Footprints
4,380 footprints matching “pins”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
HTSSOP-38-1EP_6.1x12.5mm_P0.65mm_EP5.2x12.5mm_Mask3.39x6.35mm
Package_SO
HTSSOP, 38 Pin (https://www.ti.com/jp/lit/ml/pptd158c/pptd158c.pdf)
- Pads
- 39
- SMD
- 9.5×13.0
- Boards
- —
HTSSOP-38-1EP_6.1x12.5mm_P0.65mm_EP5.2x12.5mm_Mask3.39x6.35mm_ThermalVias
Package_SO
HTSSOP, 38 Pin (https://www.ti.com/jp/lit/ml/pptd158c/pptd158c.pdf)
- Pads
- 39
- SMD
- 9.5×13.0
- Boards
- —
Infineon_PG-DSO-20-U03_7.5x12.8mm
Package_SO
Infineon PG-DSO, 20 Pin (https://www.infineon.com/dgdl/Infineon-2ED1323S12P_2ED1324S12P-DataSheet-v01_01-EN.pdf?fileId=8ac78c8c869190210186e92f0f506d0c)
- Pads
- 20
- SMD
- 11.8×13.3
- Boards
- —
Infineon_PG-DSO-8-24_4x5mm
Package_SO
Infineon PG-DSO, 8 Pin (https://www.infineon.com/dgdl/Infineon-BSP752R-DS-v01_02-EN.pdf?fileId=db3a304316f112290116f233cbd271e9#page=17)
- Pads
- 8
- SMD
- 7.4×5.5
- Boards
- —
JEITA_SOIC-16_3.9x9.9mm_P1.27mm
Package_SO
JEITA SOIC, 16 Pin (JEITA/EIAJ ED-7311-19, variation 16-001-ABA, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=30)
- Pads
- 16
- SMD
- 7.7×10.4
- Boards
- —
MSOP-12-1EP_3x4.039mm_P0.65mm_EP1.651x2.845mm_ThermalVias
Package_SO
MSOP, 12 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081666_g_mse12.pdf)
- Pads
- 13
- SMD
- 6.3×4.5
- Boards
- —
MSOP-8-1EP_3x3mm_P0.65mm_EP1.73x1.85mm
Package_SO
MSOP, 8 Pin (http://www.ti.com/lit/ds/symlink/lm25085.pdf#page=32)
- Pads
- 9
- SMD
- 6.3×3.5
- Boards
- —
PowerSSO-16-1EP_3.9x4.9mm_P0.5mm_EP2.5x3.61mm
Package_SO
PowerSSO, 16 Pin (https://www.st.com/resource/en/datasheet/vnd7020aj.pdf)
- Pads
- 17
- SMD
- 7.3×5.4
- Boards
- —
SOIC-14-16_3.9x9.9mm_P1.27mm
Package_SO
SOIC, 16 Pin package with pin 2 and 13 removed for voltage clearance (UCC256301, https://www.ti.com/lit/ds/symlink/ucc256301.pdf)
- Pads
- 14
- SMD
- 7.4×10.4
- Boards
- —
SOIC-5-6_4.4x3.6mm_P1.27mm
Package_SO
SOIC, 5 Pin (JEDEC MO-155, variation AA, 2.50mm nominal body thickness, https://www.jedec.org/system/files/docs/Mo-155a.pdf)
- Pads
- 5
- SMD
- 8.4×4.1
- Boards
- —
SOIC-8_3.81x9.347mm_P2.54mm
Package_SO
SOIC, 8 Pin (https://www.littelfuse.com/assetdocs/littelfuse-integrated-circuits-cpc2014n-datasheet?assetguid=6e3baf84-de75-4ea7-97ce-3a5e05a007c9)
- Pads
- 8
- SMD
- 7.5×9.9
- Boards
- —
SOJ-36_10.16x23.495mm_P1.27mm
Package_SO
SOJ, 36 Pin (JEDEC MS-027-A, 400 mils width, variation AE, https://www.jedec.org/system/files/docs/Ms-027a.pdf)
- Pads
- 36
- SMD
- 12.6×24.0
- Boards
- —
SSO-8-7_6.4x9.7mm_P2.54mm
Package_SO
SSO, 7 Pin (https://wmsc.lcsc.com/wmsc/upload/file/pdf/v2/lcsc/2312161855_BC-BC2213A_C596512.pdf)
- Pads
- 7
- SMD
- 11.5×10.2
- Boards
- —
SSOP-10-1EP_3.9x4.9mm_P1mm_EP2.1x3.3mm_ThermalVias
Package_SO
SSOP, 10 Pin (http://download.py32.org/%E6%95%B0%E6%8D%AE%E6%89%8B%E5%86%8C/zh-CN/PY32F002A%20%E7%B3%BB%E5%88%97%E6%95%B0%E6%8D%AE%E6%89%8B%E5%86%8C_Rev1.0.pdf#page=44)
- Pads
- 11
- SMD
- 7.5×5.4
- Boards
- —
Texas_HTSSOP-14-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3.155x3.255mm
Package_SO
Texas HTSSOP, 14 Pin (Texas Instruments PWP0014A, based on JEDEC MO-153 variation ABT-1, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd287a/pptd287a.pdf, https://www.ti.com/lit/ds/symlink/lm5161.pdf#page=34, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 15
- SMD
- 7.8×5.5
- Boards
- —
Texas_HTSSOP-14-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3.155x3.255mm_ThermalVias
Package_SO
Texas HTSSOP, 14 Pin (Texas Instruments PWP0014A, based on JEDEC MO-153 variation ABT-1, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd287a/pptd287a.pdf, https://www.ti.com/lit/ds/symlink/lm5161.pdf#page=34, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 15
- SMD
- 7.8×5.5
- Boards
- —
Toshiba_SOIC-4-6_4.4x3.6mm_P1.27mm
Package_SO
Toshiba SOIC, 4 Pin (https://toshiba.semicon-storage.com/eu/semiconductor/design-development/package/detail.4pin%20MFSOP6.html)
- Pads
- 4
- SMD
- 8.0×4.1
- Boards
- —
Toshiba_SOIC-5-6_4.4x3.6mm_P1.27mm
Package_SO
Toshiba SOIC, 5 Pin (https://toshiba.semicon-storage.com/eu/semiconductor/design-development/package/detail.5pin%20MFSOP6.html)
- Pads
- 5
- SMD
- 8.0×4.1
- Boards
- —
TSOP-I-24_12.4x6mm_P0.5mm
Package_SO
TSOP-I, 24 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation AA)
- Pads
- 24
- SMD
- 15.5×6.5
- Boards
- —
TSOP-I-24_14.4x6mm_P0.5mm
Package_SO
TSOP-I, 24 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation AB)
- Pads
- 24
- SMD
- 17.5×6.5
- Boards
- —
TSOP-I-24_16.4x6mm_P0.5mm
Package_SO
TSOP-I, 24 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation AC)
- Pads
- 24
- SMD
- 19.5×6.5
- Boards
- —
TSOP-I-24_18.4x6mm_P0.5mm
Package_SO
TSOP-I, 24 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation AD)
- Pads
- 24
- SMD
- 21.5×6.5
- Boards
- —
TSOP-I-32_16.4x8mm_P0.5mm
Package_SO
TSOP-I, 32 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation BC)
- Pads
- 32
- SMD
- 19.5×8.5
- Boards
- —
TSOP-I-40_12.4x10mm_P0.5mm
Package_SO
TSOP-I, 40 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation CA)
- Pads
- 40
- SMD
- 15.5×10.5
- Boards
- —