Footprints
104 footprints matching “0.8”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SW_DIP_SPSTx01_Piano_10.8x4.1mm_W7.62mm_P2.54mm
Button_Switch_THT
1x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), body size 10.8x4.1mm
- Pads
- 2
- THT
- 13.1×4.7
- Boards
- 6
DSUB-15-HD_Socket_Horizontal_P2.29x2.54mm_EdgePinOffset8.35mm_Housed_MountingHolesOffset10.89mm
Connector_Dsub
15-pin D-Sub connector, horizontal/angled (90 deg), THT-mount, socket (female), pitch 2.29x2.54mm, pin-PCB-offset 8.35mm, distance of mounting holes 25mm, distance of mounting holes to PCB edge 10.89mm, see https://disti-assets.s3.amazonaws.com/tonar/files/datasheets/16730.pdf
- Pads
- 16
- THT
- 31.9×22.6
- Boards
- 5
SW_DIP_SPSTx03_Piano_10.8x9.18mm_W7.62mm_P2.54mm
Button_Switch_THT
3x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), body size 10.8x9.18mm
- Pads
- 6
- THT
- 13.1×9.8
- Boards
- 4
SW_DIP_SPSTx06_Piano_10.8x16.8mm_W7.62mm_P2.54mm
Button_Switch_THT
6x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), body size 10.8x16.8mm
- Pads
- 12
- THT
- 13.1×17.4
- Boards
- 4
SW_DIP_SPSTx10_Piano_10.8x26.96mm_W7.62mm_P2.54mm
Button_Switch_THT
10x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), body size 10.8x26.96mm
- Pads
- 20
- THT
- 13.1×27.6
- Boards
- 3
TFBGA-100_9.0x9.0mm_Layout10x10_P0.8mm
Package_BGA
TFBGA-100, 10x10, 9x9mm package, pitch 0.8mm
- Pads
- 100
- SMD
- 11.0×11.0
- Boards
- 3
WLP-4_0.83x0.83mm_P0.4mm
Package_BGA
WLP-4_0.83x0.83mm_P0.4mm https://pdfserv.maximintegrated.com/package_dwgs/21-100107.PDF, https://www.maximintegrated.com/en/app-notes/index.mvp/id/1891
- Pads
- 4
- SMD
- 2.8×2.8
- Boards
- 3
QFN-16-1EP_5x5mm_P0.8mm_EP2.7x2.7mm
Package_DFN_QFN
QFN, 16 Pin (http://www.intersil.com/content/dam/Intersil/documents/l16_/l16.5x5.pdf)
- Pads
- 17
- SMD
- 6.2×6.2
- Boards
- 3
PQFP-80_14x20mm_P0.8mm
Package_QFP
PQFP, 80 Pin (JEITA/EIAJ ED-7311A (variation 80-001-PB) / JEDEC MS-022 (variation GB-2), 2.70mm body thickness, https://www.jeita.or.jp/japanese/standard/book/ED-7311A/#target/page_no=91, https://www.jedec.org/document_search?search_api_views_fulltext=MS-022)
- Pads
- 80
- SMD
- 18.5×24.5
- Boards
- 3
TQFP-44-1EP_10x10mm_P0.8mm_EP4.5x4.5mm
Package_QFP
TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)
- Pads
- 45
- SMD
- 13.3×13.3
- Boards
- 3
TerminalBlock_Phoenix_MKDS-1,5-10-5.08_1x10_P5.08mm_Horizontal
TerminalBlock_Phoenix
Terminal Block Phoenix MKDS-1,5-10-5.08, 10 pins, pitch 5.08mm, size 50.8x9.8mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.farnell.com/datasheets/100425.pdf
- Pads
- 10
- THT
- 51.8×10.8
- Boards
- 3
SW_DIP_SPSTx08_Piano_10.8x21.88mm_W7.62mm_P2.54mm
Button_Switch_THT
8x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), body size 10.8x21.88mm
- Pads
- 16
- THT
- 13.1×22.5
- Boards
- 2
BGA-169_11.0x11.0mm_Layout13x13_P0.8mm_Ball0.5mm_Pad0.4mm_NSMD
Package_BGA
Altera U169, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00470-01.pdf
- Pads
- 169
- SMD
- 13.0×13.0
- Boards
- 2
BGA-324_15.0x15.0mm_Layout18x18_P0.8mm_Ball0.5mm_Pad0.4mm_NSMD
Package_BGA
Altera U324, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00474-02.pdf
- Pads
- 324
- SMD
- 17.0×17.0
- Boards
- 2
SW_DIP_SPSTx05_Piano_10.8x14.26mm_W7.62mm_P2.54mm
Button_Switch_THT
5x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), body size 10.8x14.26mm
- Pads
- 10
- THT
- 13.1×14.9
- Boards
- 1
SW_DIP_SPSTx07_Piano_10.8x19.34mm_W7.62mm_P2.54mm
Button_Switch_THT
7x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), body size 10.8x19.34mm
- Pads
- 14
- THT
- 13.1×20.0
- Boards
- 1
DSUB-44-HD_Socket_Horizontal_P2.29x2.54mm_EdgePinOffset8.35mm_Housed_MountingHolesOffset10.89mm
Connector_Dsub
44-pin D-Sub connector, horizontal/angled (90 deg), THT-mount, socket (female), pitch 2.29x2.54mm, pin-PCB-offset 8.35mm, distance of mounting holes 47.1mm, distance of mounting holes to PCB edge 10.89mm, see https://disti-assets.s3.amazonaws.com/tonar/files/datasheets/16730.pdf
- Pads
- 45
- THT
- 54.1×22.6
- Boards
- 1
L_CommonMode_Toroid_Vertical_L19.3mm_W10.8mm_Px6.35mm_Py15.24mm_Bourns_8100
Inductor_THT
L_CommonMode_Toroid, Vertical series, Radial, pin pitch=6.35*15.24mm^2, length*width=19.304*10.795mm^2, Bourns, 8100, http://datasheet.octopart.com/8120-RC-Bourns-datasheet-10228452.pdf
- Pads
- 4
- THT
- 19.8×11.3
- Boards
- 1
R_LDR_12x10.8mm_P9.0mm_Vertical
OptoDevice
Resistor, LDR 12x10.8mm, see http://yourduino.com/docs/Photoresistor-5516-datasheet.pdf
- Pads
- 2
- THT
- 12.6×11.3
- Boards
- 1
LFBGA-100_10x10mm_Layout10x10_P0.8mm
Package_BGA
LFBGA-100, 10.0x10.0mm, 100 Ball, 10x10 Layout, 0.8mm Pitch, http://www.st.com/resource/en/datasheet/stm32f103tb.pdf#page=87
- Pads
- 100
- SMD
- 12.0×12.0
- Boards
- 1
LFBGA-144_10x10mm_Layout12x12_P0.8mm
Package_BGA
LFBGA-144, 10.0x10.0mm, 144 Ball, 12x12 Layout, 0.8mm Pitch, http://www.st.com/resource/en/datasheet/stm32f103ze.pdf#page=114
- Pads
- 144
- SMD
- 12.0×12.0
- Boards
- 1
TFBGA-121_10x10mm_Layout11x11_P0.8mm
Package_BGA
TFBGA-121, 10.0x10.0mm, 121 Ball, 11x11 Layout, 0.8mm Pitch, http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495
- Pads
- 121
- SMD
- 12.0×12.0
- Boards
- 1
TFBGA-216_13x13mm_Layout15x15_P0.8mm
Package_BGA
TFBGA-216, 13.0x13.0mm, 216 Ball, 15x15 Layout, 0.8mm Pitch, http://www.st.com/resource/en/datasheet/stm32f746zg.pdf#page=219
- Pads
- 216
- SMD
- 15.0×15.0
- Boards
- 1
TFBGA-265_14x14mm_Layout17x17_P0.8mm
Package_BGA
TFBGA-265, 14.0x14.0mm, 265 Ball, 17x17 Layout, 0.8mm Pitch, http://www.st.com/resource/en/datasheet/DM00387108.pdf#page=223
- Pads
- 265
- SMD
- 16.0×16.0
- Boards
- 1