492p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)
- Pads
- 37
- SMD
- 12.1×10.8
- Boards
- —
ST_PowerSSO-36_SlugDown_ThermalVias
Package_SO
ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7492p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)
- Pads
- 37
- SMD
- 12.1×10.8
- Boards
- —
ST_PowerSSO-36_SlugUp
Package_SO
ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7492p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)
- Pads
- 36
- SMD
- 12.1×10.8
- Boards
- —
Analog_KS-4
Package_TO_SOT_SMD
Analog Devices KS-4, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/sc70ks/ks_4.pdf
- Pads
- 4
- SMD
- 3.0×2.8
- Boards
- —