Footprints
675 footprints matching “lead”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
DIP-28_W15.24mm_LongPads
Package_DIP
28-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), LongPads
- Pads
- 28
- THT
- 18.1×36.1
- Boards
- 37
DIP-24_W7.62mm_Socket
Package_DIP
24-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket
- Pads
- 24
- THT
- 10.7×31.1
- Boards
- 36
QFN-56-1EP_7x7mm_P0.4mm_EP5.6x5.6mm
Package_DFN_QFN
QFN, 56 Pin (http://www.cypress.com/file/416486/download#page=40)
- Pads
- 57
- SMD
- 8.3×8.3
- Boards
- 34
SSOP-28_3.9x9.9mm_P0.635mm
Package_SO
SSOP28: plastic shrink small outline package; 28 leads; body width 3.9 mm; lead pitch 0.635; (see http://cds.linear.com/docs/en/datasheet/38901fb.pdf)
- Pads
- 28
- SMD
- 6.9×10.4
- Boards
- 33
TI_SO-PowerPAD-8
Package_SO
8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf)
- Pads
- 9
- SMD
- 8.0×5.4
- Boards
- 33
Diodes_PowerDI3333-8
Package_SON
Diodes Incorporated PowerDI3333-8, Plastic Dual Flat No Lead Package, 3.3x3.3x0.8mm Body, https://www.diodes.com/assets/Package-Files/PowerDI3333-8.pdf
- Pads
- 5
- SMD
- 4.2×3.8
- Boards
- 33
DFN-6-1EP_2x2mm_P0.65mm_EP1x1.6mm
Package_DFN_QFN
6-Lead Plastic Dual Flat, No Lead Package (MA) - 2x2x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 7
- SMD
- 3.3×2.5
- Boards
- 32
DIP-18_W7.62mm_Socket_LongPads
Package_DIP
18-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads
- Pads
- 18
- THT
- 10.7×23.5
- Boards
- 32
DIP-28_W7.62mm_LongPads
Package_DIP
28-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads
- Pads
- 28
- THT
- 10.5×36.1
- Boards
- 31
QFN-16-1EP_4x4mm_P0.65mm_EP2.1x2.1mm
Package_DFN_QFN
QFN, 16 Pin (http://www.thatcorp.com/datashts/THAT_1580_Datasheet.pdf)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- 30
QFN-28-1EP_6x6mm_P0.65mm_EP4.25x4.25mm
Package_DFN_QFN
QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=289)
- Pads
- 29
- SMD
- 7.2×7.2
- Boards
- 30
SSOP-24_3.9x8.7mm_P0.635mm
Package_SO
SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf)
- Pads
- 24
- SMD
- 6.9×9.3
- Boards
- 30
Diode_Bridge_Round_D9.8mm
Diode_THT
4-lead round diode bridge package, diameter 9.8mm, pin pitch 5.08mm, see http://www.vishay.com/docs/88769/woo5g.pdf
- Pads
- 4
- THT
- 9.3×10.3
- Boards
- 29
SMDIP-6_W9.53mm
Package_DIP
6-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils)
- Pads
- 6
- SMD
- 12.0×8.1
- Boards
- 29
TO-220-5_P3.4x3.7mm_StaggerOdd_Lead3.8mm_Vertical
Package_TO_SOT_THT
TO-220-5, Vertical, RM 1.7mm, Pentawatt, staggered type-1, see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-to-220/to-220_5_05-08-1421.pdf?domain=www.linear.com, https://www.diodes.com/assets/Package-Files/TO220-5.pdf
- Pads
- 5
- THT
- 10.5×9.6
- Boards
- 29
DIP-24_W7.62mm_Socket_LongPads
Package_DIP
24-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), Socket, LongPads
- Pads
- 24
- THT
- 10.7×31.1
- Boards
- 28
DIP-6_W7.62mm_LongPads
Package_DIP
6-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads
- Pads
- 6
- THT
- 10.5×8.1
- Boards
- 27
SSOP-10_3.9x4.9mm_P1.00mm
Package_SO
10-Lead SSOP, 3.9 x 4.9mm body, 1.00mm pitch (http://www.st.com/resource/en/datasheet/viper01.pdf)
- Pads
- 10
- SMD
- 6.7×5.4
- Boards
- 25
TSSOP-16-1EP_4.4x5mm_P0.65mm
Package_SO
FE Package; 16-Lead Plastic TSSOP (4.4mm); Exposed Pad Variation BB; (see Linear Technology 1956f.pdf)
- Pads
- 17
- SMD
- 7.0×5.7
- Boards
- 25
QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm_ThermalVias
Package_DFN_QFN
QFN, 24 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=278)
- Pads
- 25
- SMD
- 5.2×5.2
- Boards
- 24
QFN-56-1EP_7x7mm_P0.4mm_EP4x4mm
Package_DFN_QFN
QFN, 56 Pin (https://www.espressif.com/sites/default/files/documentation/esp32-s2_datasheet_en.pdf#page=41)
- Pads
- 57
- SMD
- 8.2×8.2
- Boards
- 24
DIP-32_W15.24mm_LongPads
Package_DIP
32-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils), LongPads
- Pads
- 32
- THT
- 18.1×41.2
- Boards
- 24
SO-4_4.4x4.3mm_P2.54mm
Package_SO
4-Lead Plastic Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN
- Pads
- 4
- SMD
- 7.7×4.8
- Boards
- 24
DFN-8-1EP_3x3mm_P0.5mm_EP1.66x2.38mm
Package_DFN_QFN
DD Package; 8-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_8_05-08-1698.pdf)
- Pads
- 9
- SMD
- 4.0×3.6
- Boards
- 23