Footprints

675 footprints matching “LEAD”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

675 footprints · page 2 of 29

Matched by name and keywords. Search by meaning instead

QFN-32-1EP_5x5mm_P0.5mm_EP3.45x3.45mm

FP3D

Package_DFN_QFN

QFN, 32 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_32_05-08-1693.pdf)

Pads
33
SMD
6.3×6.3
Boards
176

QFN-28-1EP_5x5mm_P0.5mm_EP3.35x3.35mm

FP3D

Package_DFN_QFN

QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=283)

Pads
29
SMD
6.2×6.2
Boards
175

DIP-28_W15.24mm

FP3D

Package_DIP

28-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils)

Pads
28
THT
17.3×36.1
Boards
172

DIP-28_W15.24mm_Socket

FP3D

Package_DIP

28-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket

Pads
28
THT
18.3×36.2
Boards
133

DIP-6_W7.62mm

FP3D

Package_DIP

6-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads
6
THT
9.7×8.1
Boards
119

LGA-14_3x2.5mm_P0.5mm_LayoutBorder3x4y

FP3D

Package_LGA

LGA, 14 Pin (https://www.st.com/resource/en/datasheet/lsm6ds3tr-c.pdf)

Pads
14
SMD
3.5×3.0
Boards
118

TO-92_HandSolder

FP3D

Package_TO_SOT_THT

TO-92 leads molded, narrow, drill 0.75mm, handsoldering variant with enlarged pads (see NXP sot054_po.pdf)

Pads
3
THT
5.5×5.1
Boards
117

QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm

FP3D

Package_DFN_QFN

QFN, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=274)

Pads
21
SMD
5.2×5.2
Boards
115

TSSOP-8_3x3mm_P0.65mm

FP3D

Package_SO

TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf)

Pads
8
SMD
5.9×3.6
Boards
111

LQFP-144_20x20mm_P0.5mm

FP3D

Package_QFP

LQFP, 144 Pin (JEDEC MS-026 variation BFB, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=425)

Pads
144
SMD
23.3×23.3
Boards
104

DIP-20_W7.62mm_Socket_LongPads

FP3D

Package_DIP

20-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads
20
THT
10.7×26.0
Boards
100

TO-92L_Inline_Wide

FP3D

Package_TO_SOT_THT

TO-92L leads in-line (large body variant of TO-92), also known as TO-226, wide, drill 0.75mm (see https://www.diodes.com/assets/Package-Files/TO92L.pdf and http://www.ti.com/lit/an/snoa059/snoa059.pdf)

Pads
3
THT
7.1×4.6
Boards
100

DIP-18_W7.62mm

FP3D

Package_DIP

18-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads
18
THT
9.7×23.4
Boards
99

DIP-40_W15.24mm_Socket_LongPads

FP3D

Package_DIP

40-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket, LongPads

Pads
40
THT
18.3×51.4
Boards
99

WSON-6-1EP_2x2mm_P0.65mm_EP1x1.6mm

FP3D

Package_SON

WSON, 6 Pin (http://www.ti.com/lit/ds/symlink/tps61040.pdf#page=35)

Pads
7
SMD
2.7×2.5
Boards
94

SW_Tactile_SPST_NO_Straight_CK_PTS636Sx25SMTRLFS

FP3D

Button_Switch_SMD

Tactile switch, SPST, 6.0x3.5 mm, H2.5 mm, straight, NO, gull wing leads: https://www.ckswitches.com/media/2779/pts636.pdf

Pads
2
SMD
9.5×4.2
Boards
90

WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm

FP3D

Package_SON

8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf

Pads
9
SMD
3.2×2.5
Boards
87

TO-92L_HandSolder

FP3D

Package_TO_SOT_THT

TO-92L leads in-line (large body variant of TO-92), also known as TO-226, wide, drill 0.75mm, hand-soldering variant with enlarged pads (see https://www.diodes.com/assets/Package-Files/TO92L.pdf and http://www.ti.com/lit/an/snoa059/snoa059.pdf)

Pads
3
THT
5.5×5.1
Boards
85

DIP-20_W7.62mm_LongPads

FP3D

Package_DIP

20-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads
20
THT
10.5×25.9
Boards
84

DIP-32_W15.24mm

FP3D

Package_DIP

32-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils)

Pads
32
THT
17.3×41.2
Boards
82

DIP-24_W15.24mm

FP3D

Package_DIP

24-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils)

Pads
24
THT
17.3×31.0
Boards
80

DIP-28_W7.62mm_Socket

FP3D

Package_DIP

28-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket

Pads
28
THT
10.7×36.2
Boards
75

DIP-32_W15.24mm_Socket

FP3D

Package_DIP

32-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), Socket

Pads
32
THT
18.3×41.3
Boards
75

WSON-8-1EP_6x5mm_P1.27mm_EP3.4x4.3mm

FP3D

Package_SON

WSON, 8 Pin (http://www.winbond.com/resource-files/w25q32jv%20revg%2003272018%20plus.pdf (page 68))

Pads
9
SMD
6.7×5.5
Boards
68