Footprints
482 footprints matching “NO”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
UQFN-48-1EP_6x6mm_P0.4mm_EP4.45x4.45mm_ThermalVias
Package_DFN_QFN
UQFN, 48 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=347)
- Pads
- 49
- SMD
- 7.2×7.2
- Boards
- —
VQFN-12-1EP_4x4mm_P0.8mm_EP2.1x2.1mm
Package_DFN_QFN
VQFN, 12 Pin (https://www.mouser.ch/datasheet/2/268/EMC2301_2_3_5_Data_Sheet_DS20006532A-3443118.pdf)
- Pads
- 13
- SMD
- 5.2×5.2
- Boards
- —
VQFN-40-1EP_5x5mm_P0.4mm_EP3.7x3.7mm
Package_DFN_QFN
VQFN, 40 Pin (Based on JEDEC MO-220-K.01, variation VHHE-1, https://www.silabs.com/documents/public/data-sheets/efm32pg23-datasheet.pdf#page=89, https://www.jedec.org/system/files/docs/MO-220K01.pdf)
- Pads
- 41
- SMD
- 6.3×6.3
- Boards
- —
VQFN-40-1EP_5x5mm_P0.4mm_EP3.7x3.7mm_ThermalVias
Package_DFN_QFN
VQFN, 40 Pin (Based on JEDEC MO-220-K.01, variation VHHE-1, https://www.silabs.com/documents/public/data-sheets/efm32pg23-datasheet.pdf#page=89, https://www.jedec.org/system/files/docs/MO-220K01.pdf)
- Pads
- 41
- SMD
- 6.3×6.3
- Boards
- —
VQFN-48-1EP_7x7mm_P0.5mm_EP4.1x4.1mm
Package_DFN_QFN
VQFN, 48 Pin (http://www.ti.com/lit/ds/symlink/cc430f5137.pdf#page=128)
- Pads
- 49
- SMD
- 8.3×8.3
- Boards
- —
VQFN-68-1EP_8x8mm_P0.4mm_EP4.3x4.3mm
Package_DFN_QFN
VQFN, 68 Pin (https://ftdichip.com/wp-content/uploads/2025/09/DS_FT2233HP.pdf#page=49)
- Pads
- 69
- SMD
- 9.2×9.2
- Boards
- —
WDFN-8-1EP_4x3mm_P0.65mm_EP2.4x1.8mm_ThermalVias
Package_DFN_QFN
WDFN, 8 Pin (https://www.onsemi.com/pub/Collateral/509AF.PDF)
- Pads
- 9
- SMD
- 5.2×3.5
- Boards
- —
WQFN-20-1EP_4x4mm_P0.5mm_EP2.7x2.7mm_ThermalVias
Package_DFN_QFN
WQFN, 20 Pin (JEDEC MO-220 variation WGGD-5, custom Exposed Pad from Texas Instruments and Maxim, https://www.jedec.org/standards-documents/docs/mo-220-k01, https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF, https://www.ti.com/lit/ml/qfnd016s/qfnd016s.pdf, https://www.ti.com/lit/ds/symlink/tuss4470.pdf#page=44)
- Pads
- 21
- SMD
- 5.3×5.3
- Boards
- —
WQFN-38-1EP_5x7mm_P0.5mm_EP3.15x5.15mm
Package_DFN_QFN
WQFN, 38 Pin (JEDEC MO-220 variation WHKD (with exposed pad size from Linear Technology / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_38_05-08-1701.pdf)
- Pads
- 39
- SMD
- 6.2×8.2
- Boards
- —
WQFN-38-1EP_5x7mm_P0.5mm_EP3.15x5.15mm_ThermalVias
Package_DFN_QFN
WQFN, 38 Pin (JEDEC MO-220 variation WHKD (with exposed pad size from Linear Technology / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_38_05-08-1701.pdf)
- Pads
- 39
- SMD
- 6.2×8.2
- Boards
- —
LGA-16_4x4mm_P0.65mm_LayoutBorder4x4y
Package_LGA
LGA, 16 Pin (http://www.st.com/resource/en/datasheet/l3gd20.pdf)
- Pads
- 16
- SMD
- 4.5×4.5
- Boards
- —
Texas_SIL0010A_MicroSiP-10-1EP_3.8x3mm_P0.6mm_EP0.7x2.9mm
Package_LGA
Texas SIL0010A MicroSiP, 10 Pin (http://www.ti.com/lit/ml/mpds579b/mpds579b.pdf)
- Pads
- 11
- SMD
- 4.4×3.5
- Boards
- —
SIP4_Sharp-SSR_P7.62mm_Angled_NoHole
Package_SIP
SIP4 Footprint for SSR made by Sharp
- Pads
- 4
- THT
- 19.3×31.5
- Boards
- —
Analog_MSOP-12-16_3x4.039mm_P0.5mm
Package_SO
Analog MSOP, 12 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081847_b_ms16(12).pdf)
- Pads
- 12
- SMD
- 5.6×4.5
- Boards
- —
Microchip_USON-10-1EP_3x3mm_P0.5mm_EP1.8x2.5mm
Package_SON
Microchip USON, 10 Pin (https://ww1.microchip.com/downloads/aemDocuments/documents/OTH/ProductDocuments/DataSheets/20002281C.pdf#page=14)
- Pads
- 11
- SMD
- 4.2×3.5
- Boards
- —
Microchip_USON-10-1EP_3x3mm_P0.5mm_EP1.8x2.5mm_ThermalVias
Package_SON
Microchip USON, 10 Pin (https://ww1.microchip.com/downloads/aemDocuments/documents/OTH/ProductDocuments/DataSheets/20002281C.pdf#page=14)
- Pads
- 11
- SMD
- 4.2×3.5
- Boards
- —
Nexperia_HUSON-12_USON-12-1EP_1.35x2.5mm_P0.4mm_EP0.4x2mm
Package_SON
Nexperia HUSON-12 USON, 12 Pin (https://assets.nexperia.com/documents/data-sheet/IP4251_52_53_54-TTL.pdf)
- Pads
- 13
- SMD
- 2.6×3.0
- Boards
- —
Nexperia_HUSON-8_USON-8-1EP_1.35x1.7mm_P0.4mm_EP0.4x1.2mm
Package_SON
Nexperia HUSON-8 USON, 8 Pin (https://assets.nexperia.com/documents/data-sheet/IP4251_52_53_54-TTL.pdf)
- Pads
- 9
- SMD
- 2.6×2.2
- Boards
- —
Texas_R-PUSON-N14
Package_SON
USON, 14 Pin (https://www.ti.com/lit/ds/symlink/tpd6e05u06.pdf#page=28)
- Pads
- 14
- SMD
- 2.6×4.0
- Boards
- —
VSON-10-1EP_3x3mm_P0.5mm_EP1.2x2mm_ThermalVias
Package_SON
VSON, 10 Pin (http://rohmfs.rohm.com/en/products/databook/datasheet/ic/power/switching_regulator/bd8314nuv-e.pdf (Page 20))
- Pads
- 11
- SMD
- 4.3×3.5
- Boards
- —
WSON-10-1EP_4x4mm_P0.8mm_EP2.6x3mm
Package_SON
WSON, 10 Pin (https://www.ti.com/lit/ml/qfnd434a/qfnd434a.pdf)
- Pads
- 11
- SMD
- 5.3×4.5
- Boards
- —
WSON-10-1EP_4x4mm_P0.8mm_EP2.6x3mm_ThermalVias
Package_SON
WSON, 10 Pin (https://www.ti.com/lit/ml/qfnd434a/qfnd434a.pdf)
- Pads
- 11
- SMD
- 5.3×4.5
- Boards
- —
Relay_1-Form-A_Schrack-RYII_RM5mm
Relay_THT
Relay, 1-Form-A, Schrack-RYII, RM5mm, SPST-NO
- Pads
- 4
- THT
- 29.5×11.1
- Boards
- —
Relay_DPDT_Kemet_EC2_NJ
Relay_THT
Kemet signal relay, DPDT, non-latching, single coil latching, 2.8mm pin height, https://content.kemet.com/datasheets/KEM_R7002_EC2_EE2.pdf
- Pads
- 8
- THT
- 8.0×15.5
- Boards
- —
