Footprints
401 footprints matching “1EP”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.1mm_ThermalVias
Package_SO
HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l5973d.pdf)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 28
MSOP-10-1EP_3x3mm_P0.5mm_EP1.68x1.88mm
Package_SO
MSOP, 10 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/3805fg.pdf#page=18)
- Pads
- 11
- SMD
- 6.3×3.5
- Boards
- 28
HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.1mm
Package_SO
HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l5973d.pdf)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 25
TSSOP-16-1EP_4.4x5mm_P0.65mm
Package_SO
FE Package; 16-Lead Plastic TSSOP (4.4mm); Exposed Pad Variation BB; (see Linear Technology 1956f.pdf)
- Pads
- 17
- SMD
- 7.0×5.7
- Boards
- 25
QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm_ThermalVias
Package_DFN_QFN
QFN, 24 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=278)
- Pads
- 25
- SMD
- 5.2×5.2
- Boards
- 24
QFN-56-1EP_7x7mm_P0.4mm_EP4x4mm
Package_DFN_QFN
QFN, 56 Pin (https://www.espressif.com/sites/default/files/documentation/esp32-s2_datasheet_en.pdf#page=41)
- Pads
- 57
- SMD
- 8.2×8.2
- Boards
- 24
DFN-8-1EP_3x3mm_P0.5mm_EP1.66x2.38mm
Package_DFN_QFN
DD Package; 8-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_8_05-08-1698.pdf)
- Pads
- 9
- SMD
- 4.0×3.6
- Boards
- 23
QFN-32-1EP_5x5mm_P0.5mm_EP3.7x3.7mm
Package_DFN_QFN
QFN, 32 Pin (https://www.espressif.com/sites/default/files/documentation/0a-esp8285_datasheet_en.pdf)
- Pads
- 33
- SMD
- 6.2×6.2
- Boards
- 23
QFN-56-1EP_7x7mm_P0.4mm_EP3.2x3.2mm_ThermalVias
Package_DFN_QFN
QFN, 56 Pin (https://datasheets.raspberrypi.com/rp2040/rp2040-datasheet.pdf#page=607)
- Pads
- 57
- SMD
- 8.3×8.3
- Boards
- 21
DFN-8-1EP_2x2mm_P0.5mm_EP1.05x1.75mm
Package_DFN_QFN
DFN8 2x2, 0.5P; CASE 506CN (see ON Semiconductor 506CN.PDF)
- Pads
- 9
- SMD
- 2.8×2.5
- Boards
- 20
QFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm_ThermalVias
Package_DFN_QFN
QFN, 24 Pin (https://www.alldatasheet.com/datasheet-pdf/pdf/1159021/ALFA/AS3330.html)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 20
HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm
Package_SO
HTSOP, 8 Pin (https://media.digikey.com/pdf/Data%20Sheets/Rohm%20PDFs/BD9G341EFJ.pdf)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 20
QFN-48-1EP_7x7mm_P0.5mm_EP5.15x5.15mm
Package_DFN_QFN
QFN, 48 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_48_05-08-1704.pdf)
- Pads
- 49
- SMD
- 8.3×8.3
- Boards
- 19
DFN-8-1EP_3x2mm_P0.5mm_EP1.75x1.45mm
Package_DFN_QFN
8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 9
- SMD
- 4.2×2.6
- Boards
- 18
Nordic_AQFN-73-1EP_7x7mm_P0.5mm
Package_DFN_QFN
http://infocenter.nordicsemi.com/index.jsp?topic=%2Fcom.nordic.infocenter.nrf52%2Fdita%2Fnrf52%2Fchips%2Fnrf52840.html
- Pads
- 74
- SMD
- 9.0×9.0
- Boards
- 18
QFN-40-1EP_5x5mm_P0.4mm_EP3.6x3.6mm
Package_DFN_QFN
QFN, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=297)
- Pads
- 41
- SMD
- 6.2×6.2
- Boards
- 18
WSON-10-1EP_2.5x2.5mm_P0.5mm_EP1.2x2mm
Package_SON
WSON, 10 Pin (http://www.ti.com/lit/gpn/tps63030#page=24)
- Pads
- 11
- SMD
- 3.8×3.0
- Boards
- 18
DFN-10-1EP_3x3mm_P0.5mm_EP1.65x2.38mm
Package_DFN_QFN
DFN, 10 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/lt3471.pdf#page=15)
- Pads
- 11
- SMD
- 4.3×3.5
- Boards
- 17
OnSemi_XDFN4-1EP_1.0x1.0mm_EP0.52x0.52mm
Package_DFN_QFN
XDFN4 footprint (as found on the https://www.onsemi.com/pub/Collateral/NCP115-D.PDF)
- Pads
- 5
- SMD
- 1.7×1.5
- Boards
- 17
SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.81mm
Package_SO
SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 17
VSON-10-1EP_3x3mm_P0.5mm_EP1.65x2.4mm_ThermalVias
Package_SON
VSON 10 Thermal on 11 3x3mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument
- Pads
- 11
- SMD
- 4.3×4.3
- Boards
- 17
HTSSOP-56-1EP_6.1x14mm_P0.5mm_EP3.61x6.35mm
Package_SO
HTSSOP56: plastic thin shrink small outline package http://www.ti.com/lit/ds/symlink/drv8301.pdf
- Pads
- 57
- SMD
- 9.6×14.6
- Boards
- 16
QFN-16-1EP_4x4mm_P0.65mm_EP2.5x2.5mm
Package_DFN_QFN
QFN, 16 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=266)
- Pads
- 17
- SMD
- 5.2×5.2
- Boards
- 15
QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm
Package_DFN_QFN
QFN, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00002164B.pdf#page=68)
- Pads
- 33
- SMD
- 6.3×6.3
- Boards
- 15