Footprints

2,573 footprints matching “7”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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2,573 footprints · page 3 of 108

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DIP-14_W7.62mm_Socket_LongPads

FP3D

Package_DIP

14-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 14
THT: 10.7×18.4
Boards: 225

CP_Radial_D4.0mm_P1.50mm

FP3D

Capacitor_THT

CP, Radial series, Radial, pin pitch=1.50mm, diameter=4mm, height=7mm, Electrolytic Capacitor

Pads: 2
THT: 4.5×4.5
Boards: 209

DIP-14_W7.62mm_LongPads

FP3D

Package_DIP

14-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads: 14
THT: 10.5×18.3
Boards: 205

PinSocket_1x07_P2.54mm_Vertical

FP3D

Connector_PinSocket_2.54mm

Through hole straight socket strip, 1x07, 2.54mm pitch, single row (from Kicad 4.0.7), script generated

Pads: 7
THT: 3.5×18.8
Boards: 200

DIP-16_W7.62mm_LongPads

FP3D

Package_DIP

16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads: 16
THT: 10.5×20.8
Boards: 199

PinHeader_1x02_P1.27mm_Vertical

FP3D

Connector_PinHeader_1.27mm

Through hole straight pin header, 1x02, 1.27mm pitch, single row

Pads: 2
THT: 3.1×3.5
Boards: 195

DIP-16_W7.62mm_Socket_LongPads

FP3D

Package_DIP

16-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 16
THT: 10.7×20.9
Boards: 189

R_Axial_DIN0204_L3.6mm_D1.6mm_P2.54mm_Vertical

FP3D

Resistor_THT

Resistor, Axial_DIN0204 series, Axial, Vertical, pin pitch=2.54mm, 0.167W, length*diameter=3.6*1.6mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf

Pads: 2
THT: 4.5×2.1
Boards: 187

SOIC-28W_7.5x17.9mm_P1.27mm

FP3D

Package_SO

SOIC, 28 Pin (JEDEC MS-013AE, https://www.analog.com/media/en/package-pcb-resources/package/35833120341221rw_28.pdf)

Pads: 28
SMD: 11.9×18.4
Boards: 186

LQFP-32_7x7mm_P0.8mm

FP3D

Package_QFP

LQFP, 32 Pin (https://www.nxp.com/docs/en/package-information/SOT358-1.pdf)

Pads: 32
SMD: 10.4×10.4
Boards: 185

D_A-405_P7.62mm_Horizontal

FP3D

Diode_THT

Diode, A-405 series, Axial, Horizontal, pin pitch=7.62mm, length*diameter=5.2*2.7mm^2, http://www.diodes.com/_files/packages/A-405.pdf

Pads: 2
THT: 9.9×3.2
Boards: 181

DIP-8_W7.62mm_Socket_LongPads

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads

Pads: 8
THT: 10.7×10.8
Boards: 178

PinHeader_2x05_P1.27mm_Vertical

FP3D

Connector_PinHeader_1.27mm

Through hole straight pin header, 2x05, 1.27mm pitch, double rows

Pads: 10
THT: 4.4×7.4
Boards: 172

USB_Micro-B_Molex_47346-0001

FP3D

Connector_USB

Micro USB B receptable with flange, bottom-mount, SMD, right-angle (http://www.molex.com/pdm_docs/sd/473460001_sd.pdf)

Pads: 6
SMD: 9.4×6.5
Boards: 169

TSSOP-28_4.4x9.7mm_P0.65mm

FP3D

Package_SO

TSSOP, 28 Pin (JEDEC MO-153 Var AE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 28
SMD: 7.7×10.2
Boards: 164

SOIC-18W_7.5x11.6mm_P1.27mm

FP3D

Package_SO

SOIC, 18 Pin (JEDEC MS-013AB, https://www.analog.com/media/en/package-pcb-resources/package/33254132129439rw_18.pdf)

Pads: 18
SMD: 11.9×12.1
Boards: 163

VSSOP-8_2.3x2mm_P0.5mm

FP3D

Package_SO

VSSOP, 8 Pin (https://www.jedec.org/standards-documents/docs/mo-187-f)

Pads: 8
SMD: 4.6×2.5
Boards: 156

D_1206_3216Metric_Pad1.42x1.75mm_HandSolder

FP3D

Diode_SMD

Diode SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC-7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)

Pads: 2
SMD: 4.9×2.3
Boards: 148

SO-14_3.9x8.65mm_P1.27mm

FP3D

Package_SO

SO, 14 Pin (https://www.st.com/resource/en/datasheet/l6491.pdf)

Pads: 14
SMD: 7.4×9.2
Boards: 147

PinHeader_2x07_P2.54mm_Vertical

FP3D

Connector_PinHeader_2.54mm

Through hole straight pin header, 2x07, 2.54mm pitch, double rows

Pads: 14
THT: 6.1×18.8
Boards: 143

SO-16_3.9x9.9mm_P1.27mm

FP3D

Package_SO

SO, 16 Pin (https://www.nxp.com/docs/en/package-information/SOT109-1.pdf)

Pads: 16
SMD: 7.4×10.4
Boards: 141

SOIC-24W_7.5x15.4mm_P1.27mm

FP3D

Package_SO

SOIC, 24 Pin (JEDEC MS-013AD, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_wide-rw/RW_24.pdf)

Pads: 24
SMD: 11.9×15.9
Boards: 141

SOIC-8_5.3x5.3mm_P1.27mm

FP3D

Package_SO

SOIC, 8 Pin (JEITA/EIAJ ED-7311-19 variation 08-001-BBA and Atmel/Microchip, 208 mils width, https://www.jeita.or.jp/japanese/standard/book/ED-7311-19/#target/page_no=21, https://ww1.microchip.com/downloads/en/DeviceDoc/20005045C.pdf#page=23, https://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=162)

Pads: 8
SMD: 9.3×5.8
Boards: 139

CP_EIA-7343-31_Kemet-D

FP3D

Capacitor_Tantalum_SMD

Tantalum Capacitor SMD Kemet-D (7343-31 Metric), IPC-7352 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf)

Pads: 2
SMD: 8.8×4.8
Boards: 137