Footprints
135 footprints matching “0.65mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
TDFN-6-1EP_2.5x2.5mm_P0.65mm_EP1.3x2mm_ThermalVias
Package_DFN_QFN
TDFN, 6 Pin (http://www.nve.com/Downloads/ab3.pdf)
- Pads
- 7
- SMD
- 3.8×3.0
- Boards
- —
TQFN-20-1EP_5x5mm_P0.65mm_EP3.1x3.1mm_ThermalVias
Package_DFN_QFN
TQFN, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T2055-3))
- Pads
- 21
- SMD
- 6.2×6.2
- Boards
- —
UQFN-16-1EP_4x4mm_P0.65mm_EP2.7x2.7mm
Package_DFN_QFN
16-Lead Ultra Thin Plastic Quad Flat, No Lead Package (JQ) - 4x4x0.5 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 17
- SMD
- 5.3×5.3
- Boards
- —
UQFN-32_5x5mm_P0.5mm
Package_DFN_QFN
UQFN, 32 Pin (JEDEC MO-248 variation UHHD, 0.65mm maximum overall height, https://www.jedec.org/document_search?search_api_views_fulltext=MO-248)
- Pads
- 32
- SMD
- 6.2×6.2
- Boards
- —
WDFN-8-1EP_4x3mm_P0.65mm_EP2.4x1.8mm_ThermalVias
Package_DFN_QFN
WDFN, 8 Pin (https://www.onsemi.com/pub/Collateral/509AF.PDF)
- Pads
- 9
- SMD
- 5.2×3.5
- Boards
- —
AMS_LGA-20_4.7x4.5mm_P0.65mm
Package_LGA
http://ams.com/eng/content/download/1008631/2361759/498838
- Pads
- 20
- SMD
- 6.0×6.2
- Boards
- —
LGA-16_4x4mm_P0.65mm_LayoutBorder4x4y
Package_LGA
LGA, 16 Pin (http://www.st.com/resource/en/datasheet/l3gd20.pdf)
- Pads
- 16
- SMD
- 4.5×4.5
- Boards
- —
LQFP-36_7x7mm_P0.65mm
Package_QFP
LQFP, 36 Pin (https://www.onsemi.com/pub/Collateral/561AV.PDF)
- Pads
- 36
- SMD
- 10.4×10.4
- Boards
- —
LQFP-52-1EP_10x10mm_P0.65mm_EP4.8x4.8mm
Package_QFP
LQFP, 52 Pin (https://www.onsemi.com/pub/Collateral/848H-01.PDF)
- Pads
- 53
- SMD
- 13.3×13.3
- Boards
- —
LQFP-52-1EP_10x10mm_P0.65mm_EP4.8x4.8mm_ThermalVias
Package_QFP
LQFP, 52 Pin (https://www.onsemi.com/pub/Collateral/848H-01.PDF)
- Pads
- 53
- SMD
- 13.3×13.3
- Boards
- —
MO112AC1_PQFP-52_10x10mm_P0.65mm
Package_QFP
MO112AC1 PQFP, 52 Pin (JEDEC MO-112 variation AC-1, https://www.jedec.org/document_search?search_api_views_fulltext=MO-112, https://www.analog.com/media/en/package-pcb-resources/package/32717196300961s_52_2.pdf)
- Pads
- 52
- SMD
- 15.2×15.2
- Boards
- —
PQFP-112_20x20mm_P0.65mm
Package_QFP
PQFP, 112 pins, 20mm sq body, 0.65mm pitch (http://cache.freescale.com/files/shared/doc/package_info/98ASS23330W.pdf, http://www.nxp.com/docs/en/application-note/AN4388.pdf)
- Pads
- 112
- SMD
- 23.5×23.5
- Boards
- —
PQFP-144_28x28mm_P0.65mm
Package_QFP
PQFP, 144 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095)
- Pads
- 144
- SMD
- 32.5×32.5
- Boards
- —
TQFP-52-1EP_10x10mm_P0.65mm_EP6.5x6.5mm
Package_QFP
TQFP, 52 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_52_1.pdf)
- Pads
- 53
- SMD
- 13.3×13.3
- Boards
- —
TQFP-52-1EP_10x10mm_P0.65mm_EP6.5x6.5mm_ThermalVias
Package_QFP
TQFP, 52 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_52_1.pdf)
- Pads
- 53
- SMD
- 13.3×13.3
- Boards
- —
TQFP-80_14x14mm_P0.65mm
Package_QFP
TQFP, 80 Pin (JEDEC MS-026 variation AEC, 1.00mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BZ.pdf#page=679)
- Pads
- 80
- SMD
- 17.3×17.3
- Boards
- —
TQFP-80-1EP_14x14mm_P0.65mm_EP9.5x9.5mm
Package_QFP
TQFP, 80 Pin (Based on JEDEC MS-026 variation AEC, 1.00mm body thickness, lead width / tolerances / custom Exposed Pad from Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_80_4.pdf)
- Pads
- 81
- SMD
- 17.4×17.4
- Boards
- —
TQFP-80-1EP_14x14mm_P0.65mm_EP9.5x9.5mm_ThermalVias
Package_QFP
TQFP, 80 Pin (Based on JEDEC MS-026 variation AEC, 1.00mm body thickness, lead width / tolerances / custom Exposed Pad from Analog Devices, https://www.jedec.org/document_search?search_api_views_fulltext=MS-026, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_80_4.pdf)
- Pads
- 81
- SMD
- 17.4×17.4
- Boards
- —
HSOP-36-1EP_11.0x15.9mm_P0.65mm_SlugUp
Package_SO
HSOP 11.0x15.9mm Pitch 0.65mm Slug Up (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf)
- Pads
- 36
- SMD
- 15.9×16.4
- Boards
- —
HTSSOP-16-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask2.66x2.46mm
Package_SO
HTSSOP, 16 Pin (http://www.ti.com/lit/ds/symlink/tps2660.pdf#page=48)
- Pads
- 17
- SMD
- 7.8×5.5
- Boards
- —
HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm
Package_SO
20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [HTSSOP], with thermal pad with vias
- Pads
- 21
- SMD
- 7.9×7.1
- Boards
- —
HTSSOP-20-1EP_4.4x6.5mm_P0.65mm_EP3.4x6.5mm_Mask2.75x3.43mm
Package_SO
HTSSOP, 20 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=37&zoom=160,-90,3)
- Pads
- 21
- SMD
- 7.8×7.0
- Boards
- —
HTSSOP-24-1EP_4.4x7.8mm_P0.65mm_EP3.4x7.8mm_Mask2.4x4.68mm
Package_SO
HTSSOP, 24 Pin (http://www.ti.com/lit/ds/symlink/tps703.pdf)
- Pads
- 25
- SMD
- 7.8×8.3
- Boards
- —
HTSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.5mm_Mask2.4x6.17mm
Package_SO
HTSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; thermal pad
- Pads
- 29
- SMD
- 7.3×10.3
- Boards
- —