Footprints
148 footprints matching “SO-8”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
Texas_DSBGA-8_0.705x1.468mm_Layout2x4_P0.4mm
Package_BGA
Texas Instruments, DSBGA, area grid, NSMD, YBJ0008 pad definition, 0.705x1.468mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234
- Pads
- 8
- SMD
- 2.7×3.5
- Boards
- 2
LFCSP-8-1EP_3x3mm_P0.5mm_EP1.45x1.74mm
Package_CSP
LFCSP, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-8/CP_8_13.pdf)
- Pads
- 9
- SMD
- 4.3×3.5
- Boards
- 2
WDFN-8-1EP_6x5mm_P1.27mm_EP3.4x4mm
Package_DFN_QFN
WDFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_WDFN_5x6mm_MF_C04210B.pdf)
- Pads
- 9
- SMD
- 7.2×5.5
- Boards
- 2
SMDIP-8_W11.48mm
Package_DIP
8-lead surface-mounted (SMD) DIP package, row spacing 11.48mm (451 mils)
- Pads
- 8
- SMD
- 14.0×10.7
- Boards
- 2
SMDIP-8_W9.53mm_Clearance8mm
Package_DIP
8-lead surface-mounted (SMD) DIP package, row spacing 9.53mm (375 mils), Clearance8mm
- Pads
- 8
- SMD
- 11.5×10.7
- Boards
- 2
MSOP-8-1EP_3x3mm_P0.65mm_EP2.5x3mm_Mask1.73x2.36mm_ThermalVias
Package_SO
MSOP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf#page=15)
- Pads
- 9
- SMD
- 6.2×3.5
- Boards
- 2
TE_84952-8_1x08-1MP_P1.0mm_Horizontal
Connector_FFC-FPC
TE FPC connector, 08 bottom-side contacts, 1.0mm pitch, 1.0mm height, SMT, http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=84952&DocType=Customer+Drawing&DocLang=English&DocFormat=pdf&PartCntxt=84952-4
- Pads
- 9
- SMD
- 16.9×10.3
- Boards
- 1
DFN-8-1EP_3x2mm_P0.5mm_EP1.7x1.6mm
Package_DFN_QFN
DFN, 8 Pin (https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MP8904DD/document_id/1244/)
- Pads
- 9
- SMD
- 4.3×2.5
- Boards
- 1
DFN-8-1EP_4x4mm_P0.8mm_EP2.5x3.6mm
Package_DFN_QFN
8-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 9
- SMD
- 5.3×4.7
- Boards
- 1
Micrel_MLF-8-1EP_2x2mm_P0.5mm_EP0.6x1.2mm_ThermalVias
Package_DFN_QFN
Micrel MLF, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic23050.pdf)
- Pads
- 9
- SMD
- 3.2×2.5
- Boards
- 1
VDFN-8-1EP_2x2mm_P0.5mm_EP0.9x1.7mm
Package_DFN_QFN
8-Lead Very Thin Dual Flatpack No-Lead (LZ) - 2x3x0.9 mm Body [VDFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 9
- SMD
- 3.2×2.6
- Boards
- 1
SSO-8_6.8x5.9mm_P1.27mm_Clearance7mm
Package_SO
8-Lead Plastic Stretched Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true
- Pads
- 8
- SMD
- 11.2×6.4
- Boards
- 1
MSOP-8
agg-agg
- Pads
- 8
- SMD
- 6.4×3.6
- Boards
- —
MSOP-8-EP-AD
agg-agg
- Pads
- 9
- SMD
- 6.4×3.6
- Boards
- —
MSOP-8-EP-LTC
agg-agg
- Pads
- 9
- SMD
- 6.1×3.6
- Boards
- —
SOIC-8
agg-agg
- Pads
- 8
- SMD
- 7.5×5.5
- Boards
- —
SOIC-8-EP
agg-agg
- Pads
- 9
- SMD
- 7.5×5.5
- Boards
- —
TDFN-8
agg-agg
- Pads
- 8
- SMD
- 3.3×2.5
- Boards
- —
TSSOP-8
agg-agg
- Pads
- 8
- SMD
- 7.6×3.6
- Boards
- —
UFDFN-8
agg-agg
- Pads
- 8
- SMD
- 3.3×2.5
- Boards
- —
TE_1-84952-8_1x18-1MP_P1.0mm_Horizontal
Connector_FFC-FPC
TE FPC connector, 18 bottom-side contacts, 1.0mm pitch, 1.0mm height, SMT, http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=84952&DocType=Customer+Drawing&DocLang=English&DocFormat=pdf&PartCntxt=84952-4
- Pads
- 19
- SMD
- 26.9×10.3
- Boards
- —
TE_2-84952-8_1x28-1MP_P1.0mm_Horizontal
Connector_FFC-FPC
TE FPC connector, 28 bottom-side contacts, 1.0mm pitch, 1.0mm height, SMT, http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=84952&DocType=Customer+Drawing&DocLang=English&DocFormat=pdf&PartCntxt=84952-4
- Pads
- 29
- SMD
- 36.9×10.3
- Boards
- —
TE_2-84953-8_1x28-1MP_P1.0mm_Horizontal
Connector_FFC-FPC
TE FPC connector, 28 top-side contacts, 1.0mm pitch, 1.0mm height, SMT, http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=84953&DocType=Customer+Drawing&DocLang=English&DocFormat=pdf&PartCntxt=84953-4
- Pads
- 29
- SMD
- 36.9×10.3
- Boards
- —
Converter_DCDC_XP_POWER-ITQxxxxS-H_THT
Converter_DCDC
DCDC-Converter, XP Power, ITQ series, 6W, 1500V isolation, SIP-8, https://www.xppower.com/portals/0/pdfs/SF_ITQ.pdf
- Pads
- 6
- THT
- 11.7×24.4
- Boards
- —