Footprints
616 footprints matching “1.0”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
L_Radial_D21.0mm_P15.24mm_Vishay_IHB-2
Inductor_THT
Inductor, Radial series, Radial, pin pitch=15.24mm, diameter=21mm, height=21.34mm, Vishay, IHB-2, http://www.vishay.com/docs/34015/ihb.pdf
- Pads
- 2
- THT
- 21.5×21.5
- Boards
- —
L_Radial_D21.0mm_P15.75mm_Vishay_IHB-2
Inductor_THT
Inductor, Radial series, Radial, pin pitch=15.75mm, diameter=21mm, height=21.34mm, Vishay, IHB-2, http://www.vishay.com/docs/34015/ihb.pdf
- Pads
- 2
- THT
- 21.5×21.5
- Boards
- —
L_Radial_D21.0mm_P19.00mm
Inductor_THT
Inductor, Radial series, Radial, pin pitch=19.00mm, diameter=21mm, height=21mm, http://www.abracon.com/Magnetics/radial/AIRD02.pdf
- Pads
- 2
- THT
- 21.7×21.7
- Boards
- —
LED_Rectangular_W5.0mm_H2.0mm_Horizontal_O1.27mm_Z1.0mm
LED_THT
LED, Rectangular, size 5.0x2.0mm, horizontal offset 1.27mm, z-position of LED center 1.0mm, 2 pins, generated by kicad-footprint-generator
- Pads
- 2
- THT
- 5.6×12.5
- Boards
- —
Analog_BGA-165_11.9x16mm_Layout11x15_P1.0mm
Package_BGA
Analog BGA-165 (Reference LTC DWG#05-08-1605 Rev B), 11.9x16.0mm, 165 Ball, 11x15 Layout, 1.0mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-bga/05081605_b_bga165.pdf
- Pads
- 165
- SMD
- 13.9×18.0
- Boards
- —
BGA-1023_33.0x33.0mm_Layout32x32_P1.0mm
Package_BGA
BGA-1023
- Pads
- 1023
- SMD
- 35.0×35.0
- Boards
- —
BGA-1156_35.0x35.0mm_Layout34x34_P1.0mm
Package_BGA
BGA-1156
- Pads
- 1156
- SMD
- 37.0×37.0
- Boards
- —
BGA-1295_37.5x37.5mm_Layout36x36_P1.0mm
Package_BGA
BGA-1295
- Pads
- 1295
- SMD
- 39.5×39.5
- Boards
- —
BGA-24_8x8mm_Layout5x5_P1.0mm
Package_BGA
BGA-24, 8x8mm, 24 Ball, 5x5 Layout, 1.0mm Pitch, https://www.infineon.com/assets/row/public/packages/73/package_outline_download/infineon-pg-bga-24-804-spo-pdf-package-en.pdf
- Pads
- 24
- SMD
- 10.0×10.0
- Boards
- —
BGA-256_11.0x11.0mm_Layout20x20_P0.5mm_Ball0.3mm_Pad0.25mm_NSMD
Package_BGA
Altera MBGA-256, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00348-01.pdf
- Pads
- 256
- SMD
- 13.0×13.0
- Boards
- —
BGA-324_19.0x19.0mm_Layout18x18_P1.0mm_Ball0.5mm_Pad0.4mm_NSMD
Package_BGA
BGA-324, https://www.altera.com/content/dam/altera-www/global/en_US/pdfs/literature/packaging/04r00233-03.pdf
- Pads
- 324
- SMD
- 21.0×21.0
- Boards
- —
BGA-625_21.0x21.0mm_Layout25x25_P0.8mm
Package_BGA
BGA-625
- Pads
- 625
- SMD
- 23.0×23.0
- Boards
- —
FB-BGA-484_23.0x23.0mm_Layout22x22_P1.0mm
Package_BGA
Xilinx FB-484, https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf
- Pads
- 484
- SMD
- 25.0×25.0
- Boards
- —
Texas_DSBGA-6_0.757x1.01mm_Layout2x3_P0.35mm
Package_BGA
Texas Instruments, DSBGA-6, 0.757x1.01mm, SMD, YKA0006 pad definition, 0.757x1.01mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, https://www.ti.com/lit/ds/symlink/tps62843.pdf
- Pads
- 6
- SMD
- 2.8×3.0
- Boards
- —
HSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugUp
Package_SO
HSOP 11.0x15.9mm Pitch 0.65mm Slug Up (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf)
- Pads
- 36
- SMD
- 15.9×16.4
- Boards
- —
TestPoint_Bridge_Pitch6.35mm_Drill1.3mm
TestPoint
wire loop as test point, pitch 6.35mm, hole diameter 1.3mm, wire diameter 1.0mm
- Pads
- 1
- THT
- 10.0×3.6
- Boards
- —