Footprints

166 footprints matching “0.4”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

166 footprints · page 2 of 7

Matched by name and keywords. Search by meaning instead

LQFP-128_14x14mm_P0.4mm

FP3D

Package_QFP

LQFP, 128 Pin (JEDEC MS-026 variation BEE, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=423)

Pads
128
SMD
17.3×17.3
Boards
9

D_SOD-882D

FP3D

Diode_SMD

SOD-882D, DFN1006D-2, body 1.0 x 0.6 x 0.4mm, pitch 0.65mm, https://assets.nexperia.com/documents/package-information/SOD882D.pdf

Pads
2
SMD
1.8×1.2
Boards
6

R_Axial_Power_L25.0mm_W6.4mm_P30.48mm

FP3D

Resistor_THT

Resistor, Axial_Power series, Box, pin pitch=30.48mm, 5W, length*width*height=25*6.4*6.4mm^3, http://cdn-reichelt.de/documents/datenblatt/B400/5WAXIAL_9WAXIAL_11WAXIAL_17WAXIAL%23YAG.pdf

Pads
2
THT
33.4×6.9
Boards
6

BGA-256_17.0x17.0mm_Layout16x16_P1.0mm_Ball0.5mm_Pad0.4mm_NSMD

FP3D

Package_BGA

BGA-256, dimensions: https://www.xilinx.com/support/documentation/package_specs/ft256.pdf, design rules: https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf

Pads
256
SMD
19.0×19.0
Boards
5

QFN-56-1EP_7x7mm_P0.4mm_EP4x4mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 56 Pin (https://www.espressif.com/sites/default/files/documentation/esp32-s2_datasheet_en.pdf#page=41)

Pads
57
SMD
8.2×8.2
Boards
5

QFN-68-1EP_8x8mm_P0.4mm_EP5.2x5.2mm

FP3D

Package_DFN_QFN

QFN, 68 Pin (https://cdn.microsemi.com/documents/1bf6886f-5919-4508-a50b-b1dbf3fdf0f4/download/#page=98)

Pads
69
SMD
9.2×9.2
Boards
5

UQFN-20-1EP_3x3mm_P0.4mm_EP1.85x1.85mm

FP3D

Package_DFN_QFN

UQFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=332)

Pads
21
SMD
4.2×4.2
Boards
5

R_Axial_Power_L20.0mm_W6.4mm_P30.48mm

FP3D

Resistor_THT

Resistor, Axial_Power series, Box, pin pitch=30.48mm, 4W, length*width*height=20*6.4*6.4mm^3, http://cdn-reichelt.de/documents/datenblatt/B400/5WAXIAL_9WAXIAL_11WAXIAL_17WAXIAL%23YAG.pdf

Pads
2
THT
33.4×6.9
Boards
5

DFN-16-1EP_3x4mm_P0.45mm_EP1.7x3.3mm

FP3D

Package_DFN_QFN

DE Package; 16-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_16_05-08-1732.pdf)

Pads
17
SMD
4.1×4.6
Boards
4

QFN-28-1EP_4x4mm_P0.4mm_EP2.4x2.4mm

FP3D

Package_DFN_QFN

QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=280)

Pads
29
SMD
5.2×5.2
Boards
4

LQFP-64_7x7mm_P0.4mm

FP3D

Package_QFP

LQFP, 64 Pin (https://www.nxp.com/docs/en/package-information/SOT414-1.pdf)

Pads
64
SMD
10.4×10.4
Boards
4

TQFP-128_14x14mm_P0.4mm

FP3D

Package_QFP

TQFP, 128 Pin (JEDEC MS-026 variation AEE, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026)

Pads
128
SMD
17.3×17.3
Boards
4

R_Axial_DIN0617_L17.0mm_D6.0mm_P30.48mm_Horizontal

FP3D

Resistor_THT

Resistor, Axial_DIN0617 series, Axial, Horizontal, pin pitch=30.48mm, 2W, length*diameter=17*6mm^2, http://www.vishay.com/docs/20128/wkxwrx.pdf

Pads
2
THT
33.4×6.5
Boards
4

WLP-4_0.83x0.83mm_P0.4mm

FP3D

Package_BGA

WLP-4_0.83x0.83mm_P0.4mm https://pdfserv.maximintegrated.com/package_dwgs/21-100107.PDF, https://www.maximintegrated.com/en/app-notes/index.mvp/id/1891

Pads
4
SMD
2.8×2.8
Boards
3

QFN-24-1EP_3x4mm_P0.4mm_EP1.65x2.65mm

FP3D

Package_DFN_QFN

QFN, 24 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_20_05-08-1742.pdf)

Pads
25
SMD
4.3×5.3
Boards
3

QFN-32-1EP_4x4mm_P0.4mm_EP2.65x2.65mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 32 Pin (https://www.renesas.com/eu/en/package-image/pdf/outdrawing/l32.4x4a.pdf)

Pads
33
SMD
5.2×5.2
Boards
3

QFN-32-1EP_4x4mm_P0.4mm_EP2.9x2.9mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/atmel-8153-8-and-16-bit-avr-microcontroller-xmega-e-atxmega8e5-atxmega16e5-atxmega32e5_datasheet.pdf#page=70)

Pads
33
SMD
5.2×5.2
Boards
3

QFN-68-1EP_8x8mm_P0.4mm_EP5.2x5.2mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 68 Pin (https://cdn.microsemi.com/documents/1bf6886f-5919-4508-a50b-b1dbf3fdf0f4/download/#page=98)

Pads
69
SMD
9.2×9.2
Boards
3

QFN-76-1EP_9x9mm_P0.4mm_EP3.8x3.8mm

FP3D

Package_DFN_QFN

QFN, 76 Pin (https://www.marvell.com/documents/bqcwxsoiqfjkcjdjhkvc/#page=19)

Pads
77
SMD
10.2×10.2
Boards
3

LQFP-80_10x10mm_P0.4mm

FP3D

Package_QFP

LQFP, 80 Pin (https://www.renesas.com/eu/en/package-image/pdf/outdrawing/q80.10x10.pdf)

Pads
80
SMD
13.3×13.3
Boards
3

R_Axial_DIN0516_L15.5mm_D5.0mm_P30.48mm_Horizontal

FP3D

Resistor_THT

Resistor, Axial_DIN0516 series, Axial, Horizontal, pin pitch=30.48mm, 2W, length*diameter=15.5*5mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf

Pads
2
THT
33.4×5.5
Boards
3

BGA-169_11.0x11.0mm_Layout13x13_P0.8mm_Ball0.5mm_Pad0.4mm_NSMD

FP3D

Package_BGA

Altera U169, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00470-01.pdf

Pads
169
SMD
13.0×13.0
Boards
2

BGA-324_15.0x15.0mm_Layout18x18_P0.8mm_Ball0.5mm_Pad0.4mm_NSMD

FP3D

Package_BGA

Altera U324, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00474-02.pdf

Pads
324
SMD
17.0×17.0
Boards
2

Texas_DSBGA-8_0.705x1.468mm_Layout2x4_P0.4mm

FP3D

Package_BGA

Texas Instruments, DSBGA, area grid, NSMD, YBJ0008 pad definition, 0.705x1.468mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234

Pads
8
SMD
2.7×3.5
Boards
2