Footprints

540 footprints matching “6mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

I need

Symbol Footprint 3D model

Footprints that come with a 3D model.

540 footprints · page 21 of 23

Matched by name and keywords. Search by meaning instead

QFN-38-1EP_4x6mm_P0.4mm_EP2.65x4.65mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 38 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_38_05-08-1750.pdf)

Pads: 39
SMD: 5.3×7.3
Boards: —

QFN-42-1EP_5x6mm_P0.4mm_EP3.7x4.7mm

FP3D

Package_DFN_QFN

QFN, 42 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/05081875_0_UHE42.pdf)

Pads: 43
SMD: 6.3×7.3
Boards: —

QFN-42-1EP_5x6mm_P0.4mm_EP3.7x4.7mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 42 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/05081875_0_UHE42.pdf)

Pads: 43
SMD: 6.3×7.3
Boards: —

Qorvo_TQFN66-48-1EP_6x6mm_P0.4mm_EP4.2x4.2mm

FP3D

Package_DFN_QFN

Qorvo TQFN66, 48 Pin (https://www.qorvo.com/products/d/da006805)

Pads: 49
SMD: 7.2×7.2
Boards: —

Qorvo_TQFN66-48-1EP_6x6mm_P0.4mm_EP4.2x4.2mm_ThermalVias

FP3D

Package_DFN_QFN

Qorvo TQFN66, 48 Pin (https://www.qorvo.com/products/d/da006805)

Pads: 49
SMD: 7.2×7.2
Boards: —

TDFN-8_1.4x1.6mm_P0.4mm

FP3D

Package_DFN_QFN

TDFN, 8 Pin (https://www.silabs.com/documents/public/data-sheets/si7210-datasheet.pdf)

Pads: 8
SMD: 2.7×2.1
Boards: —

Texas_RHH0036C_VQFN-36-1EP_6x6mm_P0.5mm_EP4.4x4.4mm

FP3D

Package_DFN_QFN

Texas RHH0036C VQFN, 36 Pin (http://www.ti.com/lit/ds/slvsba5d/slvsba5d.pdf#page=37)

Pads: 37
SMD: 7.3×7.3
Boards: —

Texas_RVC0020A_WQFN-20-1EP_3x4mm_P0.5mm_EP1.6x2.6mm

FP3D

Package_DFN_QFN

Texas RVC0020A WQFN, 20 Pin (https://www.ti.com/lit/ds/symlink/tps25810.pdf#page=35)

Pads: 21
SMD: 3.9×4.9
Boards: —

Texas_RVC0020A_WQFN-20-1EP_3x4mm_P0.5mm_EP1.6x2.6mm_ThermalVias

FP3D

Package_DFN_QFN

Texas RVC0020A WQFN, 20 Pin (https://www.ti.com/lit/ds/symlink/tps25810.pdf#page=35)

Pads: 21
SMD: 3.9×4.9
Boards: —

UQFN-48-1EP_6x6mm_P0.4mm_EP4.45x4.45mm_ThermalVias

FP3D

Package_DFN_QFN

UQFN, 48 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=347)

Pads: 49
SMD: 7.2×7.2
Boards: —

DIP-10_W10.16mm

FP3D

Package_DIP

10-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils)

Pads: 10
THT: 12.3×13.2
Boards: —

DIP-22_W10.16mm_LongPads

FP3D

Package_DIP

22-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads

Pads: 22
THT: 13.1×28.4
Boards: —

DIP-22_W10.16mm_SMDSocket_SmallPads

FP3D

Package_DIP

22-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), SMDSocket, SmallPads

Pads: 22
SMD: 13.2×28.6
Boards: —

DIP-22_W10.16mm_Socket_LongPads

FP3D

Package_DIP

22-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), Socket, LongPads

Pads: 22
THT: 13.2×28.6
Boards: —

DIP-24_W10.16mm_SMDSocket_SmallPads

FP3D

Package_DIP

24-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), SMDSocket, SmallPads

Pads: 24
SMD: 13.2×31.1
Boards: —

DIP-24_W10.16mm_Socket

FP3D

Package_DIP

24-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), Socket

Pads: 24
THT: 13.2×31.1
Boards: —

DIP-24_W10.16mm_Socket_LongPads

FP3D

Package_DIP

24-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), Socket, LongPads

Pads: 24
THT: 13.2×31.1
Boards: —

DIP-5-6_W10.16mm

FP3D

Package_DIP

5-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils)

Pads: 5
THT: 12.3×8.2
Boards: —

DIP-5-6_W10.16mm_LongPads

FP3D

Package_DIP

5-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads

Pads: 5
THT: 13.2×8.2
Boards: —

DIP-6_W10.16mm_LongPads

FP3D

Package_DIP

6-lead though-hole mounted DIP package, row spacing 10.16mm (400 mils), LongPads

Pads: 6
THT: 13.1×8.1
Boards: —

DIP-64_W22.86mm_SMDSocket_SmallPads

FP3D

Package_DIP

64-lead though-hole mounted DIP package, row spacing 22.86mm (900 mils), SMDSocket, SmallPads

Pads: 64
SMD: 25.9×81.9
Boards: —

Texas_SIL0010A_MicroSiP-10-1EP_3.8x3mm_P0.6mm_EP0.7x2.9mm

FP3D

Package_LGA

Texas SIL0010A MicroSiP, 10 Pin (http://www.ti.com/lit/ml/mpds579b/mpds579b.pdf)

Pads: 11
SMD: 4.4×3.5
Boards: —

HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.66x2.46mm

FP3D

Package_SO

HTSSOP, 16 Pin (http://www.ti.com/lit/ds/symlink/tps2660.pdf#page=48)

Pads: 17
SMD: 7.8×5.5
Boards: —

SOIC-5-6_4.4x3.6mm_P1.27mm

FP3D

Package_SO

SOIC, 5 Pin (JEDEC MO-155, variation AA, 2.50mm nominal body thickness, https://www.jedec.org/system/files/docs/Mo-155a.pdf)

Pads: 5
SMD: 8.4×4.1
Boards: —