Footprints
401 footprints matching “0.5”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
QFN-32-1EP_5x5mm_P0.5mm_EP3.7x3.7mm
Package_DFN_QFN
QFN, 32 Pin (https://www.espressif.com/sites/default/files/documentation/0a-esp8285_datasheet_en.pdf)
- Pads
- 33
- SMD
- 6.2×6.2
- Boards
- 23
TerminalBlock_Phoenix_MKDS-1,5-6-5.08_1x06_P5.08mm_Horizontal
TerminalBlock_Phoenix
Terminal Block Phoenix MKDS-1,5-6-5.08, 6 pins, pitch 5.08mm, size 30.5x9.8mm, drill diameter 1.3mm, pad diameter 2.6mm, http://www.farnell.com/datasheets/100425.pdf
- Pads
- 6
- THT
- 31.5×10.8
- Boards
- 23
LQFP-176_24x24mm_P0.5mm
Package_QFP
LQFP, 176 Pin (https://www.st.com/resource/en/datasheet/stm32f207vg.pdf#page=163)
- Pads
- 176
- SMD
- 27.4×27.4
- Boards
- 22
Texas_S-PVSON-N10_ThermalVias
Package_SON
3x3mm Body, 0.5mm Pitch, S-PVSON-N10, DRC, http://www.ti.com/lit/ds/symlink/tps61201.pdf
- Pads
- 11
- SMD
- 4.3×4.3
- Boards
- 21
DFN-8-1EP_2x2mm_P0.5mm_EP1.05x1.75mm
Package_DFN_QFN
DFN8 2x2, 0.5P; CASE 506CN (see ON Semiconductor 506CN.PDF)
- Pads
- 9
- SMD
- 2.8×2.5
- Boards
- 20
QFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm_ThermalVias
Package_DFN_QFN
QFN, 24 Pin (https://www.alldatasheet.com/datasheet-pdf/pdf/1159021/ALFA/AS3330.html)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 20
QFN-48-1EP_7x7mm_P0.5mm_EP5.15x5.15mm
Package_DFN_QFN
QFN, 48 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_48_05-08-1704.pdf)
- Pads
- 49
- SMD
- 8.3×8.3
- Boards
- 19
TestPoint_Bridge_Pitch2.0mm_Drill0.7mm
TestPoint
wire loop as test point, pitch 2.0mm, hole diameter 0.7mm, wire diameter 0.5mm
- Pads
- 1
- THT
- 4.4×2.4
- Boards
- 19
DFN-8-1EP_3x2mm_P0.5mm_EP1.75x1.45mm
Package_DFN_QFN
8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 9
- SMD
- 4.2×2.6
- Boards
- 18
Nordic_AQFN-73-1EP_7x7mm_P0.5mm
Package_DFN_QFN
http://infocenter.nordicsemi.com/index.jsp?topic=%2Fcom.nordic.infocenter.nrf52%2Fdita%2Fnrf52%2Fchips%2Fnrf52840.html
- Pads
- 74
- SMD
- 9.0×9.0
- Boards
- 18
ST_HLGA-10_2x2mm_P0.5mm_LayoutBorder3x2y
Package_LGA
ST HLGA, 10 Pin (https://www.st.com/resource/en/datasheet/lps22hh.pdf#page=55)
- Pads
- 10
- SMD
- 2.5×2.5
- Boards
- 18
WSON-10-1EP_2.5x2.5mm_P0.5mm_EP1.2x2mm
Package_SON
WSON, 10 Pin (http://www.ti.com/lit/gpn/tps63030#page=24)
- Pads
- 11
- SMD
- 3.8×3.0
- Boards
- 18
Hirose_FH12-30S-0.5SH_1x30-1MP_P0.50mm_Horizontal
Connector_FFC-FPC
Hirose FH12, FFC/FPC connector, FH12-30S-0.5SH, 30 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/)
- Pads
- 31
- SMD
- 21.1×7.9
- Boards
- 17
DFN-10-1EP_3x3mm_P0.5mm_EP1.65x2.38mm
Package_DFN_QFN
DFN, 10 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/lt3471.pdf#page=15)
- Pads
- 11
- SMD
- 4.3×3.5
- Boards
- 17
OnSemi_XDFN4-1EP_1.0x1.0mm_EP0.52x0.52mm
Package_DFN_QFN
XDFN4 footprint (as found on the https://www.onsemi.com/pub/Collateral/NCP115-D.PDF)
- Pads
- 5
- SMD
- 1.7×1.5
- Boards
- 17
VSON-10-1EP_3x3mm_P0.5mm_EP1.65x2.4mm_ThermalVias
Package_SON
VSON 10 Thermal on 11 3x3mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument
- Pads
- 11
- SMD
- 4.3×4.3
- Boards
- 17
HTSSOP-56-1EP_6.1x14mm_P0.5mm_EP3.61x6.35mm
Package_SO
HTSSOP56: plastic thin shrink small outline package http://www.ti.com/lit/ds/symlink/drv8301.pdf
- Pads
- 57
- SMD
- 9.6×14.6
- Boards
- 16
Hirose_FH12-20S-0.5SH_1x20-1MP_P0.50mm_Horizontal
Connector_FFC-FPC
Hirose FH12, FFC/FPC connector, FH12-20S-0.5SH, 20 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/)
- Pads
- 21
- SMD
- 16.1×7.9
- Boards
- 15
QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm
Package_DFN_QFN
QFN, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00002164B.pdf#page=68)
- Pads
- 33
- SMD
- 6.3×6.3
- Boards
- 15
LQFP-48-1EP_7x7mm_P0.5mm_EP3.6x3.6mm
Package_QFP
LQFP, 48 Pin (http://www.analog.com/media/en/technical-documentation/data-sheets/LTC7810.pdf)
- Pads
- 49
- SMD
- 10.3×10.3
- Boards
- 15
C_Disc_D10.5mm_W5.0mm_P10.00mm
Capacitor_THT
C, Disc series, Radial, pin pitch=10.00mm, diameter*width=10.5*5.0mm^2, Capacitor, http://www.vishay.com/docs/28535/vy2series.pdf
- Pads
- 2
- THT
- 12.5×5.5
- Boards
- 14
QFN-28-1EP_5x5mm_P0.5mm_EP3.35x3.35mm_ThermalVias
Package_DFN_QFN
QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=283)
- Pads
- 29
- SMD
- 6.2×6.2
- Boards
- 14
VSON-10-1EP_3x3mm_P0.5mm_EP1.65x2.4mm
Package_SON
VSON 10 Thermal on 11 3x3mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument
- Pads
- 11
- SMD
- 4.3×4.3
- Boards
- 14
R_Axial_DIN0309_L9.0mm_D3.2mm_P5.08mm_Vertical
Resistor_THT
Resistor, Axial_DIN0309 series, Axial, Vertical, pin pitch=5.08mm, 0.5W = 1/2W, length*diameter=9*3.2mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf
- Pads
- 2
- THT
- 8.0×3.7
- Boards
- 14