Footprints
675 footprints matching “LEAD”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
SMDIP-24_W7.62mm
Package_DIP
24-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)
- Pads
- 24
- SMD
- 10.1×31.0
- Boards
- —
SMDIP-24_W9.53mm
Package_DIP
24-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils)
- Pads
- 24
- SMD
- 12.0×31.0
- Boards
- —
SMDIP-28_W15.24mm
Package_DIP
28-lead surface-mounted (SMD) DIP package, row spacing 15.24mm (600 mils)
- Pads
- 28
- SMD
- 17.8×36.1
- Boards
- —
SMDIP-32_W11.48mm
Package_DIP
32-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)
- Pads
- 32
- SMD
- 14.0×41.2
- Boards
- —
SMDIP-32_W15.24mm
Package_DIP
32-lead surface-mounted (SMD) DIP package, row spacing 15.24mm (600 mils)
- Pads
- 32
- SMD
- 17.8×41.2
- Boards
- —
SMDIP-32_W7.62mm
Package_DIP
32-lead surface-mounted (SMD) DIP package, row spacing 7.62mm (300 mils)
- Pads
- 32
- SMD
- 10.1×41.2
- Boards
- —
SMDIP-32_W9.53mm
Package_DIP
32-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils)
- Pads
- 32
- SMD
- 12.0×41.2
- Boards
- —
SMDIP-4_W11.48mm
Package_DIP
4-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)
- Pads
- 4
- SMD
- 14.0×5.6
- Boards
- —
SMDIP-40_W15.24mm
Package_DIP
40-lead surface-mounted (SMD) DIP package, row spacing 15.24mm (600 mils)
- Pads
- 40
- SMD
- 17.8×51.3
- Boards
- —
SMDIP-40_W25.24mm
Package_DIP
40-lead surface-mounted (SMD) DIP package, row spacing 25.24mm (993 mils)
- Pads
- 40
- SMD
- 27.7×51.3
- Boards
- —
SMDIP-42_W15.24mm
Package_DIP
42-lead surface-mounted (SMD) DIP package, row spacing 15.24mm (600 mils)
- Pads
- 42
- SMD
- 17.8×53.8
- Boards
- —
SMDIP-48_W15.24mm
Package_DIP
48-lead surface-mounted (SMD) DIP package, row spacing 15.24mm (600 mils)
- Pads
- 48
- SMD
- 17.8×61.5
- Boards
- —
SMDIP-6_W11.48mm
Package_DIP
6-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)
- Pads
- 6
- SMD
- 14.0×8.1
- Boards
- —
SMDIP-64_W15.24mm
Package_DIP
64-lead surface-mounted (SMD) DIP package, row spacing 15.24mm (600 mils)
- Pads
- 64
- SMD
- 17.8×81.8
- Boards
- —
Toshiba_11-7A9
Package_DIP
Toshiba 11-7A9 package, like 6-lead dip package with missing pin 5, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S)
- Pads
- 5
- THT
- 9.8×8.2
- Boards
- —
LGA-16_4x4mm_P0.65mm_LayoutBorder4x4y
Package_LGA
LGA, 16 Pin (http://www.st.com/resource/en/datasheet/l3gd20.pdf)
- Pads
- 16
- SMD
- 4.5×4.5
- Boards
- —
Texas_SIL0010A_MicroSiP-10-1EP_3.8x3mm_P0.6mm_EP0.7x2.9mm
Package_LGA
Texas SIL0010A MicroSiP, 10 Pin (http://www.ti.com/lit/ml/mpds579b/mpds579b.pdf)
- Pads
- 11
- SMD
- 4.4×3.5
- Boards
- —
Microchip_PQFP-44_10x10mm_P0.8mm
Package_QFP
Microchip PQFP, 44 Pin (JEDEC MO-112 variation AA-2, Microchip and Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MO-112, https://ww1.microchip.com/downloads/aemDocuments/documents/OTH/ProductDocuments/DataSheets/20005418B.pdf#page=10, https://www.analog.com/media/en/technical-documentation/data-sheets/ad7722.pdf#page=23)
- Pads
- 44
- SMD
- 15.4×15.4
- Boards
- —
TQFP-44-1EP_10x10mm_P0.8mm_EP4.5x4.5mm_ThermalVias
Package_QFP
TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)
- Pads
- 45
- SMD
- 13.3×13.3
- Boards
- —
TQFP-80-1EP_14x14mm_P0.65mm_EP9.5x9.5mm
Package_QFP
TQFP, 80 Pin (Based on JEDEC MS-026 variation AEC, 1.00mm body thickness, lead width / tolerances / custom Exposed Pad from Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_80_4.pdf)
- Pads
- 81
- SMD
- 17.4×17.4
- Boards
- —
TQFP-80-1EP_14x14mm_P0.65mm_EP9.5x9.5mm_ThermalVias
Package_QFP
TQFP, 80 Pin (Based on JEDEC MS-026 variation AEC, 1.00mm body thickness, lead width / tolerances / custom Exposed Pad from Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_80_4.pdf)
- Pads
- 81
- SMD
- 17.4×17.4
- Boards
- —
HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm
Package_SO
20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [HTSSOP], with thermal pad with vias
- Pads
- 21
- SMD
- 7.9×7.1
- Boards
- —
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- —
PowerIntegrations_SO-8B
Package_SO
Power-Integrations variant of 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf
- Pads
- 7
- SMD
- 7.4×5.4
- Boards
- —