Footprints

6,664 footprints matching “A”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

6,664 footprints · page 5 of 278

Matched by name and keywords. Search by meaning instead

PinHeader_2x05_P1.27mm_Vertical_SMD

FP3D

Connector_PinHeader_1.27mm

surface-mounted straight pin header, 2x05, 1.27mm pitch, double rows

Pads
10
SMD
8.6×7.4
Boards
304

C_Disc_D4.7mm_W2.5mm_P5.00mm

FP3D

Capacitor_THT

C, Disc series, Radial, pin pitch=5.00mm, diameter*width=4.7*2.5mm^2, Capacitor, http://www.vishay.com/docs/45233/krseries.pdf

Pads
2
THT
7.1×3.0
Boards
303

CP_Radial_D4.0mm_P2.00mm

FP3D

Capacitor_THT

CP, Radial series, Radial, pin pitch=2.00mm, diameter=4mm, height=7mm, Electrolytic Capacitor

Pads
2
THT
4.5×4.5
Boards
302

PinHeader_2x06_P2.54mm_Vertical

FP3D

Connector_PinHeader_2.54mm

Through hole straight pin header, 2x06, 2.54mm pitch, double rows

Pads
12
THT
6.1×16.2
Boards
302

PinHeader_1x03_P2.54mm_Horizontal

FP3D

Connector_PinHeader_2.54mm

Through hole angled pin header, 1x03, 2.54mm pitch, 6mm pin length, single row

Pads
3
THT
12.3×8.6
Boards
299

R_Array_Convex_4x0603

FP3D

Resistor_SMD

Chip Resistor Network, ROHM MNR14 (see mnr_g.pdf)

Pads
8
SMD
3.1×3.7
Boards
299

L_0603_1608Metric_Pad1.05x0.95mm_HandSolder

FP3D

Inductor_SMD

Inductor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)

Pads
2
SMD
3.3×1.5
Boards
295

SW_PUSH_6mm_H5mm

FP3D

Button_Switch_THT

tactile push button, 6x6mm e.g. PHAP33xx series, height=5mm

Pads
2
THT
9.5×7.5
Boards
294

C_Disc_D3.0mm_W2.0mm_P2.50mm

FP3D

Capacitor_THT

C, Disc series, Radial, pin pitch=2.50mm, diameter*width=3*2mm^2, Capacitor

Pads
2
THT
4.6×2.5
Boards
288

JST_PH_S2B-PH-K_1x02_P2.00mm_Horizontal

FP3D

Connector_JST

JST PH series connector, S2B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf)

Pads
2
THT
6.9×8.6
Boards
282

Fuse_1206_3216Metric_Pad1.42x1.75mm_HandSolder

FP3D

Fuse

Fuse SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)

Pads
2
SMD
4.9×2.3
Boards
275

D_SMA_Handsoldering

FP3D

Diode_SMD

Diode SMA (DO-214AC) Handsoldering

Pads
2
SMD
9.0×3.5
Boards
273

Crystal_SMD_2016-4Pin_2.0x1.6mm

FP3D

Crystal

SMD2016/4, Crystal, 2.0x1.6mm package, SMD, http://www.q-crystal.com/upload/5/2015552223166229.pdf

Pads
4
SMD
3.0×2.6
Boards
272

R_Axial_DIN0207_L6.3mm_D2.5mm_P2.54mm_Vertical

FP3D

Resistor_THT

Resistor, Axial_DIN0207 series, Axial, Vertical, pin pitch=2.54mm, 0.25W = 1/4W, length*diameter=6.3*2.5mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf

Pads
2
THT
5.1×3.0
Boards
265

QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm

FP3D

Package_DFN_QFN

QFN, 24 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=278)

Pads
25
SMD
5.2×5.2
Boards
256

JST_XH_B5B-XH-A_1x05_P2.50mm_Vertical

FP3D

Connector_JST

JST XH series connector, B5B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf)

Pads
5
THT
15.9×6.8
Boards
254

ESP32-S3-WROOM-1

FP3D

RF_Module

2.4 GHz Wi-Fi and Bluetooth module https://www.espressif.com/sites/default/files/documentation/esp32-s3-wroom-1_wroom-1u_datasheet_en.pdf

Pads
41
SMD
48.0×41.2
Boards
253

C_Disc_D3.8mm_W2.6mm_P2.50mm

FP3D

Capacitor_THT

C, Disc series, Radial, pin pitch=2.50mm, diameter*width=3.8*2.6mm^2, Capacitor, http://www.vishay.com/docs/45233/krseries.pdf

Pads
2
THT
4.6×3.1
Boards
249

PinHeader_1x12_P2.54mm_Vertical

FP3D

Connector_PinHeader_2.54mm

Through hole straight pin header, 1x12, 2.54mm pitch, single row

Pads
12
THT
3.5×31.5
Boards
249

PinHeader_1x16_P2.54mm_Vertical

FP3D

Connector_PinHeader_2.54mm

Through hole straight pin header, 1x16, 2.54mm pitch, single row

Pads
16
THT
3.5×41.7
Boards
242

DIP-8_W7.62mm_LongPads

FP3D

Package_DIP

8-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils), LongPads

Pads
8
THT
10.5×10.7
Boards
242

C_1210_3225Metric_Pad1.33x2.70mm_HandSolder

FP3D

Capacitor_SMD

Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf)

Pads
2
SMD
5.0×3.2
Boards
241

Molex_KK-254_AE-6410-02A_1x02_P2.54mm_Vertical

FP3D

Connector_Molex

Molex KK-254 Interconnect System, old/engineering part number: AE-6410-02A example for new part number: 22-27-2021, 2 Pins (http://www.molex.com/pdm_docs/sd/022272021_sd.pdf)

Pads
2
THT
6.1×6.8
Boards
240

PinHeader_2x10_P2.54mm_Vertical

FP3D

Connector_PinHeader_2.54mm

Through hole straight pin header, 2x10, 2.54mm pitch, double rows

Pads
20
THT
6.1×26.4
Boards
240