Footprints
1,486 footprints matching “5mm”
Land patterns on their own — 19,830 of them, most never referenced by a symbol in the catalog. Each passed the courtyard and pad checks; 7,626 come with the 3D model they name.
QFN-24-1EP_4x4mm_P0.5mm_EP2.7x2.7mm
Package_DFN_QFN
QFN, 24 Pin (https://www.alldatasheet.com/datasheet-pdf/pdf/1159021/ALFA/AS3330.html)
- Pads
- 25
- SMD
- 5.3×5.3
- Boards
- 41
JST_GH_BM04B-GHS-TBT_1x04-1MP_P1.25mm_Vertical
Connector_JST
JST GH series connector, BM04B-GHS-TBT (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf)
- Pads
- 5
- SMD
- 9.5×6.6
- Boards
- 40
QFN-36-1EP_6x6mm_P0.5mm_EP3.7x3.7mm
Package_DFN_QFN
QFN, 36 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/36L_QFN_6x6_with_3_7x3_7_EP_Punch_Dimpled_4E_C04-0241A.pdf)
- Pads
- 37
- SMD
- 7.2×7.2
- Boards
- 40
SSOP-20_4.4x6.5mm_P0.65mm
Package_SO
SSOP, 20 Pin (https://www.jedec.org/system/files/docs/Mo-152c.pdf)
- Pads
- 20
- SMD
- 7.8×7.0
- Boards
- 39
Winbond_USON-8-1EP_3x2mm_P0.5mm_EP0.2x1.6mm
Package_SON
Winbond USON, 8 Pin (https://www.lcsc.com/datasheet/lcsc_datasheet_2205122030_Winbond-Elec-W25Q16JVUXIQ_C2843335.pdf#page=66f)
- Pads
- 9
- SMD
- 4.3×2.5
- Boards
- 39
C_Disc_D8.0mm_W2.5mm_P5.00mm
Capacitor_THT
C, Disc series, Radial, pin pitch=5.00mm, diameter*width=8*2.5mm^2, Capacitor, http://cdn-reichelt.de/documents/datenblatt/B300/DS_KERKO_TC.pdf
- Pads
- 2
- THT
- 8.5×3.0
- Boards
- 38
C_Rect_L7.0mm_W4.5mm_P5.00mm
Capacitor_THT
C, Rect series, Radial, pin pitch=5.00mm, length*width=7*4.5mm^2, Capacitor
- Pads
- 2
- THT
- 7.5×5.0
- Boards
- 38
TerminalBlock_Phoenix_PT-1,5-3-3.5-H_1x03_P3.50mm_Horizontal
TerminalBlock_Phoenix
Terminal Block Phoenix PT-1,5-3-3.5-H, 3 pins, pitch 3.5mm, size 10.5x7.6mm, drill diameter 1.2mm, pad diameter 2.4mm,
- Pads
- 3
- THT
- 11.5×8.6
- Boards
- 38
JST_GH_BM02B-GHS-TBT_1x02-1MP_P1.25mm_Vertical
Connector_JST
JST GH series connector, BM02B-GHS-TBT (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf)
- Pads
- 3
- SMD
- 7.0×6.6
- Boards
- 37
TSSOP-48_6.1x12.5mm_P0.5mm
Package_SO
TSSOP, 48 Pin (JEDEC MO-153 Var ED https://www.jedec.org/document_search?search_api_views_fulltext=MO-153)
- Pads
- 48
- SMD
- 9.4×13.0
- Boards
- 36
C_Disc_D7.5mm_W5.0mm_P5.00mm
Capacitor_THT
C, Disc series, Radial, pin pitch=5.00mm, diameter*width=7.5*5.0mm^2, Capacitor, http://www.vishay.com/docs/28535/vy2series.pdf
- Pads
- 2
- THT
- 8.0×5.5
- Boards
- 35
PhoenixContact_MC_1,5_4-G-3.5_1x04_P3.50mm_Horizontal
Connector_Phoenix_MC
Generic Phoenix Contact connector footprint for: MC_1,5/4-G-3.5; number of pins: 04; pin pitch: 3.50mm; Angled || order number: 1844236 8A 160V
- Pads
- 4
- THT
- 16.5×10.8
- Boards
- 35
TSOP-I-48_18.4x12mm_P0.5mm
Package_SO
TSOP-I, 48 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation DD)
- Pads
- 48
- SMD
- 21.5×12.5
- Boards
- 35
C_Rect_L7.2mm_W4.5mm_P5.00mm_FKS2_FKP2_MKS2_MKP2
Capacitor_THT
C, Rect series, Radial, pin pitch=5.00mm, length*width=7.2*4.5mm^2, Capacitor, http://www.wima.com/EN/WIMA_FKS_2.pdf
- Pads
- 2
- THT
- 7.7×5.0
- Boards
- 34
Jack_3.5mm_CUI_SJ1-3525N_Horizontal
Connector_Audio
TRS 3.5mm, horizontal, through-hole, https://www.cuidevices.com/product/resource/pdf/sj1-352xn.pdf
- Pads
- 5
- THT
- 12.5×14.5
- Boards
- 34
SSOP-8_3.9x5.05mm_P1.27mm
Package_SO
SSOP, 8 Pin (https://www.fujitsu.com/uk/Images/MB85RS16.pdf)
- Pads
- 8
- SMD
- 7.4×5.6
- Boards
- 34
WSON-6_1.5x1.5mm_P0.5mm
Package_SON
WSON6, http://www.ti.com/lit/ds/symlink/tlv702.pdf
- Pads
- 6
- SMD
- 2.4×2.0
- Boards
- 34
PhoenixContact_MCV_1,5_3-G-3.5_1x03_P3.50mm_Vertical
Connector_Phoenix_MC
Generic Phoenix Contact connector footprint for: MCV_1,5/3-G-3.5; number of pins: 03; pin pitch: 3.50mm; Vertical || order number: 1843619 8A 160V
- Pads
- 3
- THT
- 12.9×8.3
- Boards
- 33
SSOP-28_3.9x9.9mm_P0.635mm
Package_SO
SSOP28: plastic shrink small outline package; 28 leads; body width 3.9 mm; lead pitch 0.635; (see http://cds.linear.com/docs/en/datasheet/38901fb.pdf)
- Pads
- 28
- SMD
- 6.9×10.4
- Boards
- 33
R_Axial_DIN0516_L15.5mm_D5.0mm_P20.32mm_Horizontal
Resistor_THT
Resistor, Axial_DIN0516 series, Axial, Horizontal, pin pitch=20.32mm, 2W, length*diameter=15.5*5mm^2, http://cdn-reichelt.de/documents/datenblatt/B400/1_4W%23YAG.pdf
- Pads
- 2
- THT
- 23.2×5.5
- Boards
- 33
C_Radial_D6.3mm_H5.0mm_P2.50mm
Capacitor_THT
C, Radial series, Radial, pin pitch=2.50mm, diameter=6.3mm, height=5mm, Non-Polar Electrolytic Capacitor
- Pads
- 2
- THT
- 6.8×6.8
- Boards
- 32
JST_GH_SM03B-GHS-TB_1x03-1MP_P1.25mm_Horizontal
Connector_JST
JST GH series connector, SM03B-GHS-TB (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf)
- Pads
- 4
- SMD
- 8.2×6.4
- Boards
- 32
DFN-6-1EP_2x2mm_P0.65mm_EP1x1.6mm
Package_DFN_QFN
6-Lead Plastic Dual Flat, No Lead Package (MA) - 2x2x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf)
- Pads
- 7
- SMD
- 3.3×2.5
- Boards
- 32
C_Radial_D5.0mm_H7.0mm_P2.00mm
Capacitor_THT
C, Radial series, Radial, pin pitch=2.00mm, diameter=5mm, height=7mm, Non-Polar Electrolytic Capacitor
- Pads
- 2
- THT
- 5.5×5.5
- Boards
- 31