Footprints

324 footprints matching “0.5mm”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Footprints that come with a 3D model.

324 footprints · page 5 of 14

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DFN-12-1EP_3x4mm_P0.5mm_EP1.7x3.3mm

FP3D

Package_DFN_QFN

DE/UE Package; 12-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_12_05-08-1695.pdf)

Pads: 13
SMD: 4.1×4.6
Boards: 5

UDFN-10_1.35x2.6mm_P0.5mm

FP3D

Package_DFN_QFN

http://www.st.com/content/ccc/resource/technical/document/datasheet/f2/11/8a/ed/40/31/40/56/DM00088292.pdf/files/DM00088292.pdf/jcr:content/translations/en.DM00088292.pdf

Pads: 10
SMD: 2.3×3.1
Boards: 5

UDFN-9_1.0x3.8mm_P0.5mm

FP3D

Package_DFN_QFN

9-pin UDFN package, 1.0x3.8mm, (Ref: https://katalog.we-online.de/pbs/datasheet/824014881.pdf)

Pads: 9
SMD: 2.1×4.3
Boards: 5

VQFN-48-1EP_7x7mm_P0.5mm_EP4.1x4.1mm_ThermalVias

FP3D

Package_DFN_QFN

VQFN, 48 Pin (http://www.ti.com/lit/ds/symlink/cc430f5137.pdf#page=128)

Pads: 49
SMD: 8.3×8.3
Boards: 5

VSON-10-1EP_3x3mm_P0.5mm_EP1.2x2mm

FP3D

Package_SON

VSON, 10 Pin (http://rohmfs.rohm.com/en/products/databook/datasheet/ic/power/switching_regulator/bd8314nuv-e.pdf (Page 20))

Pads: 11
SMD: 4.3×3.5
Boards: 5

TestPoint_Bridge_Pitch2.54mm_Drill0.7mm

FP3D

TestPoint

wire loop as test point, pitch 2.0mm, hole diameter 0.7mm, wire diameter 0.5mm

Pads: 1
THT: 4.9×2.4
Boards: 5

DFN-16-1EP_4x5mm_P0.5mm_EP2.44x4.34mm

FP3D

Package_DFN_QFN

DHD Package; 16-Lead Plastic DFN (5mm x 4mm) (see Linear Technology 05081707_A_DHD16.pdf)

Pads: 17
SMD: 5.0×5.6
Boards: 4

Micrel_MLF-8-1EP_2x2mm_P0.5mm_EP0.6x1.2mm

FP3D

Package_DFN_QFN

Micrel MLF, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic23050.pdf)

Pads: 9
SMD: 3.2×2.5
Boards: 4

QFN-20-1EP_3x4mm_P0.5mm_EP1.65x2.65mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 20 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_20_05-08-1742.pdf)

Pads: 21
SMD: 4.3×5.3
Boards: 4

QFN-40-1EP_6x6mm_P0.5mm_EP4.6x4.6mm_ThermalVias

FP3D

Package_DFN_QFN

QFN, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=295)

Pads: 41
SMD: 7.2×7.2
Boards: 4

Texas_RGE0024H_VQFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm

FP3D

Package_DFN_QFN

Texas RGE0024H VQFN, 24 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=40)

Pads: 25
SMD: 5.3×5.3
Boards: 4

Texas_RHB0032E_VQFN-32-1EP_5x5mm_P0.5mm_EP3.45x3.45mm_ThermalVias

FP3D

Package_DFN_QFN

Texas RHB0032E VQFN, 32 Pin (http://www.ti.com/lit/ds/symlink/msp430f1122.pdf#page=54)

Pads: 33
SMD: 6.3×6.3
Boards: 4

TQFP-100-1EP_14x14mm_P0.5mm_EP5x5mm

FP3D

Package_QFP

TQFP, 100 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_100_4.pdf)

Pads: 101
SMD: 17.3×17.3
Boards: 4

TQFP-80_12x12mm_P0.5mm

FP3D

Package_QFP

TQFP, 80 Pin (JEDEC MS-026 variation ADD, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/aemDocuments/documents/package-outline-drawings/c04-00092c.pdf)

Pads: 80
SMD: 15.3×15.3
Boards: 4

TSOP-I-32_11.8x8mm_P0.5mm

FP3D

Package_SO

TSOP-I, 32 Pin (http://www.issi.com/WW/pdf/61-64C5128AL.pdf)

Pads: 32
SMD: 14.9×8.5
Boards: 4

TSOP-I-32_12.4x8mm_P0.5mm

FP3D

Package_SO

TSOP-I, 32 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation BA)

Pads: 32
SMD: 15.5×8.5
Boards: 4

WSON-8-1EP_3x3mm_P0.5mm_EP1.6x2.0mm

FP3D

Package_SON

8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf

Pads: 9
SMD: 3.9×3.5
Boards: 4

Texas_DSBGA-8_0.9x1.9mm_Layout2x4_P0.5mm

FP3D

Package_BGA

Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 2x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)

Pads: 8
SMD: 2.9×3.9
Boards: 3