Footprints
198 footprints matching “SOP”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SOP-4_4.4x2.6mm_P1.27mm
Package_SO
SOP, 4 Pin (http://www.vishay.com/docs/83510/tcmt1100.pdf)
- Pads
- 4
- SMD
- 8.5×3.1
- Boards
- 48
Texas_HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.95x4.9mm_Mask2.4x3.1mm_ThermalVias
Package_SO
8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf
- Pads
- 9
- SMD
- 8.4×5.5
- Boards
- 47
TSOP-II-44_10.16x18.41mm_P0.8mm
Package_SO
TSOP-II, 44 Pin (http://www.issi.com/WW/pdf/61-64C5128AL.pdf)
- Pads
- 44
- SMD
- 13.2×18.9
- Boards
- 47
QSOP-16_3.9x4.9mm_P0.635mm
Package_SO
QSOP, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0055.PDF)
- Pads
- 16
- SMD
- 7.4×5.4
- Boards
- 45
SOP-16_4.4x10.4mm_P1.27mm
Package_SO
SOP, 16 Pin (https://www.vishay.com/docs/83513/tcmd1000.pdf)
- Pads
- 16
- SMD
- 8.5×10.9
- Boards
- 45
SSOP-20_4.4x6.5mm_P0.65mm
Package_SO
SSOP, 20 Pin (https://www.jedec.org/system/files/docs/Mo-152c.pdf)
- Pads
- 20
- SMD
- 7.8×7.0
- Boards
- 39
TSSOP-48_6.1x12.5mm_P0.5mm
Package_SO
TSSOP, 48 Pin (JEDEC MO-153 Var ED https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 48
- SMD
- 9.4×13.0
- Boards
- 36
TSOP-I-48_18.4x12mm_P0.5mm
Package_SO
TSOP-I, 48 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation DD)
- Pads
- 48
- SMD
- 21.5×12.5
- Boards
- 35
SOP-4_3.8x4.1mm_P2.54mm
Package_SO
SOP, 4 Pin (https://www.littelfuse.com/assetdocs/littelfuse-integrated-circuits-cpc1017n-datasheet?assetguid=b4f177f1-629f-4104-97a5-8b8d709e83de)
- Pads
- 4
- SMD
- 7.5×4.6
- Boards
- 34
SSOP-8_3.9x5.05mm_P1.27mm
Package_SO
SSOP, 8 Pin (https://www.fujitsu.com/uk/Images/MB85RS16.pdf)
- Pads
- 8
- SMD
- 7.4×5.6
- Boards
- 34
SSOP-10-1EP_3.9x4.9mm_P1mm_EP2.1x3.3mm
Package_SO
SSOP, 10 Pin (http://download.py32.org/%E6%95%B0%E6%8D%AE%E6%89%8B%E5%86%8C/zh-CN/PY32F002A%20%E7%B3%BB%E5%88%97%E6%95%B0%E6%8D%AE%E6%89%8B%E5%86%8C_Rev1.0.pdf#page=44)
- Pads
- 11
- SMD
- 7.5×5.4
- Boards
- 33
SSOP-28_3.9x9.9mm_P0.635mm
Package_SO
SSOP28: plastic shrink small outline package; 28 leads; body width 3.9 mm; lead pitch 0.635; (see http://cds.linear.com/docs/en/datasheet/38901fb.pdf)
- Pads
- 28
- SMD
- 6.9×10.4
- Boards
- 33
TI_SO-PowerPAD-8
Package_SO
8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf)
- Pads
- 9
- SMD
- 8.0×5.4
- Boards
- 33
SSOP-24_3.9x8.7mm_P0.635mm
Package_SO
SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf)
- Pads
- 24
- SMD
- 6.9×9.3
- Boards
- 30
TSOP-5_1.65x3.05mm_P0.95mm
Package_SO
TSOP-5 package (comparable to TSOT-23), https://www.vishay.com/docs/71200/71200.pdf
- Pads
- 5
- SMD
- 3.5×3.5
- Boards
- 30
VSSOP-8_3x3mm_P0.65mm
Package_SO
VSSOP, 8 Pin (https://www.jedec.org/standards-documents/docs/mo-187-f)
- Pads
- 8
- SMD
- 6.4×3.5
- Boards
- 29
HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.1mm_ThermalVias
Package_SO
HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l5973d.pdf)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 28
MSOP-10-1EP_3x3mm_P0.5mm_EP1.68x1.88mm
Package_SO
MSOP, 10 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/3805fg.pdf#page=18)
- Pads
- 11
- SMD
- 6.3×3.5
- Boards
- 28
HSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.1mm
Package_SO
HSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l5973d.pdf)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 25
SSOP-10_3.9x4.9mm_P1.00mm
Package_SO
10-Lead SSOP, 3.9 x 4.9mm body, 1.00mm pitch (http://www.st.com/resource/en/datasheet/viper01.pdf)
- Pads
- 10
- SMD
- 6.7×5.4
- Boards
- 25
TSSOP-16-1EP_4.4x5mm_P0.65mm
Package_SO
FE Package; 16-Lead Plastic TSSOP (4.4mm); Exposed Pad Variation BB; (see Linear Technology 1956f.pdf)
- Pads
- 17
- SMD
- 7.0×5.7
- Boards
- 25
SSOP-16_4.4x5.2mm_P0.65mm
Package_SO
SSOP16: plastic shrink small outline package; 16 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot369-1_po.pdf)
- Pads
- 16
- SMD
- 7.3×5.8
- Boards
- 22
SSOP-8_3.95x5.21x3.27mm_P1.27mm
Package_SO
SSOP-8 3.95x5.21x3.27mm Pitch 1.27mm
- Pads
- 8
- SMD
- 7.2×5.7
- Boards
- 22
HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm
Package_SO
HTSOP, 8 Pin (https://media.digikey.com/pdf/Data%20Sheets/Rohm%20PDFs/BD9G341EFJ.pdf)
- Pads
- 9
- SMD
- 7.4×5.4
- Boards
- 20