Footprints
6,095 footprints matching “mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
TQFP-52-1EP_10x10mm_P0.65mm_EP6.5x6.5mm
Package_QFP
TQFP, 52 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_52_1.pdf)
- Pads
- 53
- SMD
- 13.3×13.3
- Boards
- —
TQFP-52-1EP_10x10mm_P0.65mm_EP6.5x6.5mm_ThermalVias
Package_QFP
TQFP, 52 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_52_1.pdf)
- Pads
- 53
- SMD
- 13.3×13.3
- Boards
- —
TQFP-64-1EP_10x10mm_P0.5mm_EP5.305x5.305mm
Package_QFP
TQFP, 64 Pin (https://www.esstech.com/wp-content/uploads/2022/09/ES9028PRO-Datasheet-v3.7.pdf#page=54)
- Pads
- 65
- SMD
- 13.5×13.5
- Boards
- —
TQFP-64-1EP_10x10mm_P0.5mm_EP5.305x5.305mm_ThermalVias
Package_QFP
TQFP, 64 Pin (https://www.esstech.com/wp-content/uploads/2022/09/ES9028PRO-Datasheet-v3.7.pdf#page=54)
- Pads
- 65
- SMD
- 13.5×13.5
- Boards
- —
TQFP-80_14x14mm_P0.65mm
Package_QFP
TQFP, 80 Pin (JEDEC MS-026 variation AEC, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=679)
- Pads
- 80
- SMD
- 17.3×17.3
- Boards
- —
TQFP-80-1EP_14x14mm_P0.65mm_EP9.5x9.5mm
Package_QFP
TQFP, 80 Pin (Based on JEDEC MS-026 variation AEC, 1.00mm body thickness, lead width / tolerances / custom Exposed Pad from Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_80_4.pdf)
- Pads
- 81
- SMD
- 17.4×17.4
- Boards
- —
TQFP-80-1EP_14x14mm_P0.65mm_EP9.5x9.5mm_ThermalVias
Package_QFP
TQFP, 80 Pin (Based on JEDEC MS-026 variation AEC, 1.00mm body thickness, lead width / tolerances / custom Exposed Pad from Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_80_4.pdf)
- Pads
- 81
- SMD
- 17.4×17.4
- Boards
- —
Sanyo_STK4xx-15_59.2x8.0mm_P2.54mm
Package_SIP
Sanyo SIP-15, 59.2mm x 8.0mm bosy size, STK-433E STK-435E STK-436E (http://datasheet.octopart.com/STK430-Sanyo-datasheet-107060.pdf)
- Pads
- 15
- THT
- 59.7×8.5
- Boards
- —
Sanyo_STK4xx-15_78.0x8.0mm_P2.54mm
Package_SIP
Sanyo SIP-15, 78.0mm x 8.0mm bosy size, STK-437E STK-439E STK-441E STK-443E (http://datasheet.octopart.com/STK430-Sanyo-datasheet-107060.pdf)
- Pads
- 15
- THT
- 78.5×8.5
- Boards
- —
SIP-9_21.54x3mm_P2.54mm
Package_SIP
SIP 9-pin ()
- Pads
- 9
- THT
- 22.3×3.5
- Boards
- —
SIP4_Sharp-SSR_P7.62mm_Angled_NoHole
Package_SIP
SIP4 Footprint for SSR made by Sharp
- Pads
- 4
- THT
- 19.3×31.5
- Boards
- —
Analog_MSOP-12-16_3x4.039mm_P0.5mm
Package_SO
Analog MSOP, 12 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081847_b_ms16(12).pdf)
- Pads
- 12
- SMD
- 5.6×4.5
- Boards
- —
HSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugUp
Package_SO
HSOP 11.0x15.9mm Pitch 0.65mm Slug Up (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf)
- Pads
- 36
- SMD
- 15.9×16.4
- Boards
- —
HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.66x2.46mm
Package_SO
HTSSOP, 16 Pin (http://www.ti.com/lit/ds/symlink/tps2660.pdf#page=48)
- Pads
- 17
- SMD
- 7.8×5.5
- Boards
- —
HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm
Package_SO
20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [HTSSOP], with thermal pad with vias
- Pads
- 21
- SMD
- 7.9×7.1
- Boards
- —
HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.75x3.43mm
Package_SO
HTSSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=37&zoom=160,-90,3)
- Pads
- 21
- SMD
- 7.8×7.0
- Boards
- —
HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x4.68mm
Package_SO
HTSSOP, 24 Pin (http://www.ti.com/lit/ds/symlink/tps703.pdf)
- Pads
- 25
- SMD
- 7.8×8.3
- Boards
- —
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- —
HTSSOP-38-1EP_6.1x12.5mm_P0.65mm_EP5.2x12.5mm_Mask3.39x6.35mm
Package_SO
HTSSOP, 38 Pin (https://www.ti.com/jp/lit/ml/pptd158c/pptd158c.pdf)
- Pads
- 39
- SMD
- 9.5×13.0
- Boards
- —
HTSSOP-38-1EP_6.1x12.5mm_P0.65mm_EP5.2x12.5mm_Mask3.39x6.35mm_ThermalVias
Package_SO
HTSSOP, 38 Pin (https://www.ti.com/jp/lit/ml/pptd158c/pptd158c.pdf)
- Pads
- 39
- SMD
- 9.5×13.0
- Boards
- —
Infineon_PG-DSO-20-U03_7.5x12.8mm
Package_SO
Infineon PG-DSO, 20 Pin (https://www.infineon.com/dgdl/Infineon-2ED1323S12P_2ED1324S12P-DataSheet-v01_01-EN.pdf?fileId=8ac78c8c869190210186e92f0f506d0c)
- Pads
- 20
- SMD
- 11.8×13.3
- Boards
- —
Infineon_PG-DSO-8-24_4x5mm
Package_SO
Infineon PG-DSO, 8 Pin (https://www.infineon.com/dgdl/Infineon-BSP752R-DS-v01_02-EN.pdf?fileId=db3a304316f112290116f233cbd271e9#page=17)
- Pads
- 8
- SMD
- 7.4×5.5
- Boards
- —
JEITA_SOIC-16_3.9x9.9mm_P1.27mm
Package_SO
JEITA SOIC, 16 Pin (JEITA/EIAJ ED-7311-19, variation 16-001-ABA, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=30)
- Pads
- 16
- SMD
- 7.7×10.4
- Boards
- —
MSOP-12-1EP_3x4.039mm_P0.65mm_EP1.651x2.845mm_ThermalVias
Package_SO
MSOP, 12 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-msop/05081666_g_mse12.pdf)
- Pads
- 13
- SMD
- 6.3×4.5
- Boards
- —