Footprints

1,486 footprints matching “5mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

1,486 footprints · page 18 of 62

Matched by name and keywords. Search by meaning instead

L_2512_6332Metric_Pad1.52x3.35mm_HandSolder

FP3D

Inductor_SMD

Inductor SMD 2512 (6332 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)

Pads
2
SMD
8.0×3.9
Boards
5

L_Axial_L9.5mm_D4.0mm_P5.08mm_Vertical_Fastron_SMCC

FP3D

Inductor_THT

Inductor, Axial series, Axial, Vertical, pin pitch=5.08mm, length*diameter=9.5*4mm^2, Fastron, SMCC, http://cdn-reichelt.de/documents/datenblatt/B400/DS_SMCC_NEU.pdf, http://cdn-reichelt.de/documents/datenblatt/B400/LEADEDINDUCTORS.pdf

Pads
2
THT
8.6×4.5
Boards
5

LED_D5.0mm_Horizontal_O6.35mm_Z15.0mm

FP3D

LED_THT

LED, diameter 5.0mm, horizontal offset 6.35mm, z-position of LED center 15.0mm, 2 pins, generated by kicad-footprint-generator

Pads
2
THT
6.4×16.5
Boards
5

BGA-256_17.0x17.0mm_Layout16x16_P1.0mm_Ball0.5mm_Pad0.4mm_NSMD

FP3D

Package_BGA

BGA-256, dimensions: https://www.xilinx.com/support/documentation/package_specs/ft256.pdf, design rules: https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf

Pads
256
SMD
19.0×19.0
Boards
5

LFCSP-32-1EP_5x5mm_P0.5mm_EP3.6x3.6mm

FP3D

Package_CSP

LFCSP, 32 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ADV7280.PDF#page=28)

Pads
33
SMD
6.3×6.3
Boards
5

DFN-12-1EP_3x4mm_P0.5mm_EP1.7x3.3mm

FP3D

Package_DFN_QFN

DE/UE Package; 12-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_12_05-08-1695.pdf)

Pads
13
SMD
4.1×4.6
Boards
5

QFN-28-1EP_6x6mm_P0.65mm_EP4.25x4.25mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=289)

Pads
29
SMD
7.2×7.2
Boards
5

Texas_RSA_VQFN-16-1EP_4x4mm_P0.65mm_EP2.7x2.7mm

FP3D

Package_DFN_QFN

Texas RSA VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/msp430g2001.pdf#page=44)

Pads
17
SMD
5.3×5.3
Boards
5

Texas_RSA_VQFN-16-1EP_4x4mm_P0.65mm_EP2.7x2.7mm_ThermalVias

FP3D

Package_DFN_QFN

Texas RSA VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/msp430g2001.pdf#page=44)

Pads
17
SMD
5.3×5.3
Boards
5

UDFN-10_1.35x2.6mm_P0.5mm

FP3D

Package_DFN_QFN

http://www.st.com/content/ccc/resource/technical/document/datasheet/f2/11/8a/ed/40/31/40/56/DM00088292.pdf/files/DM00088292.pdf/jcr:content/translations/en.DM00088292.pdf

Pads
10
SMD
2.3×3.1
Boards
5

UDFN-9_1.0x3.8mm_P0.5mm

FP3D

Package_DFN_QFN

9-pin UDFN package, 1.0x3.8mm, (Ref: https://katalog.we-online.de/pbs/datasheet/824014881.pdf)

Pads
9
SMD
2.1×4.3
Boards
5

UQFN-20-1EP_3x3mm_P0.4mm_EP1.85x1.85mm

FP3D

Package_DFN_QFN

UQFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=332)

Pads
21
SMD
4.2×4.2
Boards
5

VQFN-48-1EP_7x7mm_P0.5mm_EP4.1x4.1mm_ThermalVias

FP3D

Package_DFN_QFN

VQFN, 48 Pin (http://www.ti.com/lit/ds/symlink/cc430f5137.pdf#page=128)

Pads
49
SMD
8.3×8.3
Boards
5

PQFP-132_24x24mm_P0.635mm_i386

FP3D

Package_QFP

PQFP, 132 pins, 24mm sq body, 0.635mm pitch, Intel 386EX (https://www.intel.com/content/dam/www/public/us/en/documents/packaging-databooks/packaging-chapter-02-databook.pdf, http://www.nxp.com/docs/en/application-note/AN4388.pdf)

Pads
132
SMD
28.9×28.9
Boards
5

MSOP-8-1EP_3x3mm_P0.65mm_EP1.68x1.88mm_ThermalVias

FP3D

Package_SO

MSOP, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/4440fb.pdf#page=13)

Pads
9
SMD
6.3×3.5
Boards
5

SSOP-56_7.5x18.5mm_P0.635mm

FP3D

Package_SO

SSOP56: plastic shrink small outline package; 56 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf)

Pads
56
SMD
11.1×19.1
Boards
5

VSON-10-1EP_3x3mm_P0.5mm_EP1.2x2mm

FP3D

Package_SON

VSON, 10 Pin (http://rohmfs.rohm.com/en/products/databook/datasheet/ic/power/switching_regulator/bd8314nuv-e.pdf (Page 20))

Pads
11
SMD
4.3×3.5
Boards
5

SC-74-6_1.55x2.9mm_P0.95mm

FP3D

Package_TO_SOT_SMD

SC-74, 6 Pin (https://www.jeita.or.jp/japanese/standard/book/ED-7500B/#target/page_no=39)

Pads
6
SMD
4.4×3.4
Boards
5

R_Axial_DIN0516_L15.5mm_D5.0mm_P5.08mm_Vertical

FP3D

Resistor_THT

Resistor, Axial_DIN0516 series, Axial, Vertical, pin pitch=5.08mm, 2W, length*diameter=15.5*5mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf

Pads
2
THT
9.3×5.5
Boards
5

TerminalBlock_Phoenix_PT-1,5-12-5.0-H_1x12_P5.00mm_Horizontal

FP3D

TerminalBlock_Phoenix

Terminal Block Phoenix PT-1,5-12-5.0-H, 12 pins, pitch 5mm, size 60x9mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.mouser.com/ds/2/324/ItemDetail_1935161-922578.pdf

Pads
12
THT
61.0×10.0
Boards
5

RV_Disc_D12mm_W4.3mm_P7.5mm

FP3D

Varistor

Varistor, diameter 12mm, width 4.3mm, pitch 7.5mm

Pads
2
THT
12.5×4.8
Boards
5

SW_DIP_SPSTx04_Slide_Omron_A6H-4101_W6.15mm_P1.27mm

FP3D

Button_Switch_SMD

SMD 4x-dip-switch SPST Omron_A6H-4101, Slide, row spacing 6.15 mm (242 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf)

Pads
8
SMD
7.9×7.0
Boards
4

C_Disc_D14.5mm_W5.0mm_P7.50mm

FP3D

Capacitor_THT

C, Disc series, Radial, pin pitch=7.50mm, diameter*width=14.5*5.0mm^2, Capacitor, http://www.vishay.com/docs/28535/vy2series.pdf

Pads
2
THT
15.0×5.5
Boards
4

C_Radial_D16.0mm_H31.5mm_P7.50mm

FP3D

Capacitor_THT

C, Radial series, Radial, pin pitch=7.50mm, diameter=16mm, height=31.5mm, Non-Polar Electrolytic Capacitor

Pads
2
THT
16.5×16.5
Boards
4