Footprints

211 footprints matching “SOT”

Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.

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Symbol Footprint 3D model

Footprints that come with a 3D model.

211 footprints · page 5 of 9

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Infineon_PG-HSOF-8-1_ThermalVias

FP3D

Package_TO_SOT_SMD

HSOF-8-1 [TOLL] power MOSFET (http://www.infineon.com/cms/en/product/packages/PG-HSOF/PG-HSOF-8-1/)

Pads: 3
SMD: 13.8×10.6
Boards: 6

TO-252-3_TabPin4

FP3D

Package_TO_SOT_SMD

TO-252/DPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO252/PG-TO252-3-1/

Pads: 4
SMD: 11.1×7.0
Boards: 6

TO-247-2_Vertical

FP3D

Package_TO_SOT_THT

TO-247-2, Vertical, RM 10.9mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html

Pads: 2
THT: 16.4×5.5
Boards: 6

TO-251-3-1EP_Horizontal_TabDown

FP3D

Package_TO_SOT_THT

TO-251-3, Horizontal, RM 2.29mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf

Pads: 4
THT: 7.1×11.9
Boards: 6

TO-5-3

FP3D

Package_TO_SOT_THT

TO-5-3

Pads: 3
THT: 9.9×9.9
Boards: 6

SC-74-6_1.55x2.9mm_P0.95mm

FP3D

Package_TO_SOT_SMD

SC-74, 6 Pin (https://www.jeita.or.jp/japanese/standard/book/ED-7500B/#target/page_no=39)

Pads: 6
SMD: 4.4×3.4
Boards: 5

Heraeus_TO-92-2

FP3D

Package_TO_SOT_THT

TO-92 2-pin variant by Heraeus, drill 0.75mm (http://www.produktinfo.conrad.com/datenblaetter/175000-199999/181293-da-01-de-TO92_Temperatursensor_PT1000_32209225.pdf)

Pads: 2
THT: 4.6×3.1
Boards: 5

TO-3

FP3D

Package_TO_SOT_THT

Transistor TO-3

Pads: 3
THT: 41.0×27.9
Boards: 5

ATPAK-2

FP3D

Package_TO_SOT_SMD

ATPAK SMD package, http://www.onsemi.com/pub/Collateral/ENA2192-D.PDF

Pads: 3
SMD: 10.8×7.0
Boards: 4

HVSOF5

FP3D

Package_TO_SOT_SMD

HVSOF5, http://rohmfs.rohm.com/en/techdata_basic/ic/package/hvsof5_1-e.pdf, http://rohmfs.rohm.com/en/products/databook/datasheet/ic/sensor/hall/bu52001gul-e.pdf

Pads: 5
SMD: 2.2×2.1
Boards: 4

TSOT-23-8_HandSoldering

FP3D

Package_TO_SOT_SMD

8-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_8_05-08-1637.pdf

Pads: 8
SMD: 5.9×3.4
Boards: 4

TO-220-4_Vertical

FP3D

Package_TO_SOT_THT

TO-220-4, Vertical, RM 2.54mm

Pads: 4
THT: 10.5×4.9
Boards: 4

TO-3PB-3_Vertical

FP3D

Package_TO_SOT_THT

TO-3PB-3, Vertical, RM 5.45mm, see http://www.onsemi.com/pub/Collateral/340AC.PDF

Pads: 3
THT: 16.1×5.8
Boards: 4

TO-92_Inline_Horizontal1

FP3D

Package_TO_SOT_THT

TO-92 horizontal, leads in-line, narrow, oval pads, drill 0.75mm (see NXP sot054_po.pdf)

Pads: 3
THT: 5.1×10.1
Boards: 4

HVSOF6

FP3D

Package_TO_SOT_SMD

HVSOF6, http://rohmfs.rohm.com/en/techdata_basic/ic/package/hvsof6_1-e.pdf, http://rohmfs.rohm.com/en/products/databook/datasheet/ic/audio_video/video_amplifier/bh76106hfv-e.pdf

Pads: 7
SMD: 3.5×2.1
Boards: 3

SC-70-8

FP3D

Package_TO_SOT_SMD

SOT, 8 Pin (JEDEC MO-203, variant BA, https://www.jedec.org/document_search?search_api_views_fulltext=MO-203, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-sc-70/sot_8_05-08-1639.pdf)

Pads: 8
SMD: 2.9×2.2
Boards: 3