Footprints
377 footprints matching “leaded”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
TO-92L_Inline
Package_TO_SOT_THT
TO-92L leads in-line (large body variant of TO-92), also known as TO-226, wide, drill 0.75mm (see https://www.diodes.com/assets/Package-Files/TO92L.pdf and http://www.ti.com/lit/an/snoa059/snoa059.pdf)
- Pads
- 3
- THT
- 5.5×4.6
- Boards
- 51
SW_Push_1P1T_NO_CK_KSC6xxJ
Button_Switch_SMD
Tactile switch, 6.2x6.25 mm, H7.68 mm, J leads, https://www.ckswitches.com/media/1972/ksc6.pdf
- Pads
- 2
- SMD
- 9.1×6.8
- Boards
- 50
SO-4_4.4x3.6mm_P2.54mm
Package_SO
4-Lead Plastic Small Outline (SO), see https://www.elpro.org/de/index.php?controller=attachment&id_attachment=339
- Pads
- 4
- SMD
- 8.8×4.1
- Boards
- 49
DIP-28_W7.62mm_Socket_LongPads
Package_DIP
28-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads
- Pads
- 28
- THT
- 10.7×36.2
- Boards
- 48
WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm_ThermalVias
Package_SON
8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf
- Pads
- 9
- SMD
- 3.2×2.5
- Boards
- 47
DIP-40_W15.24mm_LongPads
Package_DIP
40-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), LongPads
- Pads
- 40
- THT
- 18.1×51.3
- Boards
- 45
DIP-18_W7.62mm_Socket
Package_DIP
18-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket
- Pads
- 18
- THT
- 10.7×23.5
- Boards
- 39
DIP-28_W15.24mm_LongPads
Package_DIP
28-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), LongPads
- Pads
- 28
- THT
- 18.1×36.1
- Boards
- 37
DIP-24_W7.62mm_Socket
Package_DIP
24-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket
- Pads
- 24
- THT
- 10.7×31.1
- Boards
- 36
SSOP-28_3.9x9.9mm_P0.635mm
Package_SO
SSOP28: plastic shrink small outline package; 28 leads; body width 3.9 mm; lead pitch 0.635; (see http://cds.linear.com/docs/en/datasheet/38901fb.pdf)
- Pads
- 28
- SMD
- 6.9×10.4
- Boards
- 33
TI_SO-PowerPAD-8
Package_SO
8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf)
- Pads
- 9
- SMD
- 8.0×5.4
- Boards
- 33
Diodes_PowerDI3333-8
Package_SON
Diodes Incorporated PowerDI3333-8, Plastic Dual Flat No Lead Package, 3.3x3.3x0.8mm Body, https://www.diodes.com/assets/Package-Files/PowerDI3333-8.pdf
- Pads
- 5
- SMD
- 4.2×3.8
- Boards
- 33
DFN-6-1EP_2x2mm_P0.65mm_EP1x1.6mm
Package_DFN_QFN
6-Lead Plastic Dual Flat, No Lead Package (MA) - 2x2x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 7
- SMD
- 3.3×2.5
- Boards
- 32
DIP-18_W7.62mm_Socket_LongPads
Package_DIP
18-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads
- Pads
- 18
- THT
- 10.7×23.5
- Boards
- 32
DIP-28_W7.62mm_LongPads
Package_DIP
28-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads
- Pads
- 28
- THT
- 10.5×36.1
- Boards
- 31
SSOP-24_3.9x8.7mm_P0.635mm
Package_SO
SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf)
- Pads
- 24
- SMD
- 6.9×9.3
- Boards
- 30
Diode_Bridge_Round_D9.8mm
Diode_THT
4-lead round diode bridge package, diameter 9.8mm, pin pitch 5.08mm, see http://www.vishay.com/docs/88769/woo5g.pdf
- Pads
- 4
- THT
- 9.3×10.3
- Boards
- 29
SMDIP-6_W9.53mm
Package_DIP
6-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils)
- Pads
- 6
- SMD
- 12.0×8.1
- Boards
- 29
DIP-24_W7.62mm_Socket_LongPads
Package_DIP
24-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads
- Pads
- 24
- THT
- 10.7×31.1
- Boards
- 28
DIP-6_W7.62mm_LongPads
Package_DIP
6-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads
- Pads
- 6
- THT
- 10.5×8.1
- Boards
- 27
SSOP-10_3.9x4.9mm_P1.00mm
Package_SO
10-Lead SSOP, 3.9 x 4.9mm body, 1.00mm pitch (http://www.st.com/resource/en/datasheet/viper01.pdf)
- Pads
- 10
- SMD
- 6.7×5.4
- Boards
- 25
TSSOP-16-1EP_4.4x5mm_P0.65mm
Package_SO
FE Package; 16-Lead Plastic TSSOP (4.4mm); Exposed Pad Variation BB; (see Linear Technology 1956f.pdf)
- Pads
- 17
- SMD
- 7.0×5.7
- Boards
- 25
DIP-32_W15.24mm_LongPads
Package_DIP
32-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), LongPads
- Pads
- 32
- THT
- 18.1×41.2
- Boards
- 24
SO-4_4.4x4.3mm_P2.54mm
Package_SO
4-Lead Plastic Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN
- Pads
- 4
- SMD
- 7.7×4.8
- Boards
- 24