129 footprints matching “JEDEC”

Package_SO

SOIC, 14 Pin (JEDEC MS-013AF, https://www.analog.com/media/en/package-pcb-resources/package/54614177245586rw_14.pdf)

Pads

14

SMD

11.9×9.5

Boards

5

Package_QFP

TQFP, 128 Pin (JEDEC MS-026 variation AEE, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026)

Pads

128

SMD

17.3×17.3

Boards

4

Package_QFP

TQFP, 80 Pin (JEDEC MS-026 variation ADD, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/aemDocuments/documents/package-outline-drawings/c04-00092c.pdf)

Pads

80

SMD

15.3×15.3

Boards

4

Package_SO

SOIC, 20 Pin (JEDEC MS-013AD, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_wide-rw/RI_20_1.pdf)

Pads

20

SMD

11.8×15.9

Boards

4

Package_QFP

PQFP, 80 Pin (JEITA/EIAJ ED-7311A (variation 80-001-PB) / JEDEC MS-022 (variation GB-2), 2.70mm body thickness, https://www.jeita.or.jp/japanese/standard/book/ED-7311A/#target/page_no=91, https://www.jedec.org/document_search?search_api_views_fulltext=MS-022)

Pads

80

SMD

18.5×24.5

Boards

3

Package_QFP

TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)

Pads

45

SMD

13.3×13.3

Boards

3

Package_SO

TSSOP, 30 Pin (JEDEC MO-153 Var BC-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads

30

SMD

7.7×8.3

Boards

3

Package_TO_SOT_SMD

SOT, 8 Pin (JEDEC MO-203, variant BA, https://www.jedec.org/document_search?search_api_views_fulltext=MO-203, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-sc-70/sot_8_05-08-1639.pdf)

Pads

8

SMD

2.9×2.2

Boards

3

Package_QFP

TQFP, 48 Pin (JEDEC MS-026 variation ABC, 1.00mm body thickness, custom Exposed Pad from Microchip and Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=664, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_48_4.pdf)

Pads

49

SMD

10.3×10.3

Boards

2

Package_SO

TSSOP, 20 Pin (JEDEC MO-153 Var BA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads

20

SMD

7.7×5.5

Boards

2

Package_SO

TSSOP, 24 Pin (JEDEC MO-153 Var CA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads

24

SMD

7.7×5.5

Boards

2

Package_SO

TSSOP, 28 Pin (JEDEC MO-153 Var DB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads

28

SMD

9.4×10.2

Boards

2

Package_SO

TSSOP, 56 Pin (JEDEC MO-153 Var EE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads

56

SMD

9.4×14.5

Boards

2

Diode_SMD

STMicroelectronics SMC (JEDEC DO-214-D, variant AB), https://www.st.com/resource/en/datasheet/sm15t36a.pdf#page=7

Pads

2

SMD

8.8×6.4

Boards

1

Package_DFN_QFN

WQFN, 20 Pin (JEDEC MO-220 variation WGGD-5, custom Exposed Pad from Texas Instruments and Maxim, https://www.jedec.org/standards-documents/docs/mo-220-k01, https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF, https://www.ti.com/lit/ml/qfnd016s/qfnd016s.pdf, https://www.ti.com/lit/ds/symlink/tuss4470.pdf#page=44)

Pads

21

SMD

5.3×5.3

Boards

1

Package_QFP

TQFP, 100 Pin (JEDEC MS-026 variation ADE, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=685)

Pads

100

SMD

15.3×15.3

Boards

1

Package_QFP

TQFP, 64 Pin (JEDEC MS-026 variation ABD, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfpsu/su_64_1.pdf)

Pads

64

SMD

10.3×10.3

Boards

1

Package_DFN_QFN

Maxim WSON, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tdfn-ep/21-0174.pdf, https://www.analog.com/media/en/package-pcb-resources/land-pattern/tdfn-ep/90-0091.pdf)

Pads

9

SMD

4.1×2.5

Boards

—

Package_DFN_QFN

UQFN, 32 Pin (JEDEC MO-248 variation UHHD, 0.65mm maximum overall height, https://www.jedec.org/document_search?search_api_views_fulltext=MO-248)

Pads

32

SMD

6.2×6.2

Boards

—

Package_DFN_QFN

VQFN, 40 Pin (Based on JEDEC MO-220-K.01, variation VHHE-1, https://www.silabs.com/documents/public/data-sheets/efm32pg23-datasheet.pdf#page=89, https://www.jedec.org/system/files/docs/MO-220K01.pdf)

Pads

41

SMD

6.3×6.3

Boards

—

Package_DFN_QFN

VQFN, 40 Pin (Based on JEDEC MO-220-K.01, variation VHHE-1, https://www.silabs.com/documents/public/data-sheets/efm32pg23-datasheet.pdf#page=89, https://www.jedec.org/system/files/docs/MO-220K01.pdf)

Pads

41

SMD

6.3×6.3

Boards

—

Package_DFN_QFN

WQFN, 20 Pin (JEDEC MO-220 variation WGGD-5, custom Exposed Pad from Texas Instruments and Maxim, https://www.jedec.org/standards-documents/docs/mo-220-k01, https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF, https://www.ti.com/lit/ml/qfnd016s/qfnd016s.pdf, https://www.ti.com/lit/ds/symlink/tuss4470.pdf#page=44)

Pads

21

SMD

5.3×5.3

Boards

—

Package_DFN_QFN

WQFN, 38 Pin (JEDEC MO-220 variation WHKD (with exposed pad size from Linear Technology / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_38_05-08-1701.pdf)

Pads

39

SMD

6.2×8.2

Boards

—

Package_DFN_QFN

WQFN, 38 Pin (JEDEC MO-220 variation WHKD (with exposed pad size from Linear Technology / Analog Devices), https://www.jedec.org/document_search?search_api_views_fulltext=MO-220, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_38_05-08-1701.pdf)

Pads

39

SMD

6.2×8.2

Boards

—