Footprints

6,095 footprints matching “mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

6,095 footprints · page 229 of 254

Matched by name and keywords. Search by meaning instead

Mounting_Wuerth_WP-SMRA-D3.3mm_L7mm_7466300_Horizontal

FP3D

Mounting_Wuerth

Right-angle SMD mounting hardware, inside through hole 3.3mm, lenght 7mm, total height 5mm, Würth electronics 7466300 (https://www.we-online.com/components/products/datasheet/7466300.pdf)

Pads
1
SMD
7.5×5.7
Boards
—

Mounting_Wuerth_WP-SMRA-M3_L7mm_7466303_Horizontal

FP3D

Mounting_Wuerth

Right-angle SMD mounting Hardware, inside threaded M3, length 7m, total height 5mm, Würth electronics 7466303 (https://www.we-online.com/components/products/datasheet/7466303.pdf)

Pads
1
SMD
7.5×5.7
Boards
—

BMP

FP3D

muratovas-MAS_Package_nostd

surface-mounted straight pin header, 2x05, 1.27mm pitch, double rows

Pads
10
SMD
8.6×7.4
Boards
—

FPC_1x22_P0.5mm

FP3D

muratovas-MAS_Package_nostd

Molex FFC/FPC connector, 50 bottom-side contacts, 0.5mm pitch

Pads
22
SMD
11.5×3.6
Boards
—

FPC_1x30_P0.5mm

FP3D

muratovas-MAS_Package_nostd

Molex FFC/FPC connector, 30 bottom-side contacts, 0.5mm pitch

Pads
30
SMD
15.5×3.6
Boards
—

SMD-DIP-8_W9.53mm

FP3D

muratovas-MAS_Package_nostd

8-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils)

Pads
8
SMD
12.1×10.7
Boards
—

Texas_DPY0002A_0.6x1mm_P0.65mm

FP3D

muratovas-MAS_Package_nostd

X1SON 2 pin 0.6x1mm 0.375mm height package, https://www.ti.com/lit/ml/mpss034c/mpss034c.pdf, https://www.ti.com/lit/ds/symlink/tpd6e05u06.pdf

Pads
2
SMD
1.3×0.9
Boards
—

UDFN-6-1EP_2x2mm_P0.65mm_EP0.9x1.65mm

FP3D

muratovas-MAS_Package_nostd

UDFN, 6 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/6L_UDFN_2x2x0_6mm_HTA_C04-01156a.pdf)

Pads
7
SMD
3.0×2.5
Boards
—

BGA-84_10.5x13.0mm_Layout2x3x16_P0.8mm

FP3D

muratovas-MAS_Package_std

BGA-84,

Pads
90
SMD
11.0×15.0
Boards
—

L_0806_2.0x1.6mm

FP3D

muratovas-MAS_Package_std

Pads
2
SMD
2.8×2.0
Boards
—

L_Array_Concave_4x0402

FP3D

muratovas-MAS_Package_std

Chip Common Mode Choke Coil Arrays

Pads
8
SMD
2.0×2.5
Boards
—

LGA-12_2x2mm_P0.5mm

FP3D

muratovas-MAS_Package_std

LGA12

Pads
12
SMD
2.5×2.5
Boards
—

LQFP-128_14x20mm_P0.5mm

FP3D

muratovas-MAS_Package_std

LQFP, 128 Pin (https://www.nxp.com/docs/en/package-information/SOT425-1.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py

Pads
129
SMD
17.4×23.4
Boards
—

PinSocket_2x07_P1.27mm_End

FP3D

muratovas-MAS_Package_std

surface-mounted straight socket strip, 2x07, 1.27mm pitch, double cols (from Kicad 4.0.7!), script generated

Pads
14
SMD
3.2×9.5
Boards
—

QFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm

FP3D

muratovas-MAS_Package_std

QFN, 24 Pin (http://www.alfarzpp.lv/eng/sc/AS3330.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py

Pads
25
SMD
5.3×5.3
Boards
—

R_Shunt_Bourns_CSS2H-2512_6332Metric

FP3D

muratovas-MAS_Package_std

pad 3.4x1.8 mm

Pads
2
SMD
7.5×3.9
Boards
—

SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm

FP3D

muratovas-MAS_Package_std

SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29), generated with kicad-footprint-generator ipc_gullwing_generator.py

Pads
9
SMD
7.4×5.4
Boards
—

TQFP-128_14x14mm_P0.4mm_PAD

FP3D

muratovas-MAS_Package_std

TQFP128 14x14 / TQFP128 CASE 932BB (see ON Semiconductor 932BB.PDF)

Pads
129
SMD
16.9×16.9
Boards
—

R_LDR_11x9.4mm_P8.2mm_Vertical

FP3D

OptoDevice

Resistor, LDR 11x9.4mm

Pads
2
THT
12.6×9.9
Boards
—

R_LDR_D13.8mm_P9.0mm_Vertical

FP3D

OptoDevice

Resistor, diameter 13.8mm pitch 9mm, see http://yourduino.com/docs/Photoresistor-5516-datasheet.pdf

Pads
2
THT
14.3×14.3
Boards
—

R_LDR_D20mm_P17.5mm_Vertical

FP3D

OptoDevice

Resistor, LDR 20mm diameter, pin pitch 17.5mm, see http://yourduino.com/docs/Photoresistor-5516-datasheet.pdf

Pads
2
THT
20.5×20.5
Boards
—

Oscillator_SeikoEpson_SG-8002DB

FP3D

Oscillator

14-lead dip package, row spacing 7.62 mm (300 mils)

Pads
4
THT
9.8×20.4
Boards
—

Analog_BGA-165_11.9x16mm_Layout11x15_P1.0mm

FP3D

Package_BGA

Analog BGA-165 (Reference LTC DWG#05-08-1605 Rev B), 11.9x16.0mm, 165 Ball, 11x15 Layout, 1.0mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-bga/05081605_b_bga165.pdf

Pads
165
SMD
13.9×18.0
Boards
—

Analog_BGA-209_9.5x16mm_Layout11x19_P0.8mm

FP3D

Package_BGA

Analog BGA-209 (Reference LTC DWG#05-08-1561 Rev B), 9.5x16.0mm, 209 Ball, 11x19 Layout, 0.8mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-bga/05081561_bga209.pdf

Pads
209
SMD
11.5×18.0
Boards
—