Footprints
104 footprints matching “0.8”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
L_Radial_D50.8mm_P36.32mm_Vishay_IHB-6
Inductor_THT
Inductor, Radial series, Radial, pin pitch=36.32mm, diameter=50.8mm, height=38.1mm, Vishay, IHB-6, http://www.vishay.com/docs/34015/ihb.pdf
- Pads
- 2
- THT
- 51.3×51.3
- Boards
- —
L_Radial_D50.8mm_P38.86mm_Vishay_IHB-6
Inductor_THT
Inductor, Radial series, Radial, pin pitch=38.86mm, diameter=50.8mm, height=38.1mm, Vishay, IHB-6, http://www.vishay.com/docs/34015/ihb.pdf
- Pads
- 2
- THT
- 51.3×51.3
- Boards
- —
L_Wurth_WE-HCFT-3540_LeadDiameter0.8mm
Inductor_THT_Wurth
Shielded High Current Inductor, body 41x36mm, https://www.we-online.com/catalog/en/WE-HCFT#/articles/WE-HCFT-3540
- Pads
- 2
- THT
- 41.5×36.5
- Boards
- —
WSON-10-1EP_2x3mm_P0.5mm_EP0.84x2.4mm
kiml-00-kiml-unsorted
WSON-10 package 2x3mm body, pitch 0.5mm, see http://www.ti.com/lit/ds/symlink/tps62177.pdf
- Pads
- 11
- SMD
- 3.1×3.6
- Boards
- —
BGA-84_10.5x13.0mm_Layout2x3x16_P0.8mm
muratovas-MAS_Package_std
BGA-84,
- Pads
- 90
- SMD
- 11.0×15.0
- Boards
- —
Analog_BGA-209_9.5x16mm_Layout11x19_P0.8mm
Package_BGA
Analog BGA-209 (Reference LTC DWG#05-08-1561 Rev B), 9.5x16.0mm, 209 Ball, 11x19 Layout, 0.8mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-bga/05081561_bga209.pdf
- Pads
- 209
- SMD
- 11.5×18.0
- Boards
- —
Analog_BGA-49_6.25x6.25mm_Layout7x7_P0.8mm
Package_BGA
Analog BGA-49, 6.25x6.25mm, 49 Ball, 7x7 Layout, 0.8mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-bga/05081600_0_bga49.pdf https://www.analog.com/media/en/technical-documentation/product-information/assembly-considerations-for-umodule-bga-lga-package.pdf
- Pads
- 49
- SMD
- 8.3×8.3
- Boards
- —
BGA-48_8.0x9.0mm_Layout6x8_P0.8mm
Package_BGA
BGA-48 - pitch 0.8 mm
- Pads
- 48
- SMD
- 10.0×11.0
- Boards
- —
BGA-624_21x21mm_Layout25x25_P0.8mm
Package_BGA
BGA-624, 21.0x21.0mm, 624 Ball, 25x25 Layout, 0.8mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1529-1.pdf
- Pads
- 624
- SMD
- 23.0×23.0
- Boards
- —
BGA-625_21.0x21.0mm_Layout25x25_P0.8mm
Package_BGA
BGA-625
- Pads
- 625
- SMD
- 23.0×23.0
- Boards
- —
BGA-64_9.0x9.0mm_Layout10x10_P0.8mm
Package_BGA
BGA-64, 10x10 raster, 9x9mm package, pitch 0.8mm
- Pads
- 64
- SMD
- 11.0×11.0
- Boards
- —
BGA-90_8.0x13.0mm_Layout2x3x15_P0.8mm
Package_BGA
BGA-90, http://www.issi.com/WW/pdf/42-45S32800J.pdf
- Pads
- 90
- SMD
- 10.0×15.0
- Boards
- —
FBGA-78_7.5x11mm_Layout2x3x13_P0.8mm
Package_BGA
FBGA-78, https://www.skhynix.com/product/filedata/fileDownload.do?seq=7687
- Pads
- 78
- SMD
- 9.5×13.0
- Boards
- —
FCPBGA-780_23x23mm_Layout28x28_P0.8mm
Package_BGA
FCPBGA-780, 23.0x23.0mm, 780 Ball, 28x28 Layout, 0.8mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00854D.pdf
- Pads
- 780
- SMD
- 25.0×25.0
- Boards
- —
Texas_BGA-289_15x15mm_Layout17x17_P0.8mm
Package_BGA
Texas Instruments BGA-289, 0.4mm pad, 15x15mm, 289 Ball, 17x17 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf
- Pads
- 289
- SMD
- 17.0×17.0
- Boards
- —
Xilinx_CSG48_7.0x7.0mm_Layout7x7_P0.8mm
Package_CSP
XC9572XL CS BGA, 7x7mm, 48 Ball, 7x7 Layout, 0.8mm Pitch, https://www.xilinx.com/content/dam/xilinx/support/documents/package_specs/cs48.pdf
- Pads
- 48
- SMD
- 9.0×9.0
- Boards
- —
QFN-16-1EP_5x5mm_P0.8mm_EP2.7x2.7mm_ThermalVias
Package_DFN_QFN
QFN, 16 Pin (http://www.intersil.com/content/dam/Intersil/documents/l16_/l16.5x5.pdf)
- Pads
- 17
- SMD
- 6.2×6.2
- Boards
- —
VQFN-12-1EP_4x4mm_P0.8mm_EP2.1x2.1mm
Package_DFN_QFN
VQFN, 12 Pin (https://www.mouser.ch/datasheet/2/268/EMC2301_2_3_5_Data_Sheet_DS20006532A-3443118.pdf)
- Pads
- 13
- SMD
- 5.2×5.2
- Boards
- —
LQFP-64_14x14mm_P0.8mm
Package_QFP
LQFP, 64 Pin (https://www.nxp.com/docs/en/package-information/SOT791-1.pdf)
- Pads
- 64
- SMD
- 17.4×17.4
- Boards
- —
Microchip_PQFP-44_10x10mm_P0.8mm
Package_QFP
Microchip PQFP, 44 Pin (JEDEC MO-112 variation AA-2, Microchip and Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MO-112, https://ww1.microchip.com/downloads/aemDocuments/documents/OTH/ProductDocuments/DataSheets/20005418B.pdf#page=10, https://www.analog.com/media/en/technical-documentation/data-sheets/ad7722.pdf#page=23)
- Pads
- 44
- SMD
- 15.4×15.4
- Boards
- —
TQFP-44-1EP_10x10mm_P0.8mm_EP4.5x4.5mm_ThermalVias
Package_QFP
TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)
- Pads
- 45
- SMD
- 13.3×13.3
- Boards
- —
ST_PowerSSO-24_SlugDown
Package_SO
ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7266p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)
- Pads
- 25
- SMD
- 12.1×10.8
- Boards
- —
ST_PowerSSO-24_SlugDown_ThermalVias
Package_SO
ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7266p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)
- Pads
- 25
- SMD
- 12.1×10.8
- Boards
- —
ST_PowerSSO-24_SlugUp
Package_SO
ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7266p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)
- Pads
- 24
- SMD
- 12.1×10.8
- Boards
- —