Footprints
6,095 footprints matching “mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
TSSOP-68_8x14mm_P0.4mm
Package_SO
TSSOP, 68 Pin (JEDEC MO-153 Var JD-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 68
- SMD
- 11.3×14.5
- Boards
- —
TSSOP-80_6.1x17mm_P0.4mm
Package_SO
TSSOP, 80 Pin (JEDEC MO-153 Var FF https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 80
- SMD
- 9.4×17.5
- Boards
- —
VSO-40_7.6x15.4mm_P0.762mm
Package_SO
VSO40: plastic very small outline package; 40 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot158-1_po.pdf)
- Pads
- 40
- SMD
- 13.1×16.1
- Boards
- —
VSO-56_11.1x21.5mm_P0.75mm
Package_SO
VSO56: plastic very small outline package; 56 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf)
- Pads
- 56
- SMD
- 16.6×22.2
- Boards
- —
Microchip_USON-10-1EP_3x3mm_P0.5mm_EP1.8x2.5mm
Package_SON
Microchip USON, 10 Pin (https://ww1.microchip.com/downloads/aemDocuments/documents/OTH/ProductDocuments/DataSheets/20002281C.pdf#page=14)
- Pads
- 11
- SMD
- 4.2×3.5
- Boards
- —
Microchip_USON-10-1EP_3x3mm_P0.5mm_EP1.8x2.5mm_ThermalVias
Package_SON
Microchip USON, 10 Pin (https://ww1.microchip.com/downloads/aemDocuments/documents/OTH/ProductDocuments/DataSheets/20002281C.pdf#page=14)
- Pads
- 11
- SMD
- 4.2×3.5
- Boards
- —
Nexperia_HUSON-12_USON-12-1EP_1.35x2.5mm_P0.4mm_EP0.4x2mm
Package_SON
Nexperia HUSON-12 USON, 12 Pin (https://assets.nexperia.com/documents/data-sheet/IP4251_52_53_54-TTL.pdf)
- Pads
- 13
- SMD
- 2.6×3.0
- Boards
- —
Nexperia_HUSON-8_USON-8-1EP_1.35x1.7mm_P0.4mm_EP0.4x1.2mm
Package_SON
Nexperia HUSON-8 USON, 8 Pin (https://assets.nexperia.com/documents/data-sheet/IP4251_52_53_54-TTL.pdf)
- Pads
- 9
- SMD
- 2.6×2.2
- Boards
- —
Texas_R-PWSON-N12_EP0.4x2mm
Package_SON
http://www.ti.com/lit/ds/symlink/tpd6f003.pdf
- Pads
- 13
- SMD
- 2.3×3.0
- Boards
- —
VSON-10-1EP_3x3mm_P0.5mm_EP1.2x2mm_ThermalVias
Package_SON
VSON, 10 Pin (http://rohmfs.rohm.com/en/products/databook/datasheet/ic/power/switching_regulator/bd8314nuv-e.pdf (Page 20))
- Pads
- 11
- SMD
- 4.3×3.5
- Boards
- —
WSON-10-1EP_4x4mm_P0.8mm_EP2.6x3mm
Package_SON
WSON, 10 Pin (https://www.ti.com/lit/ml/qfnd434a/qfnd434a.pdf)
- Pads
- 11
- SMD
- 5.3×4.5
- Boards
- —
WSON-10-1EP_4x4mm_P0.8mm_EP2.6x3mm_ThermalVias
Package_SON
WSON, 10 Pin (https://www.ti.com/lit/ml/qfnd434a/qfnd434a.pdf)
- Pads
- 11
- SMD
- 5.3×4.5
- Boards
- —
WSON-16_3.3x1.35_P0.4mm
Package_SON
WSON-16 3.3 x 1.35mm Pitch 0.4mm http://www.chip.tomsk.ru/chip/chipdoc.nsf/Package/C67E729A4D6C883A4725793E004C8739!OpenDocument
- Pads
- 17
- SMD
- 2.2×3.8
- Boards
- —
NEC_Molded_7x4x9mm
Package_TO_SOT_THT
Molded Japan Transistor Package 7x4x9mm^3, http://rtellason.com/transdata/2sb734.pdf
- Pads
- 3
- THT
- 7.5×4.5
- Boards
- —
SOD-70_P2.54mm
Package_TO_SOT_THT
Plastic near cylindrical package Sod-70 see: https://www.nxp.com/docs/en/data-sheet/KTY81_SER.pdf [StepUp generated footprint]
- Pads
- 2
- THT
- 5.1×4.3
- Boards
- —
SOD-70_P5.08mm
Package_TO_SOT_THT
Plastic near cylindrical package Sod-70 see: https://www.nxp.com/docs/en/data-sheet/KTY81_SER.pdf [StepUp generated footprint]
- Pads
- 2
- THT
- 6.8×4.3
- Boards
- —
TO-218-2_Vertical
Package_TO_SOT_THT
TO-218-2, Vertical, RM 10.95mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf
- Pads
- 2
- THT
- 15.4×5.4
- Boards
- —
TO-220-11_P3.4x5.08mm_StaggerEven_Lead4.58mm_Vertical
Package_TO_SOT_THT
TO-220-11, Vertical, RM 1.7mm, Multiwatt-11, staggered type-2, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf
- Pads
- 11
- THT
- 20.7×11.0
- Boards
- —
TO-220-5_P3.4x3.7mm_StaggerEven_Lead3.8mm_Vertical
Package_TO_SOT_THT
TO-220-5, Vertical, RM 1.7mm, Pentawatt, staggered type-2, see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-to-220/to-220_5_05-08-1421.pdf?domain=www.linear.com, https://www.diodes.com/assets/Package-Files/TO220-5.pdf
- Pads
- 5
- THT
- 10.5×9.6
- Boards
- —
TO-247-5_Vertical
Package_TO_SOT_THT
TO-247-5, Vertical, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf
- Pads
- 5
- THT
- 16.4×5.5
- Boards
- —
TO-251-2_Vertical
Package_TO_SOT_THT
TO-251-2, Vertical, RM 4.58mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf
- Pads
- 2
- THT
- 7.1×2.8
- Boards
- —
TO-251-2-1EP_Horizontal_TabDown
Package_TO_SOT_THT
TO-251-2, Horizontal, RM 4.58mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf
- Pads
- 3
- THT
- 7.1×11.9
- Boards
- —
TO-262-3-1EP_Horizontal_TabDown
Package_TO_SOT_THT
TO-262-3, Horizontal, RM 2.54mm, IIPAK, I2PAK, see http://www.onsemi.com/pub/Collateral/EN8586-D.PDF
- Pads
- 4
- THT
- 10.5×16.5
- Boards
- —
TO-262-5_Vertical
Package_TO_SOT_THT
TO-262-5, Vertical, RM 1.7mm, IIPAK, I2PAK, see http://pdf.datasheetcatalog.com/datasheet/irf/iris4011.pdf
- Pads
- 5
- THT
- 10.5×5.0
- Boards
- —