Footprints

129 footprints matching “Jedec”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Footprints that come with a 3D model.

129 footprints · page 4 of 6

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LQFP-176_20x20mm_P0.4mm

FP3D

Package_QFP

LQFP, 176 Pin (JEDEC MS-026 variation BFC, 1.40mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026)

Pads: 176
SMD: 23.3×23.3
Boards: —

Microchip_PQFP-44_10x10mm_P0.8mm

FP3D

Package_QFP

Microchip PQFP, 44 Pin (JEDEC MO-112 variation AA-2, Microchip and Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MO-112, https://ww1.microchip.com/downloads/aemDocuments/documents/OTH/ProductDocuments/DataSheets/20005418B.pdf#page=10, https://www.analog.com/media/en/technical-documentation/data-sheets/ad7722.pdf#page=23)

Pads: 44
SMD: 15.4×15.4
Boards: —

MO112AC1_PQFP-52_10x10mm_P0.65mm

FP3D

Package_QFP

MO112AC1 PQFP, 52 Pin (JEDEC MO-112 variation AC-1, https://www.jedec.org/document_search?search_api_views_fulltext=MO-112, https://www.analog.com/media/en/package-pcb-resources/package/32717196300961s_52_2.pdf)

Pads: 52
SMD: 15.2×15.2
Boards: —

TQFP-44-1EP_10x10mm_P0.8mm_EP4.5x4.5mm_ThermalVias

FP3D

Package_QFP

TQFP, 44 Pin (JEDEC MS-026 variation ACB, 1.00mm body thickness, custom Exposed Pad from Microchip, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=662)

Pads: 45
SMD: 13.3×13.3
Boards: —

TQFP-48-1EP_7x7mm_P0.5mm_EP3.5x3.5mm_ThermalVias

FP3D

Package_QFP

TQFP, 48 Pin (JEDEC MS-026 variation ABC, 1.00mm body thickness, custom Exposed Pad from Microchip and Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=664, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_48_4.pdf)

Pads: 49
SMD: 10.3×10.3
Boards: —

TQFP-80_14x14mm_P0.65mm

FP3D

Package_QFP

TQFP, 80 Pin (JEDEC MS-026 variation AEC, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=679)

Pads: 80
SMD: 17.3×17.3
Boards: —

TQFP-80-1EP_14x14mm_P0.65mm_EP9.5x9.5mm

FP3D

Package_QFP

TQFP, 80 Pin (Based on JEDEC MS-026 variation AEC, 1.00mm body thickness, lead width / tolerances / custom Exposed Pad from Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_80_4.pdf)

Pads: 81
SMD: 17.4×17.4
Boards: —

TQFP-80-1EP_14x14mm_P0.65mm_EP9.5x9.5mm_ThermalVias

FP3D

Package_QFP

Pads: 81
SMD: 17.4×17.4
Boards: —

HSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugUp

FP3D

Package_SO

HSOP 11.0x15.9mm Pitch 0.65mm Slug Up (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf)

Pads: 36
SMD: 15.9×16.4
Boards: —

SOIC-5-6_4.4x3.6mm_P1.27mm

FP3D

Package_SO

SOIC, 5 Pin (JEDEC MO-155, variation AA, 2.50mm nominal body thickness, https://www.jedec.org/system/files/docs/Mo-155a.pdf)

Pads: 5
SMD: 8.4×4.1
Boards: —

SOJ-36_10.16x23.495mm_P1.27mm

FP3D

Package_SO

SOJ, 36 Pin (JEDEC MS-027-A, 400 mils width, variation AE, https://www.jedec.org/system/files/docs/Ms-027a.pdf)

Pads: 36
SMD: 12.6×24.0
Boards: —

ST_PowerSSO-24_SlugDown

FP3D

Package_SO

ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7266p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)

Pads: 25
SMD: 12.1×10.8
Boards: —

ST_PowerSSO-24_SlugDown_ThermalVias

FP3D

Package_SO

ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7266p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)

Pads: 25
SMD: 12.1×10.8
Boards: —

ST_PowerSSO-24_SlugUp

FP3D

Package_SO

ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7266p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)

Pads: 24
SMD: 12.1×10.8
Boards: —

ST_PowerSSO-36_SlugDown

FP3D

Package_SO

ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7492p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)

Pads: 37
SMD: 12.1×10.8
Boards: —

ST_PowerSSO-36_SlugDown_ThermalVias

FP3D

Package_SO

ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7492p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)

Pads: 37
SMD: 12.1×10.8
Boards: —

ST_PowerSSO-36_SlugUp

FP3D

Package_SO

ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7492p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf)

Pads: 36
SMD: 12.1×10.8
Boards: —

Texas_HTSSOP-14-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3.155x3.255mm

FP3D

Package_SO

Texas HTSSOP, 14 Pin (Texas Instruments PWP0014A, based on JEDEC MO-153 variation ABT-1, 1.00mm body thickness, https://www.ti.com/lit/ml/pptd287a/pptd287a.pdf, https://www.ti.com/lit/ds/symlink/lm5161.pdf#page=34, https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)

Pads: 15
SMD: 7.8×5.5
Boards: —