Footprints

6,622 footprints matching “L”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Footprints that come with a 3D model.

6,622 footprints · page 5 of 276

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C_Disc_D5.0mm_W2.5mm_P2.50mm

FP3D

Capacitor_THT

C, Disc series, Radial, pin pitch=2.50mm, diameter*width=5*2.5mm^2, Capacitor, http://cdn-reichelt.de/documents/datenblatt/B300/DS_KERKO_TC.pdf

Pads: 2
THT: 5.5×3.0
Boards: 312

PinHeader_1x04_P2.54mm_Horizontal

FP3D

Connector_PinHeader_2.54mm

Through hole angled pin header, 1x04, 2.54mm pitch, 6mm pin length, single row

Pads: 4
THT: 12.3×11.2
Boards: 307

PinHeader_1x09_P2.54mm_Vertical

FP3D

Connector_PinHeader_2.54mm

Through hole straight pin header, 1x09, 2.54mm pitch, single row

Pads: 9
THT: 3.5×23.9
Boards: 306

PinHeader_2x05_P1.27mm_Vertical_SMD

FP3D

Connector_PinHeader_1.27mm

surface-mounted straight pin header, 2x05, 1.27mm pitch, double rows

Pads: 10
SMD: 8.6×7.4
Boards: 304

C_Disc_D4.7mm_W2.5mm_P5.00mm

FP3D

Capacitor_THT

C, Disc series, Radial, pin pitch=5.00mm, diameter*width=4.7*2.5mm^2, Capacitor, http://www.vishay.com/docs/45233/krseries.pdf

Pads: 2
THT: 7.1×3.0
Boards: 303

CP_Radial_D4.0mm_P2.00mm

FP3D

Capacitor_THT

CP, Radial series, Radial, pin pitch=2.00mm, diameter=4mm, height=7mm, Electrolytic Capacitor

Pads: 2
THT: 4.5×4.5
Boards: 302

PinHeader_2x06_P2.54mm_Vertical

FP3D

Connector_PinHeader_2.54mm

Through hole straight pin header, 2x06, 2.54mm pitch, double rows

Pads: 12
THT: 6.1×16.2
Boards: 302

DIP-28_W7.62mm

FP3D

Package_DIP

28-lead though-hole mounted DIP package, row spacing 7.62mm (300 mils)

Pads: 28
THT: 9.7×36.1
Boards: 301

PinHeader_1x03_P2.54mm_Horizontal

FP3D

Connector_PinHeader_2.54mm

Through hole angled pin header, 1x03, 2.54mm pitch, 6mm pin length, single row

Pads: 3
THT: 12.3×8.6
Boards: 299

L_0603_1608Metric_Pad1.05x0.95mm_HandSolder

FP3D

Inductor_SMD

Inductor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)

Pads: 2
SMD: 3.3×1.5
Boards: 295

C_Disc_D3.0mm_W2.0mm_P2.50mm

FP3D

Capacitor_THT

C, Disc series, Radial, pin pitch=2.50mm, diameter*width=3*2mm^2, Capacitor

Pads: 2
THT: 4.6×2.5
Boards: 288

JST_PH_S2B-PH-K_1x02_P2.00mm_Horizontal

FP3D

Connector_JST

JST PH series connector, S2B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf)

Pads: 2
THT: 6.9×8.6
Boards: 282

Fuse_1206_3216Metric_Pad1.42x1.75mm_HandSolder

FP3D

Fuse

Fuse SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC-7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf)

Pads: 2
SMD: 4.9×2.3
Boards: 275

D_SMA_Handsoldering

FP3D

Diode_SMD

Diode SMA (DO-214AC) Handsoldering

Pads: 2
SMD: 9.0×3.5
Boards: 273

LQFP-100_14x14mm_P0.5mm

FP3D

Package_QFP

LQFP, 100 Pin (https://www.nxp.com/docs/en/package-information/SOT407-1.pdf)

Pads: 100
SMD: 17.5×17.5
Boards: 273

Crystal_SMD_2016-4Pin_2.0x1.6mm

FP3D

Crystal

SMD2016/4, Crystal, 2.0x1.6mm package, SMD, http://www.q-crystal.com/upload/5/2015552223166229.pdf

Pads: 4
SMD: 3.0×2.6
Boards: 272

DIP-40_W15.24mm

FP3D

Package_DIP

40-lead though-hole mounted DIP package, row spacing 15.24mm (600 mils)

Pads: 40
THT: 17.3×51.3
Boards: 272

D_MiniMELF

FP3D

Diode_SMD

Diode Mini-MELF (SOD-80, LL-34)

Pads: 2
SMD: 5.3×2.2
Boards: 270

R_Axial_DIN0207_L6.3mm_D2.5mm_P2.54mm_Vertical

FP3D

Resistor_THT

Resistor, Axial_DIN0207 series, Axial, Vertical, pin pitch=2.54mm, 0.25W = 1/4W, length*diameter=6.3*2.5mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf

Pads: 2
THT: 5.1×3.0
Boards: 265