Footprints
4,663 footprints matching “5”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
PinHeader_2x05_P1.27mm_Vertical_SMD
Connector_PinHeader_1.27mm
surface-mounted straight pin header, 2x05, 1.27mm pitch, double rows
- Pads
- 10
- SMD
- 8.6×7.4
- Boards
- 304
C_Disc_D4.7mm_W2.5mm_P5.00mm
Capacitor_THT
C, Disc series, Radial, pin pitch=5.00mm, diameter*width=4.7*2.5mm^2, Capacitor, http://www.vishay.com/docs/45233/krseries.pdf
- Pads
- 2
- THT
- 7.1×3.0
- Boards
- 303
PinHeader_2x06_P2.54mm_Vertical
Connector_PinHeader_2.54mm
Through hole straight pin header, 2x06, 2.54mm pitch, double rows
- Pads
- 12
- THT
- 6.1×16.2
- Boards
- 302
DIP-28_W7.62mm
Package_DIP
28-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)
- Pads
- 28
- THT
- 9.7×36.1
- Boards
- 301
PinHeader_1x03_P2.54mm_Horizontal
Connector_PinHeader_2.54mm
Through hole angled pin header, 1x03, 2.54mm pitch, 6mm pin length, single row
- Pads
- 3
- THT
- 12.3×8.6
- Boards
- 299
L_0603_1608Metric_Pad1.05x0.95mm_HandSolder
Inductor_SMD
Inductor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)
- Pads
- 2
- SMD
- 3.3×1.5
- Boards
- 295
SW_PUSH_6mm_H5mm
Button_Switch_THT
tactile push button, 6x6mm e.g. PHAP33xx series, height=5mm
- Pads
- 2
- THT
- 9.5×7.5
- Boards
- 294
C_Disc_D3.0mm_W2.0mm_P2.50mm
Capacitor_THT
C, Disc series, Radial, pin pitch=2.50mm, diameter*width=3*2mm^2, Capacitor
- Pads
- 2
- THT
- 4.6×2.5
- Boards
- 288
SOIC-16W_7.5x10.3mm_P1.27mm
Package_SO
SOIC, 16 Pin (JEDEC MS-013AA, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_wide-rw/rw_16.pdf)
- Pads
- 16
- SMD
- 11.9×10.8
- Boards
- 282
SOIC-20W_7.5x12.8mm_P1.27mm
Package_SO
SOIC, 20 Pin (JEDEC MS-013AC, https://www.analog.com/media/en/package-pcb-resources/package/233848rw_20.pdf)
- Pads
- 20
- SMD
- 11.9×13.3
- Boards
- 279
Fuse_1206_3216Metric_Pad1.42x1.75mm_HandSolder
Fuse
Fuse SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)
- Pads
- 2
- SMD
- 4.9×2.3
- Boards
- 275
LQFP-100_14x14mm_P0.5mm
Package_QFP
LQFP, 100 Pin (https://www.nxp.com/docs/en/package-information/SOT407-1.pdf)
- Pads
- 100
- SMD
- 17.5×17.5
- Boards
- 273
DIP-40_W15.24mm
Package_DIP
40-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils)
- Pads
- 40
- THT
- 17.3×51.3
- Boards
- 272
D_0805_2012Metric
Diode_SMD
Diode SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC-7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing)
- Pads
- 2
- SMD
- 3.4×1.9
- Boards
- 268
R_Axial_DIN0207_L6.3mm_D2.5mm_P2.54mm_Vertical
Resistor_THT
Resistor, Axial_DIN0207 series, Axial, Vertical, pin pitch=2.54mm, 0.25W = 1/4W, length*diameter=6.3*2.5mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf
- Pads
- 2
- THT
- 5.1×3.0
- Boards
- 265
QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm
Package_DFN_QFN
QFN, 24 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=278)
- Pads
- 25
- SMD
- 5.2×5.2
- Boards
- 256
TSOT-23-5
Package_TO_SOT_SMD
TSOT, 5 Pin (https://www.jedec.org/sites/default/files/docs/MO-193D.pdf variant AB)
- Pads
- 5
- SMD
- 4.1×3.4
- Boards
- 256
JST_XH_B5B-XH-A_1x05_P2.50mm_Vertical
Connector_JST
JST XH series connector, B5B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf)
- Pads
- 5
- THT
- 15.9×6.8
- Boards
- 254
DIP-4_W7.62mm
Package_DIP
4-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)
- Pads
- 4
- THT
- 9.7×5.6
- Boards
- 252
C_Disc_D3.8mm_W2.6mm_P2.50mm
Capacitor_THT
C, Disc series, Radial, pin pitch=2.50mm, diameter*width=3.8*2.6mm^2, Capacitor, http://www.vishay.com/docs/45233/krseries.pdf
- Pads
- 2
- THT
- 4.6×3.1
- Boards
- 249
PinHeader_1x12_P2.54mm_Vertical
Connector_PinHeader_2.54mm
Through hole straight pin header, 1x12, 2.54mm pitch, single row
- Pads
- 12
- THT
- 3.5×31.5
- Boards
- 249
SSOP-28_5.3x10.2mm_P0.65mm
Package_SO
SSOP, 28 Pin (JEDEC MO-150 variation AH, 1.75mm body thickness, https://www.jedec.org/document_search?search_api_views_fulltext=MO-150, https://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=400)
- Pads
- 28
- SMD
- 9.4×10.7
- Boards
- 244
PinHeader_1x16_P2.54mm_Vertical
Connector_PinHeader_2.54mm
Through hole straight pin header, 1x16, 2.54mm pitch, single row
- Pads
- 16
- THT
- 3.5×41.7
- Boards
- 242
DIP-8_W7.62mm_LongPads
Package_DIP
8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads
- Pads
- 8
- THT
- 10.5×10.7
- Boards
- 242