Footprints

58 footprints matching “flat

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

58 footprints · page 3 of 3

Matched by name and keywords. Search by meaning instead

IXYS_SMD-8_6.3x9.7mm_P2.54mm

FP3D

Package_DIP

IXYS Flatpak, 8 Pin (https://www.littelfuse.com/media?resourcetype=datasheets&itemid=996c6e8f-cc1b-44f6-811e-251c6e004c56&filename=littelfuse-integrated-circuits-loc112-datasheet)

Pads
8
SMD
11.1×10.2
Boards

TQFP-44-1EP_10x10mm_P0.8mm_EP4.5x4.5mm_ThermalVias

FP3D

Package_QFP

TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)

Pads
45
SMD
13.3×13.3
Boards

PowerIntegrations_eSIP-7C

FP3D

Package_SIP

eSIP-7C Vertical Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf

Pads
6
THT
10.5×5.8
Boards

PowerIntegrations_eSIP-7F

FP3D

Package_SIP

eSIP-7F Flat Package with Heatsink Tab https://ac-dc.power.com/sites/default/files/product-docs/linkswitch-ph_family_datasheet.pdf

Pads
6
THT
14.0×10.7
Boards

PowerIntegrations_eSOP-12B

FP3D

Package_SO

eSOP-12B SMT Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf

Pads
12
SMD
13.6×11.2
Boards

TO-92_Inline_W4.0mm_Horizontal_FlatSideUp

FP3D

Package_TO_SOT_THT

TO-92 horizontal, leads in-line, narrow, oval pads, drill 0.75mm (see NXP sot054_po.pdf)

Pads
3
THT
5.1×10.1
Boards

TO-92_W4.0mm_StaggerEven_Horizontal_FlatSideDown

FP3D

Package_TO_SOT_THT

TO-92 horizontal, leads molded, narrow, drill 0.75mm (see NXP sot054_po.pdf)

Pads
3
THT
5.1×11.3
Boards

TO-92_W4.0mm_StaggerEven_Horizontal_FlatSideUp

FP3D

Package_TO_SOT_THT

TO-92 horizontal, leads molded, narrow, drill 0.75mm (see NXP sot054_po.pdf)

Pads
3
THT
5.1×11.3
Boards

TO-92-2_W4.0mm_Horizontal_FlatSideDown

FP3D

Package_TO_SOT_THT

TO-92 horizontal, leads in-line, narrow, oval pads, drill 0.75mm (see NXP sot054_po.pdf)

Pads
2
THT
5.1×10.1
Boards

TO-92-2_W4.0mm_Horizontal_FlatSideUp

FP3D

Package_TO_SOT_THT

TO-92 horizontal, leads in-line, narrow, oval pads, drill 0.75mm (see NXP sot054_po.pdf)

Pads
2
THT
5.1×10.1
Boards